Summary
Overview
Education
Skills
Certification
Timeline
Honors
Generic

Aryan Tokachichu

Rolla,MO

Summary

Sophomore | Computer Engineering Major | Missouri S&T | | 4.0 GPA

Dedicated to understanding and engineering computation at the lowest levels from transistor-level logic gates to microarchitecture and machine instruction execution. Proven hands-on track record designing custom 16-bit RISC processor datapaths, RTL modules, and low-level software in Verilog, C, and Python. Actively pursuing 2027 hardware and digital design engineering co-op/internship roles.

Overview

1
1
Certification

Education

Bachelor of Science - Computer Engineering

Missouri University of Science And Technology
Rolla, MO
05-2029

Skills

  • Programming & Systems Languages: C,Python, Hack Assembly Language, SQL (SQLite)
  • Computer Architecture & Systems Fundamentals: 16-Bit RISC Architecture, Harvard Architecture, Memory Hierarchy (Registers, RAM, ROM), Instruction Decoding, Datapath Routing
  • Hardware Description & Digital Design: HDL,Verilog(HDLBits), Register-Transfer Level (RTL) Design, Combinational & Sequential Logic, Custom ALU Architecture, Testbench Design

Certification

NAND2Tetris - Building a modern computer form first principles:

Digital Logic, HDL, Hack Assembly

CS50-Harvard's Introduction to Computer Science:

C,Python,SQLite, Data Structures, Memory management

Timeline

Bachelor of Science - Computer Engineering

Missouri University of Science And Technology

Honors

Phi Theta Kappa Honor Society:

  • Inducted into the international collegiate honor society for sustained academic achievement and leadership (Top 10% academic standing).
  • Maintained a 4.0 cumulative GPA across foundational mathematics, physics, and engineering coursework.

Missouri S&T Kummer Vanguard Scholars Program:

  • Selected for premier merit-based scholarship and cohort program at Missouri S&T focused on STEM leadership, innovation, and entrepreneurship.
  • Participating in collaborative design-thinking workshops, professional development seminars, and interdisciplinary engineering challenges.
Aryan Tokachichu