Summary
Overview
Work History
Education
Skills
Websites
Publications
Patents
Timeline
Generic

Chun Chieh Tien

Surprise,AZ

Summary

Seasoned photomask process and equipment engineer with 10+ years of experience at TSMC, specializing in multi-beam writer technology (MBM2K), e-beam metrology, and cross-site equipment transfer. Strong leadership in project execution, vendor collaboration, and SOP standardization. Proven track record of driving yield improvements, managing tool installations, and mentoring engineers in high-volume semiconductor manufacturing.

Overview

13
13
years of professional experience

Work History

Photomask Equipment Leader

TSMC Arizona
, USA
01.2022 - Current
  • Led the installation and bring-up of NuFlare MBM2K and KLA IPRO7 metrology systems.
  • Resolved an uncommon distortion issue on IPRO7 through detailed analysis and collaboration with engineers from KLA Germany, leading to a revised inspection method.
  • Oversaw procurement and qualification of photomask raw materials, including EUV/optical blanks, pellicles, photoresist, and filters.
  • Conducted cross-site process matching, ensuring CD and yield parity using standard pattern benchmarking.
  • Mentored new team members and managed day-to-day technical operations as team lead.

Senior Photomask Engineer

TSMC Taiwan
, Taiwan
01.2016 - 01.2022
  • Spearheaded Cr-Hardmask defect reduction project, reducing defect rate from 10% to ~1% through etching recipe optimization and equipment PM refinement.
  • Developed and implemented a fast-track Cr-removal flow, cutting process time from 6 hours to 1 hour; patented and deployed into volume production.
  • Transferred N7 photomask layers from R&D to mass production using IMS multi-beam writer, and dry etcher.

Photomask Process Engineer

TSMC Taiwan
, Taiwan
01.2013 - 01.2016
  • Gained hands-on experience operating writers, SEMs, and etchers for advanced photomask manufacturing.
  • Applied SPC methodology to monitor CD variation and defect trends, enabling consistent yield performance.
  • Created process documentation and contributed to early-stage yield improvement tasks.

Education

M.S. - Materials Science and Engineering

National Cheng Kung University
Taiwan

B.S. - Ｍaterial Science and Engineering

National Cheng Kung University
Taiwan

Skills

  • Multi-beam Writer Operation (MBM2K, EBM9K)
  • Tool Installation & Cross-site Transfer
  • Defect & Yield Improvement
  • SEM & Metrology Analysis (Holon, IPRO7)
  • SOP Writing & Process Standardization
  • Vendor Collaboration (NuFlare, KLA, TEL, AMAT)
  • Photomask CD Matching & SPC Analysis
  • Project Ownership & Team Mentorship

Publications

  • Chang, C.-H., Tien, C.-C., et al., A macroscopically nondestructive method for characterizing coating-substrate interfacial properties., JCTR, 15, 5, 913-922, 2018
  • Pillai, K., Gray, P., Tien, C.-C., et al., Evaluation of nanoparticle release from polymer coatings., ACS Abstracts, 249, 2015
  • Sung, L.-P., Rabb, S., Tien, C.-C., et al., Surface degradation under UV exposure., ACS Abstracts, 248, 2014
  • Pillai, K., Bajaj, A., Tien, C.-C., et al., Exploring nanoparticle release., ACS Abstracts, 252, 2016
  • Hsueh, H.-C., Jacobs, D., Tien, C.-C., et al., Kinetics of photodegradation., JCTR, 14, 4, 893-902, 2017

Patents

  • US 10,739,671 B2, Method of manufacturing phase shift photo masks, 2020
  • US 11,906,898, Method of manufacturing phase shift photo masks, 2024
  • US 9,739,802 B2, Multi-electrode conductive AFM probe manufacturing, 2017

Timeline

Photomask Equipment Leader

TSMC Arizona
01.2022 - Current

Senior Photomask Engineer

TSMC Taiwan
01.2016 - 01.2022

Photomask Process Engineer

TSMC Taiwan
01.2013 - 01.2016

M.S. - Materials Science and Engineering

National Cheng Kung University

B.S. - Ｍaterial Science and Engineering

National Cheng Kung University

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