Eddy Mata

Sample Prep

• Allied X-Prep Toolset
• Chemical Prep using various chemicals to remove substances on the die
• Allied Multi-Prep Polisher
• Delid and physical removal of indium and TIM

CSAM (Confocal Scanning Acoustic Microscopy)

• Using PVA TePla SAM 300 with Winsam Software
• Both lidded and de-lidded units to capture TIM and Die level analysis for physical abnormalities
• Measurements using up to 8mm (110MHz) Transducers

3D Optical Imaging

• Using Keyence VHX Digital Microscope
• Captured images for Physical Failure Analysis

Surface Profilometry

• Using Solarius Development Laser Scan
• 3D Surface Scanning

X-Ray Imaging

• Using Zeiss 3D X-Ray Scanner

LSM (Laser Scanning Microscopy)

• Run both on the Meridan 4 and LICAT toolsets
• Scanning die level damage in the active areas to determine damage of the die

HAAS CNC

• Mill lids using specialty bits and pre-written code

Cross Sectionals taken using a wet saw for physical and die level failure analysis

• Diagnosed and resolved technical issues to minimize downtime and improve equipment efficiency.
• Conducted regular maintenance and inspections to ensure optimal functionality of systems and tools.

• Operate scanning electron microscope (SEM) for top view or critical dimension (CD)
• Receives minimal direction from Master Technician/TRs/Supervisors to prioritize non-routine daily tasks/projects
• Identifies new assignments/projects based on the need of the department
• Understanding of Recipe creation for CD Metrology (CD SEM)
• Demonstrates a deep level of adaptability to prioritize work based on business needs
• Has advanced understanding of and creation of the Standard Operating Procedures (SOP)
• Works on advanced assignment that requires a considerable amount of judgment and initiative
• CD-SEM Recipe Setup and Troubleshooting measurement issues
• Troubleshooting Automation, Data collection, and lot track-out issues
• TTTM activity (Tool To Tool Matching), and execution of experiments for new metrology recipes by running Gauge R&R study
• Works with multiple metrology engineers on multiple cross projects
• Monitors on tool qualification and take correction actions as needed
• Works together with equipment team
• Understand basic scanning electron microscope (SEM) principle
• Provides clear and concise written and verbal communication skills to team members
• Able to prioritize large workloads daily and able to multi-task.
• Operated and maintained advanced semiconductor manufacturing equipment to ensure optimal performance.
• Conducted routine inspections and troubleshooting of production machinery to minimize downtime.

• Responsible for technical functions in support of engineering activities such as design, test, checkout, modifications, fabrications, of design circuitry, electromechanical systems, or specialized test equipment
• Conduct engineering tests and detailed experimental testing to collect data or assist in research work
• Performs operational testing and fault isolation on systems and equipment
• Working on Server validation platforms - Platforms bring up, Hosts set up, and advanced troubleshooting
• Worked with CPUs, DIMMs, PCI cards
• Basic understanding of the programmable chips on-board
• Understanding of inventory control and very diligent in tracking high value IP
• Currently training on the technical aspects of a validation domain, such as Memory and High Speed Input/Output
• Prioritize and handle multiple lab requests that may be for hardware changes, experimental data, BIOS flash, SW set up, Host set up numbering 250+ platforms.

• Supported all Floor Operations in the Validation Lab
• Qualified to run ADVANTEST Handler and ADVANTEST T2000 Tester
• Shift Lead maintained the floor and would give pass down to on coming shift and would facilitate work and priorities for shift team
• Qualified to run STHI PPV and Boot Screen Testing
• Supported Engineering in running data collection work in Work Orders
• Performed maintenance and troubleshooting on HDMTs, LV, and X10 validation test equipment
• Supported team members in completing shift goals and tasks
• Trained employees on shift 6 for performing Tester reboots, Hydra setup & Handler recovery
• Knowledgeable of the different BIN codes, allowing to affectedly contact the engineer or shift-lead minimizing the response time to the BIN failures
• Also utilized this information to quickly correspond to equipment related failures, in order to correct for test floor operations, socket repair, TIU programming & validation of both socket & TIUs
• Assisted in extensive move of all CMT and mainframes handlers from AN1 to AN4 lab.

• Perform backside circuit edits and modification using FIB tool on next generation Intel Atom Products
• Work closely with Design, Debug and Product Engineers to define and design circuit edit plans to fix /root-cause circuit issues before performing edits
• Participate in the development of Circuit Edit and Sample Prep techniques for efficiency and cost savings for CD/FIB department
• Provide Sample Prep support using LCE, GDD, CNC and Polishing/Lapping tools
• Developed a process for Sample Prep to eliminate the need for a Wedge Bonder saving the department $200K
• Perform Die/Package inspection using optical microscope
• Interface with the vendors to resolve tool and related issues including troubleshooting and maintenance
• Planning and scheduling daily lab related tasks
• Collecting data and generating analysis reports for engineers after edits are completed.