Ganapati Hegde

Dynamic Senior Embedded Software Engineer and Technical Lead with 15+ years’ experience developing and delivering advanced platforms for the automotive, Tier 1, and semiconductor sectors. Expert in classic AUTOSAR, MCAL/BSW, automotive Ethernet stack, and complex device drivers for global OEMs and engineering partners. Adept at rapid prototyping, cross-functional project leadership, and business development in multicultural settings. Recognized for bridging technical depth with customer-oriented innovation, driving business success, and mentoring international teams.

Functional Safety Level 1 (ISO 26262)

• Architected universal BSW and bespoke Ethernet stack for Detroit Big 3 OEM’s next-gen SDV program (ITK/Bosch/ETAS).
• Drove complete MCAL/BSW configuration and integration of AUTOSAR-based HVAC ECU for Tier 1, leading global technical teams.
• Led migration of IoT stack (FreeRTOS) to AUTOSAR OS and MCAL driver development for a new automotive semiconductor product line.
• Delivered key amplifier MCU projects at Harman as Principal Engineer and Project Lead, successfully managing a cross-regional, dual-role handover and implementation.
• Designed and delivered complex automotive drivers and Ethernet stacks in multi-disciplinary global teams at Bosch—recognized with innovation awards and selected to demonstrate the VCU-P concept at NAIAS Detroit.
• Winner, RBNA Hackathon for out-of-the-box technical innovation.

• Five years direct US work experience—familiar with North American OEM, Tier 1 customer requirements and technical environments.
• Led diverse global teams across US, India, Europe.
• Native fluency in English, working proficiency with multicultural teams.
• Recognized for technical innovation, rapid problem-solving, and business-oriented software solutions.