Bhargav Pandya

San Jose,CA

Summary

Data-driven Manufacturing & Process Engineer with 8+ years of expertise optimizing PCBA and system-level manufacturing within complex electronics environments. Uniquely qualified with dual Master's degrees in Mechanical Engineering and Project Management, combining deep technical hardware validation with structured cross-functional leadership. Proven track record driving 8D root-cause analysis, mitigating risk via PFMEA, and managing product quality throughout the NPI and sustaining lifecycles within Contract Manufacturing (CM) environments.

Overview

Certification

years of professional experience

Work History

Manufacturing Process Engineer -

Solutions Manufacturing

2019.08 - 2026.06

Review customer assembly drawings, Gerber files, PCB stack-ups, and BOMs during RFQ and NPI phases — partnering with Signal Integrity and Hardware Engineering teams on design-for-manufacturability feedback.
Develop manufacturing work instructions and establish Critical-to-Quality process controls (SPC, Cpk for SPI, reflow oven profiling) ensuring zero-defect product introduction and Mass Production launch readiness.
Evaluate and implement new manufacturing technologies, materials, and automated inspection systems in partnership with CM and ODM suppliers, driving DFx (Design for Manufacturability/Assembly) cost-reduction activities that enhanced overall throughput and yield for complex, high-density PCBAs.
Improved Overall Equipment Effectiveness (OEE) for 3 SMT lines by 15% across key performance, availability, and quality metrics, while driving process capability (Cpk) improvements to meet Six Sigma quality goals.
Analyzed manufacturing data trends utilizing Six Sigma methodology and Design of Experiments (DOE) to reduce variability in solder paste deposition by 8%, directly improving joint reliability and process Cpk.
Develop and maintain PFMEA frameworks to identify component and process failure modes, proactively mitigating risks and implementing corrective actions to eliminate potential field or test escapes.
Lead cross-functional teams across domestic and offshore CM/ODM sites to execute Root Cause Analysis (5 Whys, Cause & Effect) and drive supplier corrective action (8D/SCAR), preventing recurrence of hardware and process failures and holding suppliers accountable to established quality KPIs.
Provide technical direction, training, and troubleshooting support for advanced SMT and inspection equipment (AOI, X-ray, Stencil Printers, SPI, Pick and Place), collaborating with global Quality and Hardware Engineering teams to debug hardware and resolve structural anomalies during product reliability testing.
Design and develop in-house 3D-printed tooling fixtures to optimize manufacturing workflows, increase throughput, and protect fragile components on high-density PCBAs.
Authored Standard Operating Procedures (SOPs) and managed IQ/OQ/PQ validation protocols for newly installed machinery, maintaining strict calibration logs in compliance with Quality Management System (QMS) requirements.
Manage work orders, engineering change tracking (ECR/ECO/ECN), and BOM configurations within the ERP system while managing CM/ODM supplier performance and collaborating with global suppliers and customers to identify component substitutes and optimize product reliability.

Mechanical Engineer -

SVTronics Inc

2018.03 - 2019.08

Established optimized production sequences and manufacturing workflows to support high-yield assembly of complex Printed Circuit Board Assemblies (PCBA).
Supervised a team of 12 operators, managing shop floor activities and ensuring material availability to maintain SMT production schedules and quality targets.
Minimized material scrap metrics by 7% through the application of Lean and Six Sigma methodologies, including continuous improvement frameworks, Poka-Yoke, and 5S principles.
Utilized FMEA, Statistical Process Control (SPC), and Total Productive Maintenance (TPM) to optimize SMT production facility utilization and ensure consistent process capability.
Developed and validated thermal reflow and wave soldering profiles to guarantee robust, reliable solder joint integrity across diverse board topologies and micro-components.

Education

Master of Science - Project Management

Harrisburg University of Science And Technology

Harrisburg, PA

Master of Science - Mechanical Engineering

The University of Texas At Arlington

Arlington, TX

Bachelor of Science - Mechanical Engineering

Babaria Institute of Technology

Vadodara, Gujarat, India

Skills

CAD software: SolidWorks, AutoCAD
FEA/DFM software: Ansys, GraphiCode Power Place
Engineering tools: Design for Manufacturing (DFM), Design for Excellence(DFx), Design for Assembly (DFA), Engineering Change Orders (ECR, ECO, ECN), Gemba, Geometric Dimensioning & Tolerancing (GD&T), New Product Introduction (NPI),

Quality/Lean tools: Lean Manufacturing, Six Sigma, 5s, Kaizen, DMAIC, Root Cause, Failure Modes & Effects Analysis (FMEA), Process Failure Modes & Effects Analysis (PFMEA), Design of Experiments (DOE), Statistical Process Control (SPC), Cpk/Ppk Process Capability Analysis, 8D Methodology, Corrective and Preventive Actions (CAPA)
Documentation tools: MS Excel, MS PowerPoint, MS Word, Outlook, Epicor DocStar, Crystal Report, ERP