Summary
Overview
Work History
Education
Skills
Patents
Timeline
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ANANTH JUPUDI

ANANTH JUPUDI

Los Gatos,United States

Summary

Dynamic Engineering Director with a demonstrated history of working in the semiconductors industry. Brings comprehensive knowledge of physical vapor deposition (PVD), electrostatic chucks (ESC), degas, preclean, microwave, plasma dicing and hybrid bonding equipment design. Displays strong innovative skills, holds numerous patents. Skilled at coordinating product development plans and personnel resources to complete work under tight deadlines.

Overview

20
20
years of professional experience

Work History

Director, Mechanical Engineer

Applied Materials
01.2022 - Current
  • Planned PVD, plasma dicing and hybrid bonding projects targeting >$1B advanced wafer level packaging applications from beginning to end, focusing on timelines, budgets and mechanical feasibility.
  • Recruited, hired, and trained more than 50 personnel over the years, working to establish key internal functions and outline scope of positions for new organization.
  • Spearheaded innovative approaches to resource allocation and strategic planning.
  • Implemented business strategies, increasing revenue, and effectively targeting new markets worth billions of dollars.
  • Observed each employee's individual strengths and initiated mentoring program to improve areas of weakness.
  • Applied mechanical problem solving skills to develop creative solutions for quality products.

Manager, Mechanical Engineer

Applied Materials
12.2015 - 01.2022
  • Planned, created, tested and deployed solutions per product life cycle (PLC) methodology to produce high quality systems to meet and exceed customer expectations.
  • Accomplished multiple tasks within established timeframes.
  • Developed detailed plans based on broad guidance and direction.
  • Cross-trained existing employees to maximize team agility and performance.
  • Defined clear targets and objectives and communicated to other team members.
  • Cultivated positive rapport with fellow employees to boost company morale and promote employee retention.

Senior Mechanical Engineer

Applied Materials
10.2012 - 12.2015
  • Assisted drafters in developing structural design of products using drafting tools or computer-assisted design (CAD) or drafting equipment and software.
  • Designed and analyzed degas, preclean and electrostatic chucks' (ESC) mechanical systems and mechanisms.
  • Applied semiconductor equipment standards and requirements to all designs.
  • Checked design compliance with product specifications and standards requirements.
  • Evaluated final product's overall performance, reliability and safety.
  • Attended project planning meetings to coordinate mechanical system designs with structural and architecture teams, mitigate design conflicts, and coordinate delivery timelines.
  • Applied mechanical problem solving skills to develop creative solutions for quality products.
  • Developed internal processes and plans for mechanical verification, product development and factory processes.
  • Troubleshot and diagnosed degas, preclean and ESC issues, quickly made plans for repairs and monitored use to rectify issues.
  • Created, prototyped and tested degas, preclean and ESC solutions for many key customers.

Mechanical Engineer

Applied Materials
10.2006 - 09.2012
  • Attended project planning meetings to coordinate mechanical system designs with structural and architecture teams, mitigate design conflicts, and coordinate delivery timelines.
  • Drafted assemblies, models, and other technical drawings.
  • Effectively developed models, assemblies and drawings using UG NX CAD and AutoCAD software.
  • Assisted in creating, prototyping and testing ESC, degas and preclean solutions for many key customers.
  • Applied mechanical problem solving skills to develop creative solutions for quality products.

Design Engineer

Melcor Inc.
11.2005 - 10.2006
  • Addressed design challenges and evaluated alternative design models to meet project requirements.
  • Analyzed and interpreted customer requirements to develop engineering solutions.
  • Assisted in developing cost-effective solutions to engineering problems.

Manufacturing Engineer

Lytron Inc
06.2004 - 07.2005
  • Coordinated selection of manufacturing methods, fabrication, and operation of product designs.
  • Identified problems and specific resolutions to fix defective, damaged, or malfunctioning parts, assemblies, equipment and systems.
  • Worked flexible hours across night, weekend, and holiday shifts.
  • Worked effectively in fast-paced environments.

