13 years of practical experience in RTL-GDS implementation, I have garnered consistent recognition for my outstanding performance and valuable contributions to project success. My expertise shines in the areas of block and fullchip closure, where I have repeatedly showcased my proficiency. Furthermore, my track record of leadership positions equips me with the ability to skillfully guide teams towards achieving their objectives.
Part of Device and Development Group (DDG), responsible for HuB part of the chipsets. Involved in Chassis upbringing.
NVL - Intel 1.8A node. 2.4 GHz / 2.4 Mill GC partition. RTL - GDS implementation.
MTL - TSMC 7nm. 2.0 GHz / 2.0 Mill GC. RTL - GDS implementation.
Additional responsibilities within DDG
MGR - Intel 10nm. 2.8 GHz / 1.4 Mill GC. RTL - GDS implementation
LBG - Intel 14nm. 1.6 GHz / 1 Mill gc. Server PCH. RTL - GDS implementation.
Camera Chip - Intel. 22nm / 8Mill gc. RTL- GDS implementation. Project Discontinued
As a lead, my work involved in ...
PCH - Intel Malaysia. 22-14nm. 1.5GHz. 1 Mill - 500k GC. RTL - GDS implementation.
Physical Design
Place & Route, Clock - FC, DC, ICC/ICC2
Timing - PT SI
Low power - VCLP / VC
Physical Verification - ICV, Calibre
Static / Dynamic IR - Ansys Redhawk
Scripting Tcl