Arnob Masud
North Plains,OR
Summary
Result-oriented professional with hands-on experience in quality and reliability development across multiple process technologies. Demonstrated success in Intel Federal project management, fostering cross-module collaboration, ensuring timely customer delivery, and upholding rigorous quality assurance benchmarks. Proficient in semiconductor device physics and skilled in data analytics, driving strategic decision-making. Committed to utilizing expertise to elevate product quality, reliability, and customer satisfaction across the semiconductor landscape.
Overview
6
6
years of professional experience
Work History
Quality and Reliability Engineer
Intel
05.2020 - Current
- Project Lead tasked with timely delivery of 1222, 1274, and 1278 IPs to Intel Federal customers. Collaborated closely with Integration, Device, and Reliability groups to define product specifications and develop reliability testing protocols tailored to meet customer requirements. Coordinated with program manager to procure wafers and oversee packaging processes. Spearheaded execution of SER, SEL, TID, BTI, and HCI testing on assembled units. Proactively managed timelines to ensure on-time delivery of project milestones.
- X-ray TID Reliability Module Owner for Process Technologies 1222, 1275, 1276, and 1278. Led development of TID testing methodology from inception. Currently spearheading creation of standardized in-house X-ray tool dose calibration protocol to ensure dose accuracy across manufacturing, product, and reliability divisions.
- TCAD Lead responsible for simulating and comprehending physics and mechanisms behind SER, TID, HC effect, and BTI metric for various process revisions of 1276 and 1278. This facilitates development of program guidelines prior to material availability for testing.
- Recipient of Intel DRA Award for delivering innovative solutions to meet SER requirements for 1278 product line. Successfully developed and filed patent for proposed solution.
- Served as Chair of 1222 Mykonos TID Task Force, ensuring timely certification. Collaborated with Integration and Device teams to devise process solutions aligning with future customer requirements for 1222.
Lithography Process Development Engineer
Intel
05.2018 - 04.2020
- Coordinated activities between TEL Field Service Engineers (FSE) and IQ floor technicians to ensure seamless tool conversions.
- Responsible for overseeing and managing processes and equipment within Lithography Track Module area.
- Led chemical compliance audits for Lithography tools and oversaw station monitor reporting. Innovatively created Python/SQL automated reporting scripts to enhance efficiency and mitigate potential failure and quality risks.
Education
Ph.D. - Electrical Engineering
University of Houston
Houston, TXBachelor of Science - Applied Physics, Electronics & Communication Eng.
University of Dhaka
BangladeshSkills
- Project management
- Cross team collaboration
- Reliability testing
- TCAD simulations
- Python
- SQL
- JMP
- SPICE simulations
- Microsoft office suite
Timeline
Quality and Reliability Engineer
Intel
05.2020 - Current
Lithography Process Development Engineer
Intel
05.2018 - 04.2020
Ph.D. - Electrical Engineering
University of Houston
Bachelor of Science - Applied Physics, Electronics & Communication Eng.
University of Dhaka