Summary
Work History
Education
Skills
Extracurricular activities
Timeline
Generic

Ayushi Raina

Ithaca,NY

Summary

Motivated and detail-oriented Electrical and Computer Engineering student at Cornell University with hands-on experience in hardware design, silicon validation, and processor architecture.

Work History

Hardware Engineering Intern - HBM

Micron Technology, Inc
05.2025 - Current
  • Develop and implement JEDEC-HBM and Near Memory DRAM solutions to enhance memory performance and efficiency.
  • Innovate 2.5D and 3D memory designs from both electrical and packaging perspectives, contributing to cutting-edge memory technology.
  • Collaborate with cross-functional teams (R&D, Manufacturing, Marketing, and Quality Assurance) to streamline product development and ensure cost-effective DRAM production.
  • Perform debugging and qualification techniques for memory solutions, ensuring product quality and functionality through rigorous testing.
  • Contribute to developing low power per bit solutions for machine learning (ML) and artificial intelligence (AI) applications, optimizing memory efficiency.
  • Engage in end-to-end process integration across front-end and back-end stages, improving the vertical integration of memory technology.

Hardware Engineer Intern - Server Platform hardware design

Advanced Micro Devices(AMD)
01.2025 - 04.2025
  • Supported platform bring-up and early validation of Venice silicon on the SP7 server platform, a next-generation AMD EPYC processor featuring a multi-die architecture with separate I/O Dies (IOD) and Core Complex Dies (CCDs).
  • Validated power sequencing during initial platform bring-up to ensure all voltage rails powered up correctly, within specified timing margins, and without shorts, using oscilloscopes, multimeters, and digital power analyzers.
  • Monitored critical system signals, including power, clock, and reset, and collaborated with senior engineers to identify and resolve power delivery anomalies and timing violations, ensuring smooth power-on behavior.
  • Analyzed and understood AMD's chiplet-based architecture, focusing on the functionality and physical layout of IOD and CCD components.
  • Collected and analyzed waveform data to troubleshoot power and performance-related issues, ensuring platform stability during early silicon bring-up and contributing to the identification of underperforming silicon.
  • Contributed to the setup and maintenance of testing environments, including configuring lab equipment such as oscilloscopes, digital power analyzers, and multimeters, ensuring accurate data collection for effective debugging and validation.
  • Collaborated closely with senior engineers, referencing schematics, power tree diagrams, and board layout files to address and resolve hardware issues, enhancing system performance and reliability.
  • Gained hands-on experience with silicon validation, debugging, and power validation processes, strengthening skills in platform-level hardware bring-up and real-world application of CPU architecture knowledge.

Education

Bachelor of Science - Electrical and Computer Engineering

Cornell University
Ithaca, NY
05.2026

Skills

  • Electrical testing
  • Hardware debugging
  • Analog electronics
  • Schematic capture
  • Digital electronics
  • Embedded systems
  • FPGA development
  • Hardware documentation

Extracurricular activities

Institute of Electrical and Electronics Engineers (IEEE), Academic Team

Timeline

Hardware Engineering Intern - HBM

Micron Technology, Inc
05.2025 - Current

Hardware Engineer Intern - Server Platform hardware design

Advanced Micro Devices(AMD)
01.2025 - 04.2025

Bachelor of Science - Electrical and Computer Engineering

Cornell University

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Ayushi Raina