CHENG-CHIEN CHANG (Martin)
Vancouver,WA
Summary
Semiconductor engineering and product development leader with a strong record in process integration, product engineering, and customer technical support. Led teams of engineers, managed KPIs and talent development, and improved yield, defect control, and manufacturing efficiency across eFlash, HV, BCD, and UHV platforms.
Overview
15
15
years of professional experience
Work History
Technical Manager
TSMC Washington
Vancouver, Washington
11.2022 - Current
- Led technical development, product optimization, customer collaboration, and cross-functional problem solving for 0.18um eFlash and UHV technologies.
- Improved quality and yield by resolving long-standing KLA wafer edge defect issue, cutting defect counts from over 3000 to zero.
- Worked with customers to tune sensitive device characteristics and resolve product performance issues, improving final test (FT) yield from 88% to 97% and reducing leakage-related loss by 9%.
- Improved final test (FT) yield from 88% to 97% and reduced leakage-related loss by 9%.
- Helped streamline WAT process steps, raising WAT throughput by 7% from 9.2 to 9.9 WPH and increasing testing capacity.
- Led WAT simplification initiatives, improving WAT throughput by 7%, from 9.2 to 9.9 WPH.
- Increased effective testing capacity and improved utilization of manufacturing resources.
- Optimized manufacturing processes to enhance productivity and efficiency.
- Coordinated cross-module CIT initiatives to address process weaknesses, conduct root cause analysis, implement corrective actions, and stabilize manufacturing performance.
- Led cross-module CIT initiatives to address long-standing process weaknesses across multiple technology platforms.
- Coordinated engineering resources to identify root causes, implement corrective actions, and improve process stability.
- Delivered technical leadership across multiple cross-functional teams, enhancing collaboration and project outcomes.
- Received special recognition from a Tier-1 analog customer during its 2024 Quarterly Business Review (QBR).
Section Manager
TSMC Fab3
Hsinchu, Taiwan
07.2011 - 11.2022
- Managed the Process Integration and Product Engineering team, directly leading 5–8 engineers. Set departmental objectives, annual KPIs, and managed performance, talent development, recruitment support, and organizational planning.
- Established departmental annual objectives and KPIs, monitored execution, and aligned team performance with business and engineering targets.
- Led engineering teams in technology development, product integration, and product qualification, ensuring successful manufacturing ramp-up.
- Coordinated cross-functional engineering resources to effectively resolve complex technical and product-related challenges.
- Collaborated with international customers to support product qualification, technical issue resolution, and product commercialization.
- Conducted employee performance evaluations and provided promotion and career development recommendations.
- Selected Product & Technology Achievements
- 2017–2022 | BCD, HV & Automotive Products
- Automotive-Grade Hall Sensor: Led product development and qualification for a Tier-1 customer program. Annual wafer output reached 60K in 2022, 90K in 2023, and 120K in 2024.
- Automotive-Grade 3D MIM Capacitor: Supported technology development and product introduction, securing business from a Tier-1 smartphone supplier.
- 0.16um HV Mask Reduction: Led technology development and product transfer, completing the project within five months. The technology was expected to generate more than 200K wafers in total over a three-year period.
- 2013–2017 | eFlash, UHV & High-Voltage Products
- 0.5um UHV 600V / 700V / 800V: Led ultra-high-voltage device technology development and product qualification, securing business from a Tier-1 power management IC supplier with approximately 3K wafers per month.
- Automotive eFlash: Led engineering efforts to improve 0.18um / 0.25um automotive eFlash yield and strengthen early-stage process defense, securing a Tier-1 TPMS customer program with approximately 5K wafers per month.
- Deep Trench Capacitor IPD: Developed integrated passive device technology, improving CPU function speed by 26%.
- MCU Product Development: Resolved critical leakage issues and supported the successful acquisition of a Tier-1 MCU customer program.
- 2011–2013 | eFlash & Discrete Device Technologies
- Supported 0.35um discrete device development covering 5V, 8V, 12V, and 30V applications.
Education
Application Physics
Chung-Yuan Christian University
Taoyuan07-2000
Skills
- Product development
- Team leadership
- Product qualification
- New product introduction
- Defect reduction
- 035um Discrete Devices: 5V / 8V / 12V / 30V
- Process optimization
- Technical leadership
- Cross-Functional Leadership: Coordination across Process Integration, Product Engineering, and multiple engineering disciplines
- Cross-functional problem solving
- Root cause analysis
- Customer collaboration
- Team leadership
- 018um / 025um Automotive eFlash: 18V / 25V / HV
- 018um Deep Trench PIP Capacitor: 18V / 33V
- 035um eFlash: 33V / 5V / HV
- 035um Discrete Devices: 5V / 8V / 12V / 30V
- Cross-functional problem solving
- Root cause analysis
Personal Information
Title: Target Position: Product Department Manager
LEADERSHIP & CUSTOMER RECOGNITION
- 2026: Improved WAT throughput by 7% and led cross-module CIT initiatives to resolve long-standing technical issues., 2024: Received special recognition from a Tier-1 analog customer during QBR., 2021: Received Special Thanks recognition and NTO Success Award from a key customer., 2019: Received Best Golden Trade Secret Award., 2018–2019: Received Excellent Support Awards from a key customer., 2017: Received NTO and Excellent Function recognition from a Tier-1 smartphone supplier., 2014–2015: Published three patents, including two U.S. patents and one South Korean patent.
- Two U.S. patents (2014–2015), One South Korean patent (2014–2015)
LEADERSHIP APPROACH
- A results-oriented engineering leader who emphasizes clear objectives, accountability, teamwork, and continuous improvement.
- Experienced in building and developing engineering teams through structured KPI management, performance evaluation, and talent development. Focuses on customer requirements, product quality, and operational efficiency while aligning cross-functional engineering resources to solve complex technical challenges.
- Committed to translating technical capabilities into measurable business results through effective product development, quality improvement, manufacturing optimization, and customer collaboration.
Timeline
Technical Manager
TSMC Washington
11.2022 - Current
Section Manager
TSMC Fab3
07.2011 - 11.2022
Application Physics
Chung-Yuan Christian University