Chan Dang

• Support Engineering in Thin Film/CMP processes.
• Process SWR lots.
• Disposition lots when out of control limit and make necessary adjustments to prevent future lot failure.
• Monitor and control parameter from SPC charts.
• Support Engineering to optimize process parameters to get higher removal rate and lower non uniformity in CMP process.
• Met weekly with team members to discuss project implementations and alleviate any issues.
• Coached newly hired employees and interns while observing progress and delegating tasks.
• Conducted root cause analysis to identify, prioritize and eliminate process losses.
• Provided technical assistance to production team when issues arose.
• Reviewed processes, identifying areas requiring improvement.

Support Engineering to develop Digital Micro Mirror Device (DMD)

Adjust production parameters like temperature, pressure, and time to minimize waste and increase yield.

Make changes and experiment with new approaches, but implement them gradually.

• Process dielectric/metal deposition and etch processes
• Inspected products and machines to maintain quality and efficiency.
• Organized work to meet demanding production goals.