Atanu Dutta

9+ years of experience in semiconductor packaging, package design for case/over-molded power modules, 3-D packaging, fabrication/assembly process design/development, packaging material Expertise in reliability/failure mode analysis using thermal shock/cycling, die shear, power cycling, HTRB/H3TRB, cross-section (x-section) of semiconductor devices, packages Skills in various industrial and automotive standards AQG-324, AEC-Q101/100, MIL, JEDEC, IEC Hands-on expertise in multi-chip modules, SMT, flip-chip solder bumping, underfills for flip-chip, solder paste/preform/ball for die/component attach, reflow, wire bonding, encapsulation, passivation Experience in test vehicle design for experimental research using design of experiment (DOE) in JMP, R Expertise in injection molded design, insert molded design Expertise in packaging materials: power substrate, die attach, sintering, molding compound, interconnect technologies Expertise in package modeling and electrical/thermal/structural/virtual reliability multiphysics simulations using ANSYS, COMSOL Skills in semiconductor characterization tools: CSAM, X-ray Adept in VNA, TDR, curve tracer, oscilloscope, spectrum analyzer, impedance analyzer Authored and co-authored twelve technical publications Technical problem solver, cross-functional team player, excellent technical writing, communication skills Led student organization as president, executed successful fundraising drive

• Outstanding Student Paper Award, IMAPS CICMT 2016, Denver, CO
• Cora Sanders Scholarship (College of Engineering, University of Arkansas)
• University of Arkansas graduate school travel grant for presenting research paper
• ICCR Scholarship (4-year scholarship that paid all undergraduate tuition and living expenses)

• A module-level spring-interconnected power module, A. Dutta, S. Ang, IEEE Transaction on component, packaging and manufacturing technology, 2018
• Effects of parasitic parameters on electromagnetic interference of wide bandgap power electronic modules, A. Dutta, S. Ang, IEEE Applied Power Electronic Conference and Exposition, 2017
• A 3-D stacked wirebondless silicon carbide power module, A. Dutta. S. Ang, IEEE Wide Banggap Power Devices and Application, 2016
• LTCC interposer based high voltage 3-D power module, A. Dutta. S. Ang, Z. Chen, International High Voltage Direct Current Conference, 2016
• Electromagnetic interference simulations for wide bandgap power electronic modules, A. Dutta, S. Ang, IEEE Journal of Emerging and Selected Topics in Power Electronics, 2016
• Design of a low inductance power module based on low temperature co-fired ceramic, A. Dutta, S. Ang, IMPAS Ceramic Interconnect and Ceramic Microsystems Technologies, 2016
• Electrical parasitics and thermal modeling for optimized layout design of high power SiC modules, A. S. Bahman, F. Blaabjerg, A. Dutta and A. Mantooth, IEEE Applied Power Electronic Conference and Exposition, 2016
• Multi-chip power module layout and design using Q3D extractor and PowerSynth, A. Nizam, A. Dutta, T. Vrotsos, A. Mantooth, S. Pytel, IEEE Applied Power Electronic Conference and Exposition, 2016
• Electromagnetic interference simulations of power electronic modules, A. Dutta, S. Ang, IEEE International Workshop on Integrated Power Packaging, 2015
• A silicon carbide based synchronous buck converter, A. Dutta, Y. Ma, J. Lv, S. Ang, Power Conversion and Intelligent Motion Asia, 2014
• Realization of a SiC module-based indirect matrix converter with minimum parasitic inductances, J. K. Hayes, A.E. Mejia, J.C. Balda, A. Dutta, S. Ang, IEEE Applied Power Electronic Conference and Exposition, 2014
• The design and fabrication of a 50KVA 450A silicon carbide power electronic module, A. Dutta, S. Wang, J. Zhou, S. Ang, J. Chang, C. Chen, IEEE Power Electronics for Distributed Generation Systems, 2013
• Electrically small, omnidirectional GPS antenna using a split ring resonator, V. V. Varadan, M.B. Buscher, I.K. Kim, A. Dutta, B. McLaughlin, and D. White, Metamaterials, 2010

• Led Bangladesh Student Organization at University of Arkansas, as President
• Led fundraising drive for pediatric cancer research, St. Jude Children’s Research Hospital, Memphis, TN
• Led team of three of N.I.T., Durgapur during Cognizance’07 technical conference at I.I.T., Roorkee, India
• Led team of four of N.I.T., Durgapur during Blitz’07 technical conference at NSHM, Durgapur, India
• Coordinated and organized annual cultural event of N.I.T., Durgapur