Overview
Work History
Education
Timeline
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Daniel J. Vincent

North Hampton,NH

Overview

5
5
years of professional experience

Work History

Ion Implant Manufacturing Operations Engineer

IBM Research
Albany, NY
09.2016 - 08.2020
  • Developed, tested, and revised Reactive Ion Etching processes (for both front end and back end of line semiconductor manufacturing) and extensively troubleshot equipment and process faults to recover misprocessed wafers and return tools to desired production standards
  • Monitored and maintained 60+ Front End of Line and Back End of Line tool mainframes; transfer modules; and processing chambers specializing in Reactive Ion Etching (RIE), Ion Implantation, Gas Cluster Ion Beam Planarization (GCIB), Plasma Doping, Ashing, and Chemical Oxide Removal (COR)
  • Organized and tracked process module usage hours, and long-term processing trends, to adjust designated times between part replacements, based on empirical data, which saved money from unnecessary work and predicted when work was needed before product was damaged
  • Executed and organized experiments which reduced the total number of silicon wafers needed for tool monitoring and increased the efficacy of equipment monitors by updating qualifying process parameters to better mimic production conditions and provide more reliable data
  • Analyzed Statistical Process Control charts (combined with metrology wafer maps and monitor trendlines) to track, maintain, and improve quality control of manufacturing etch processes
  • Coordinated with workstation operators, integrators, and engineers to facilitate the transfer of processes between different platforms and develop new key programs for IBM (and partner companies including Global Foundries, Samsung, Lam, Tokyo Electron, and Applied Materials) involving FinFETs, Gate-All-Around FETs, Nanosheets, Magnetoresistive RAM, Resistive RAM, and Phase-Change Memory
  • Trained and certified workstation operators on proper tool operation to reduce the number of unnecessary operation interruptions and to increase both fab efficiency and overall product yield
  • Filed and awarded a patent on Metal Supervia Structures and have two Middle of Line Contact Processing patents pending
  • Skills Learned: Collection and analysis of process and trend data to troubleshoot and ameliorate quality control problems; Effective and efficient communication, between multiple engineering groups and companies, to streamline the recovery of hardware and minimize production down time.

Assistant Signal Designer/Repairman/Signalman

Pan Am Railways
North Billerica, MA
06.2015 - 01.2015
  • Meticulously worked through procedures (circuit board, wiring and layout diagrams) to construct, wire, and solder new equipment and collaborated with crews from different departments to complete large scale construction projects and maintain existing railroad signaling equipment
  • Spearheaded the disassembly and categorization of hundreds of relays, and other electronic equipment, to streamline repairs
  • Revised, reviewed, and created over 100 circuit diagrams, using AutoCAD 2012, to ensure quicker updating and dissemination of hardware improvements.

Education

Ph.D. Graduated - Electrical Computer Engineering, Materials Science & Engineering

University of Wisconsin
09.2024

M.S. Graduated -

12.2022

B.S - Chemistry-Materials Science

University of California, Angeles (UCLA)
06.2016

<ul><li>Focus: Semiconductor physics, properties of semiconducting materials, optics and optoelectronics, quantum mechanics, material interface properties. Wisconsin Nano Engineering Device (WISNED) Research Lab:</li><li>Research Areas: Semiconductor heterostructure device fabrication and electrical testing, photoluminescent and electroluminescent edge-emitting lasers, photodiodes, semiconductor interface electron affinity tuning.</li><li>Equipment Worked With: Reactive Ion Etchers (RIE), Inductively Coupled Plasma Etchers (ICP), Electron Beam Metal Evaporators, Contact Lithography, Atomic Layer Deposition (ALD), Chemical Mechanical Polishing (CMP), Keithley Semiconductor Characterization Probes, Plasma Enhanced Chemical Vapor Deposition (PECVD</li></ul> -

<ul><li>Coursework Completed: Chemical Thermodynamics, Quantum Mechanics, Mechanical Properties of Materials, Diffusion Controlled Reactions, Physics of Semiconductors, Inorganic Chemistry, Basic Organic Chemistry, Metal Alloys, Ceramics and Glasses, X-Ray Diffraction.</li><li>Skills Learned: Acid/Base Titration, Mass Spectrometry, Error Analysis, Distillation, Crystallization Purification, Ultraviolet and Infrared Spectroscopy, X-Ray Diffraction Analysis.</li><li>UCLA Interfraternity Council Vice-President of Risk Management (2015)</li></ul> -

Timeline

Ion Implant Manufacturing Operations Engineer

IBM Research
09.2016 - 08.2020

Assistant Signal Designer/Repairman/Signalman

Pan Am Railways
06.2015 - 01.2015

Ph.D. Graduated - Electrical Computer Engineering, Materials Science & Engineering

University of Wisconsin

M.S. Graduated -

B.S - Chemistry-Materials Science

University of California, Angeles (UCLA)

<ul><li>Focus: Semiconductor physics, properties of semiconducting materials, optics and optoelectronics, quantum mechanics, material interface properties. Wisconsin Nano Engineering Device (WISNED) Research Lab:</li><li>Research Areas: Semiconductor heterostructure device fabrication and electrical testing, photoluminescent and electroluminescent edge-emitting lasers, photodiodes, semiconductor interface electron affinity tuning.</li><li>Equipment Worked With: Reactive Ion Etchers (RIE), Inductively Coupled Plasma Etchers (ICP), Electron Beam Metal Evaporators, Contact Lithography, Atomic Layer Deposition (ALD), Chemical Mechanical Polishing (CMP), Keithley Semiconductor Characterization Probes, Plasma Enhanced Chemical Vapor Deposition (PECVD</li></ul> -

<ul><li>Coursework Completed: Chemical Thermodynamics, Quantum Mechanics, Mechanical Properties of Materials, Diffusion Controlled Reactions, Physics of Semiconductors, Inorganic Chemistry, Basic Organic Chemistry, Metal Alloys, Ceramics and Glasses, X-Ray Diffraction.</li><li>Skills Learned: Acid/Base Titration, Mass Spectrometry, Error Analysis, Distillation, Crystallization Purification, Ultraviolet and Infrared Spectroscopy, X-Ray Diffraction Analysis.</li><li>UCLA Interfraternity Council Vice-President of Risk Management (2015)</li></ul> -

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