Embedded C /C ( Familiar with Assembly / Rust)
Ganapati Hegde
Sr. Software Engineer / Advanced Solutions Engineer
Novi
Summary
Seasoned automotive software specialist with 15+ years in embedded systems and platform delivery across Bosch, Harman, and ITK Engineering (Bosch Group). Deep expertise in complex device drivers for EMS and Ethernet switch software within the AUTOSAR stack at Bosch; progressed to principal engineering and project leadership of audio amplifier ECUs at Harman; now operating as a solutions architect and topic lead at ITK. Focused on Software-Defined Vehicle (SDV) and semiconductor programs, mentoring multidisciplinary teams and steering end-to-end embedded delivery. Proven track record of shaping innovation and delivering impactful solutions for global OEMs and Tier 1s, with added impact in technical presales, acquisition support, and early opportunity shaping.
Overview
17
17
years of professional experience
1
1
Certificate
Work History
Sr. Software Engineer / Advanced Solutions Engineer
ITK Engineering LLC (Bosch)
10.2022 - Current
- Developing a vECU builder project for long-horizon SIL—virtualization/stubbing complex device drivers to enable early integration and repeatable validation.
- Migrated IoT/FreeRTOS workloads to AUTOSAR OS (MICROSAR/AUTOSAR OS) and designed/developed MCAL/BSW drivers on a new semiconductor platform, enabling the customer’s first automotive-grade product line.
- Architected and delivered Automotive Ethernet stack on AUTOSAR Classic for SDV programs—for a Top US OEM to run technical evaluations and integrations (ETAS RTA‑CAR, Marvell 88Q6113), tailoring to OEM specific requirements.
- Led end-to-end delivery of an AUTOSAR-based HVAC ECU for a Tier 1 supplier, coordinating US/EU/India teams across requirements, configuration, integration, and validation.
- Drove technical presales and acquisitions—RFI/RFQ responses, solution shaping, estimates, and demos—contributing to wins in SDV and semiconductor engagements.
- Mentored junior engineers and improved distributed team throughput via code/design reviews and robust integration workflows; maintained project rigor with Jira/Confluence and CI in Bitbucket.
Principal Engineer / Project Lead – Audio Amplifier ECU
Harman International (Samsung)
10.2020 - 09.2022
- Led a flagship BEV program for a top European OEM—the first amplifier ECU delivered by the India team—stabilizing interfaces and restoring delivery cadence after a cross-site reorganization.
- Owned MCU-side architecture and system integration; drove requirements (DOORS), design (Enterprise Architect), configuration/integration (Vector DaVinci), and validation (CANoe, TRACE32) through production milestones.
- Instituted risk tracking and corrective actions; unblocked critical integration issues and safeguarded schedule and quality across releases.
- Earned dual-role ownership (Principal Engineer + Project Lead) on the subsequent West Coast OEM program based on successful execution and customer trust.
Architect – AUTOSAR BSW / Gasoline Complex Drivers; Sr. Software Engineer (US: Bosch LLC)
Robert Bosch Engineering & Business Solutions
07.2012 - 09.2020
- Platform AUTOSAR BSW/Ethernet (Bosch/ETAS): spec‑compliant switch drivers, reusable configs; internal POC for multi‑switch cascading on Bosch HPC HW.
- Gasoline EMS complex device drivers ownership (Injector, Ignition, Knock): designed and optimized time-critical GTM/GPTA paths; ensured deterministic timing, calibration hooks, and diagnostics fit for global platform rollouts.
- North America assignment: provided platform-side driver expertise to major OEM programs, aligning platform requirements and resolving integration issues without diverging from standard baselines.
- Cross-site technical leadership (IN/US): mentored engineers, ran design/code reviews, and delivered rapid platform POCs that matured into reusable components and reference integrations.
- Recognitions: selected to demonstrate the VCU‑P concept at NAIAS Detroit; RBNA Hackathon winner for innovative cross-functional solutions.
Firmware Engineer
Horner APG
11.2010 - 07.2012
- Developed downloadable communication protocols for PLC controllers, enabling field-configurable functionality and long-term extensibility.
- Delivered firmware integrations across evolving industrial standards, building a perspective on adaptable software architectures that parallels today’s SDV principles (different use case, same philosophy: support variability and change over time).
Embedded Engineer
EIC Digital Meters / TDP Sun Power Technologies
10.2008 - 10.2010
- Worked on M2M AMR communication using Wavecom GSM modems and RS‑485 Modbus RTU—early IoT-style telemetry and remote data collection for distributed devices.
- Implemented device‑side SPI integration (CS5460A energy ADC) and production calibration.
- Early M2M (pre‑IoT) experience: remote telemetry, protocol design, and field‑configurable firmware for distributed devices—directly relevant to today’s IoT edge and SDV paradigms.
Education
BE - Electronics & Communication Engineering
Visvesvaraya Technological University
Bengaluru07-2008
Skills
AUTOSAR (Classic) Architecture/MCAL & BSW Stack
Certification
Functional Safety Level 1 (ISO 26262)
Accomplishments
- Semiconductor entry: FreeRTOS-to-AUTOSAR OS migration + MCAL stack for new automotive platform.
- Reusable BSW/Ethernet foundation across SDV prototypes (ITK/Bosch/ETAS) for Detroit Big 3.
- AUTOSAR HVAC ECU integration across global teams, on-schedule readiness.
- Cross-regional amplifier MCU program takeover and delivery at Harman.
- NAIAS VCU-P selection and Bosch innovation recognition; RBNA Hackathon Winner.
Timeline
Sr. Software Engineer / Advanced Solutions Engineer
ITK Engineering LLC (Bosch)
10.2022 - Current
Principal Engineer / Project Lead – Audio Amplifier ECU
Harman International (Samsung)
10.2020 - 09.2022
Architect – AUTOSAR BSW / Gasoline Complex Drivers; Sr. Software Engineer (US: Bosch LLC)
Robert Bosch Engineering & Business Solutions
07.2012 - 09.2020
Firmware Engineer
Horner APG
11.2010 - 07.2012
Embedded Engineer
EIC Digital Meters / TDP Sun Power Technologies
10.2008 - 10.2010
BE - Electronics & Communication Engineering
Visvesvaraya Technological University
Software
ETAS: ISOLAR/RTaRTE, INCA, LABCAR; Vector: DaVinci, CANoe, CANalyzer
Virtualization & Prototyping: Synopsys Virtualizer; ETAS vECU Builder; ETAS EHOOKS
IBM DOORS, Polarion; Git/Bitbucket, Jenkins, Jira, Confluence
Additional Information
- Multicultural collaboration: led teams across US/India/Europe; strong stakeholder communication with OEMs/Tier 1s.
- Recognized for technical innovation and rapid problem‑solving in complex automotive software programs.
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