Abad Valdez Fernandez

· In the Defect Metrology area, met operational commits and deliverables from Seed assignment to Oregon (2021 - 2022) for p1227 FDH/FDA/SRK entities, including transfer and setup of supporting systems SPC, AM, PCSA, Specs and recipe creation.

· Supported tool qual activities by delivering D1-built TWs, documenting tool learnings and BKMs from D1, performing data analysis for the Final White Papers (FWP) while guiding and working with the Home Team (HT), and finalizing eMRCL items to bring the tools up to production.

· Delivered training to HT, technicians, and Pelican seeds on the P1227 tools and systems, worked on L1 Infinity packages, and completed all assigned tool installs.

· Completed tools Walk-The-Lot (WTL) to enable the Run-The-Lot (RTL) start.

· Sustained and troubleshot various AM issues across multiple toolsets, ran several ATACs, and helped manage the vendors to recover tools.

· Provided support for SRA/B review tools as previous tool owner which included recipes creation for all incoming NPI lots and external adhoc requests as needed, as well as driving PM improvements and frequency adjustments where appropriate.

· After engaging team and yield customers, provided and applied an updated particle monitor and TW management system across all tools in the area resulting in reduction of labor hours, more efficient monitor results and much better TW management.

· As Back End (BE) Metals tool owner, acted as the ACME area champion and representative for implementation of Automon and PPQ systems across all the Sputtering/ Endura toolsets. Automated events were created and tabulated in the different Specs, and training was provided to peer engineers and technicians.

· Sustained and supported sputtering tools CTI, BSM, and CSB, which involved modifying maintenance procedures, monitoring/adjustment of process control parameters in responding to abnormal trends, and white-papering tool parts modifications to address process issues, and tool uninstalls/transfers such as BSMs.

· Owned Defect modes for Endura toolset CTI, collected and performed data analysis for defects review and tool diagnosis of defects root cause. This involved attending IMT meetings for Back End Tear Outs to help address the defect issues.

· Working in C4, managed and sustained the areas of barrier layer metal (SPC sputtering toolsets), Wet etch (WCF wet stations), Diffusion (VFR furnaces), metro (TFR, and FTM), and plasma clean (ASH) as part of P1266/8/9 300mm. It included troubleshooting tool issues, SPC monitoring and response.

· Owned and implemented setups for process tools in sustaining systems such as EP, TWT, Automon/PPQ, and JMP Dashboard, among others.

· Implemented multiple redesign changes through the WP forum consisting of chamber-kit parts modification, Process changes, and monitoring systems, as well as tool installs/quals.

· Interfaced and communicated with process, e-test, yield and integration engineering to address tool issues and die yield improvements leading to tool chamber parts changes.

· Edited and revised several specifications and preventive maintenance procedures for the

module tool sets through the White Paper process.

· Helped in the training and evaluation of peer technicians doing the maintenance and operation of the different tool sets.

· Authored several Statistical Process Control (SPC) changes involving retargeting and adding new limits around the baseline, removing unused charts, setting up better response rules and optimizing others (for FTM and TFR). Jobfiles were created to address the PCSA reports, with about 65% false alarms reduction and increase of tool availability.

· Developed and implemented various projects for continuous improvement on the performance of the tools and the manufacturing costs of consumable parts which included the life extension of process kits and parts, reevaluation of monitor control limits, introduction of troubleshooting automated procedures, and application of LEAN principles such as removal of unnecessary process steps to eliminate radical issues, and relocation/demo of toolsets for a more efficient factory layout.

· Utilized DOE principles to improve systems and implement procedures to address major sputtering tool issues such as modification of kit parts in Cu chamber to eliminate arcing, adaptation of modified chamber components in Ti chamber to address PM issues and process scraps due to deposition, and modified PM procedures and elimination of parts in Etch chamber to remove burn marks leading to significant tool downtime and product disposition.

· Conducted research and study on the effects of radiation on the Power MOSFET

· Exposed different prototypes of transistors to an artificial x-rays radiation atmosphere

· Recorded and compared the data for analysis and annotation of effects due to radiation

· Served in the Infantry Unit as Machine Gunner (MOS 0331), taking active roles as gunner, Team, and Squad Leader

· Demonstrated leadership by making improvements to work processes and helping to train others.

· Worked as Armory manager serving as a safeguard for fire weapons

Acted as manager of corresponding military-related courses

· Prioritized and organized tasks to efficiently accomplish service goals.

· Planned and completed group projects, working smoothly with others.

· Maintained updated knowledge through continuing education and advanced training.

· Provided excellent service and attention to customers when face-to-face or through phone conversations.