Education

Masters - Mechanical Engineering

The University of Texas At Arlington
Arlington
05.2004

Skills

  • Semiconductors - ESC, PVD, Hybrid bonding, Microwave, Plasma dicing
  • Engineering Management
  • Product Development
  • Cross-functional Team Leadership
  • Staff Development
  • Strategies and goals
  • Contract and Vendor Management

Patents

  • US-D913979-S Inner shield for a substrate processing chamber
  • US-9548200-B2 Variable frequency microwave (VFM) processes and applications in semiconductor thin film fabrications
  • US-10945313-B2 Methods and apparatus for a microwave batch curing process
  • US-8895450-B2 Low resistivity tungsten PVD with enhanced ionization and RF power coupling
  • US-11251028-B2 Pre-clean chamber with integrated shutter garage
  • US-9252002-B2 Two piece shutter disk assembly for a substrate process chamber
  • US-10851453-B2 Methods and apparatus for shutter disk assembly detection
  • US-10971383-B2 Fluorescence based thermometry for packaging applications
  • US-2021233790-A1 Batch substrate support with warped substrate capability
  • WO-2020242804-A1 Inline microwave batch degas chamber
  • WO-2018204576-A1 Method and apparatus for uniform thermal distribution in a microwave cavity during semiconductor processing
  • TW-201614091-A Apparatus for high compressive stress film deposition to improve kit life
  • TW-201342492-A Substrate support with radio frequency (RF) return path
  • JP-2024014889-A Methods and apparatus for detecting microwave fields in cavity
  • US-11043406-B2 Two piece shutter disk assembly with self-centering feature
  • US-11670513-B2 Apparatus and systems for substrate processing for lowering contact resistance
  • WO-2021216557-A1 Methods and apparatus for reducing defects in preclean chambers
  • US-2021172806-A1 Apparatus for measuring temperature in a vacuum and microwave environment
  • US-2017004982-A1 Batch processing apparatus
  • US-2018226282-A1 Non-contact substrate temperature measurement technique based on spectral inteferometry
  • US-D973609-S Upper shield with showerhead for a process chamber
  • US-2023086151-A1 In-situ calibration/optimization of emissivity settings in vacuum for temperature measurement
  • US-D931241-S Lower shield for a substrate processing chamber
  • WO-2021041751-A1 High conductance lower shield for process chamber
  • US-2021057244-A1 Method and apparatus for processing a substrate using non-contact temperature measurement
  • US-2021059017-A1 Methods and apparatus for processing a substrate using microwave energy
  • WO-2021041750-A1 High conductance inner shield for process chamber
  • US-D967081-S Microwave transmission window assembly
  • US-2021074523-A1 Common Electrostatic Chuck For Differing Substrates
  • WO-2021216445-A1 Preclean chamber upper shield with showerhead
  • WO-2019204110-A1 Methods and apparatus for microwave leakage reduction for semiconductor process chambers
  • US-2020411353-A1 Methods and apparatus for high voltage electrostatic chuck protection
  • US-2023061379-A1 Low warpage curing methodology by inducing curvature
  • US-2019385874-A1 Methods and apparatus for reconfigurable flow control in process chambers
  • WO-2023205112-A1 In-situ low temperature measurement of low emissivity substrates
  • US-11699634-B2 Water cooled plate for heat management in power amplifiers
  • WO-2021007105-A1 Methods and apparatus for microwave processing of polymer materials
  • US-2024087913-A1 Shutter Disk
  • US-2022140456-A1 A microwave window including first and second plates with vertical stepped areas configured for pressure sealing a dielectric plate between the first and second plates
  • US-2022069536-A1 Solid-state power amplifiers with cooling capabilities
  • WO-2024059234-A1 On-board cleaning of tooling parts in hybrid bonding tool
  • US-2016189941-A1 Methods and apparatus for nodule control in a titanium-tungsten target
  • WO-2022266358-A1 Semitransparent substrate support for microwave degas chamber
  • ...

Timeline

Director, Mechanical Engineer

Applied Materials
01.2022 - Current

Manager, Mechanical Engineer

Applied Materials
12.2015 - 01.2022

Senior Mechanical Engineer

Applied Materials
10.2012 - 12.2015

Mechanical Engineer

Applied Materials
10.2006 - 09.2012

Design Engineer

Melcor Inc.
11.2005 - 10.2006

Manufacturing Engineer

Lytron Inc
06.2004 - 07.2005

Masters - Mechanical Engineering

The University of Texas At Arlington
ANANTH JUPUDI