I started working at Motorola in 1987 as an operator. Started as an inspector of ICs after the completion of wire bond, die bond and mold which encapsulated the Die.
I was promoted to Group Leader in 1990 when my team was moved to the Oak Hill factory probe floor. We probed 6 and 12 in wafers. We probed on different types of prober including Teradynes and Acretechs.
I received two awards on the probe from floor for discovering two misproccesses which would have caused issues to the final customer.
I became a engineering specialist in 2015 and moved to the final test floor. There is lead a team of 5 where we did lot starts and setups for engineering remote/debug sessions.