CMP Intern
Universal Photonics
07.2022 - 08.2022
- Contact Number: (510)-738-8686
- Worked on Chemical Mechanical Planarization (CMP) process to smoothen Glass and Silicon Carbide substrate surfaces used in Optics and Semiconductor
- Worked closely with the R&D Scientist to develop and formulate new Slurries used in the CMP processes
- Ran DOE and Statistical methods to analyze data and make improvements to the formulation
- Used Atomic Force Microscopy to characterize the substrate surfaces after the CMP process
- As part of the intern experience, I was given an opportunity to develop a slurry formulation using Cerium Oxide for polishing glass substrate to reduce the starting glass thickness