ARCHIE MANABAT

• Operated KNS wire bonding equipment to run production lots per process spec, ensuring output targets, quality requirements, and schedule adherence.
• Performed machine setup, recipe selection, and verification (program loading, vision alignment checks as applicable, tooling readiness) prior to lot start to prevent misprocessing.
• Conducted in-process inspections (bond appearance/placement, wire condition, leadframe handling) and escalated abnormalities to Engineering/Technicians to prevent quality escapes.
• Executed tool changeovers and basic tool maintenance (cleaning, minor adjustments, housekeeping, consumable replacement per SOP) to sustain stable bonding performance.
• Monitored process and equipment alarms, performed first-level troubleshooting and recovery actions, and documented issues to expedite technician response.
• Ensured proper material handling and traceability using MES transactions (track-in/out, move, holds) and maintained accurate lot documentation.
• Followed control plans and work instructions to meet quality standards, including sampling frequency, defect classification, and escalation protocols.
• Facilitated containment and rework by segregating nonconforming material, labeling accurately, and coordinating with QA/Engineering to maintain quality standards.
• Enhanced operational efficiency through application of standardized work, 5S practices, and effective shift endorsement, minimizing downtime and handoff errors.
• Collaborated with cross-functional teams (Process, Equipment, Quality, Production Control) to resolve line issues and meet daily KPI targets.

Die Attach — Fastford

• Operated Fastford Die Attach equipment to support adhesive/attach operations per spec, including basic setup verification, lot processing, and in-process checks for placement and handling integrity.
• Followed material controls (die/wafer, adhesives if applicable), traceability, and cleanliness requirements to prevent contamination and misalignment issues.

Flip Chip Attach — ESEC 2100 FC hS (Flip Chip Bonder)

• Supported flip chip attach production on ESEC 2100 FC hS, performing station readiness checks, recipe verification, and monitoring alignment/placement performance within operator scope.
• Executed controlled handling of bumped die/devices and ensured correct process flow and documentation to maintain product integrity and traceability.

Sawing — DISCO DFD6362

• Operated DISCO DFD6362 sawing equipment under standard work, including lot preparation/verification, monitoring cut quality indicators, and following safety/handling protocols for wafers/frames.
• Ensured correct lot tracking and coordinated escalations for abnormalities (e.g., chipping, excessive debris, handling issues) to prevent downstream defects.

• Developed and implemented ASM Plated Design Kicker Improvement for the ASM Twin Eagle elevator assembly to mitigate elevator jam errors and reduce quality risks (e.g., depressed wires and leadframe damage).
• Engineered a more stable kicker configuration using a wide metal plate integrating 3 pins, improving pin stability and reducing carrier sticking events.
• Developed and implemented an ASM TE 3 Dimensional Hybrid C Installation Jig, a solution eliminating set-up variability.
• Maintained and troubleshot ASM Twin Eagle, KNS, and ASM Aero wire bonders to sustain high tool uptime and stable production output in a high-volume semiconductor environment.
• Executed preventive maintenance (PM) and corrective maintenance (CM), reducing unplanned stoppages and improving equipment reliability across shift coverage.
• Performed rapid fault isolation and recovery for mechanical, electrical, pneumatic, and sensor-related issues.
• Supported wire bonding process stability by addressing equipment contributors to defects (e.g., misplacement/offset, handling-related damage, depressed wires, jam-related escapes), and reducing scrap.
• Conducted precision mechanical alignment and verification of handling systems (carrier movement, elevator/track/clamp alignment), preventing recurring jams and ensuring consistent material flow.
• Completed post-repair tool buy-off/qualification support, coordinating with Production/Process/Quality to return tools to line safely and quickly with verified performance.
• Replaced, calibrated, and validated critical wear parts and assemblies (e.g., motors, valves, regulators, sensors, belts/filters/fixtures), maintaining tool capability within specification.
• Improved equipment stability by analyzing downtime patterns and implementing corrective actions, resulting in reduced chronic alarms and repeat failures.
• Ensured strict compliance with ESD, cleanroom protocol, and LOTO/safety procedures, protecting product integrity and preventing safety incidents.
• Maintained accurate equipment history and maintenance documentation (downtime logs, parts replaced, failure mode notes, corrective actions), supporting trend analysis and continuous improvement.
• Optimized mechanical robustness by reducing pin height (~¼), adding pin braces/support, and improving bolt depth for stronger structural stability under applied force.
• Delivered long-term corrective solution, contributing to tool stability and productivity, recognized as key improvement during employment.
• Promoted/selected as Shift Team Leader, directing daily execution for wire bonding equipment support and ensuring fast response to production constraints.
• Led shift prioritization for tool recoveries, PM execution, and escalations, protecting output and meeting shift target output.
• Managed shift handoffs and escalation flow; ensured accurate endorsements, open-item tracking, and follow-through to closure with Engineering and Production.
• Coached and trained technicians/operators on best practices, leading to reduced repeat occurrences and enhanced team consistency.

• Performed preventive and corrective maintenance on wire bond equipment (ASM Eagle 60, Shinkawa 3000, UTC 50, ASM AB339) to ensure high uptime and stable production output.
• Troubleshot machine alarms, bonding defects, and process drift (e.g., NSOP, lifted bonds, ball shear/wire pull outliers, pad cratering, stitch issues) and restored tools to production-ready condition.
• Executed diagnostics on mechanical, electrical, pneumatic, and vacuum systems, replacing and calibrating valves, regulators, solenoids, sensors, motors, and actuators to ensure optimal equipment functionality.
• Conducted checks and tuning of bond head/ultrasonic systems, inspecting transducers, horns, capillaries, and related assemblies to ensure consistent bonding quality.
• Performed machine setup verification and recovery support after PMs, breakdowns, conversions, and line stops—ensuring tools meet qualification requirements before release.
• Performed equipment calibration and verification for key machine parameters (bond force, ultrasonic power, temperature controls, vision alignment checks) according to SOP and control plans.
• Supported process engineering by providing maintenance insights, identifying recurring failure modes, and assisting in implementing corrective actions to enhance yield and reliability.
• Documented maintenance activities and equipment history including downtime logs, parts replaced, PM records, and escalation reports to support traceability and continuous improvement.
• Participated in tool qualification and production readiness activities (post-repair buy-off, correlation checks, assist during DOE runs, and validation lots) in coordination with Production and Engineering.
• Ensured compliance with safety and cleanroom protocols, ESD control, and LOTO in a high-volume semiconductor environment.

• Maintained and repaired production equipment to ensure optimal operation.
• Responded promptly to emergency repair requests, minimizing downtime across departments.
• Responded promptly to emergency breakdowns at any time during shift hours.
• Utilized diagnostic tools to troubleshoot mechanical failures effectively.
• Collaborated with engineering teams to enhance maintenance protocols, ensuring more efficient repair processes.
• Trained junior technicians on safety procedures and equipment handling.
• Documented maintenance activities to ensure compliance and facilitate accurate record-keeping.