Summary
Overview
Work History
Education
Skills
Websites
Leadership Experience
Golf, Pinball
Timeline
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Eddie Bononcini

Corrales,NM

Summary

Senior dry etch process engineer for the Intel F11X NM Site with 28 years of dry etch experience. Owned, sustained, and transferred multiple process technology nodes across career. Performed ground level development, continuous improvement, high level sustaining, and vendor development collaboration for Silicon Photonics (SiP) program in Hitachi etch.

Overview

29
29
years of professional experience

Work History

Senior Staff Process Engineer

Intel
01.2013 - Current
  • Responsible for etch development on Hitachi M712 toolset to perform various etch techniques and novel etches using legacy platform
  • Developed numerous etch operations and partnered closely with yield integration to meet success criteria for the SiP process flow
  • Researched and applied etch methods and techniques to perform different style etches such as deep Si etch, InP etch, Ge etch, Al etch, and greyscale etch among others for SiP process
  • Sustained SiP process across 15 etch layers that required manual targeting and constant trend reviews which required constant multi-tasking to ensure all layers were running on target
  • Collaborated with etch vendor on first of a kind toolset to F11X site that exceeded requirements by SiP program resulting in 50% overall optical loss performance improvement
  • Mentored and trained six engineers to sustain Hitachi SiP which has several critical operations and considerations by instilling core values to ensure quality processing and results
  • Provide feedback to both new and experienced engineers in the group on performance, growth, and trained them to have a working understanding of all SiP etch operations
  • Created xRFCs, provided direction, and trained command center technicians across 168 hr team to be able to manage SiP lot dispatch operations that enabled cycle time goals to be met
  • Utilized and became proficient in using various metrology tools to develop etch processes such as the SRB (SEM), MIK (optical), and PRD (profilometer).

Senior Process Engineer

Intel
01.2006 - 01.2013
  • Transferred, sustained, and performed continuous improvement for the P1266 HME process consisting of four metal etch and four via etch layers as HVM 1 site
  • Trained multiple F11X engineers on the new HME process for F11X and its complexities
  • Lead module transfer (NSE, STR, HME, ICE) from PTD for P1266 engineering seeds and technicians with report outs to high level management
  • Developed chamber conditioning and run rule layer mixing of all layers to help reduce BEEP defects as part of task force model.

Senior Process Engineer

Intel
01.2001 - 01.2006
  • Process engineer and transfer seed of first 300mm factory in the world for NSE of the novel L shaped spacer process
  • Applied CE! strategies and methodology to ensure startup success and transfer deliverables
  • Trained all F11X MTs and FSE on PM activities for first of a kind toolset.

F11 Gasonix ash equipment engineer

01.1999 - 01.2001

Fab19 Hitachi etch equipment engineer

01.1998 - 01.1999

Fab9 LRC Process engineer

01.1997 - 01.1998

Intel GRE performed rotations in Fab 9 LRC, NM GSS, and F7 Integration group

01.1996 - 01.1997

Education

B.S., Electrical Engineering -

University of New Mexico
Albuquerque, NM
12.1996

Skills

  • Advanced knowledge in process engineering
  • Proficiency in process optimization
  • Strong analytical and problem-solving skills
  • Ability to develop and implement engineering strategies
  • Proficiency in troubleshooting process engineering issues
  • Ability to analyze engineering data for improvement opportunities
  • Ability to perform and apply research to development projects
  • Proficiency in providing technical support and collaborating cross-functionally
  • Strong communication and team collaboration skills
  • Strong project management skills
  • Ability to adapt to new technologies and methods in process engineering
  • Ability to use statistical process control methodology
  • Data Analysis
  • Process Development
  • Team Collaboration

Leadership Experience

  • Led numerous ATACs for Hitachi etch chamber issues consisting of both Hitachi FSE's and Intel technicians
  • Hitachi HPM team leader
  • Hitachi Module Team Leader for P1266 process transfer consisting of five engineers and four manufacturing technicians
  • Temporary Hitachi HME group leader during P1268 startup
  • Hitachi Module Team Leader for P1262/1263 process
  • Direct manager for equipment technician
  • Provide Hitachi module group leader coverage as needed

Golf, Pinball

Pinball enthusiast with small collection of DMD machines

Timeline

Senior Staff Process Engineer

Intel
01.2013 - Current

Senior Process Engineer

Intel
01.2006 - 01.2013

Senior Process Engineer

Intel
01.2001 - 01.2006

F11 Gasonix ash equipment engineer

01.1999 - 01.2001

Fab19 Hitachi etch equipment engineer

01.1998 - 01.1999

Fab9 LRC Process engineer

01.1997 - 01.1998

Intel GRE performed rotations in Fab 9 LRC, NM GSS, and F7 Integration group

01.1996 - 01.1997

B.S., Electrical Engineering -

University of New Mexico

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Eddie Bononcini