Goutham Issac Ashok Kumar
Beaverton,OR
Summary
Resourceful Engineer passionate about advancing knowledge in microelectronics through high-quality research. Self-motivated professional with excellent communication, planning and problem solving abilities. Skilled in working within collaborative environments for multiple corporate funded projects. Delivered project goals in a time stipulated, result oriented research environment.
Overview
8
8
years of professional experience
Work History
Module Development Engineer
Intel
Hillsboro, Oregon
10.2021 - Current
- Performed equipment upgrades, commissioning and troubleshooting activities as the tool owner.
- Participated and Collaborated in cross-functional teams to help and develop solutions for complex tool problems to ensure smooth implementation of tool transfers and installations.
- Involved and Implemented tool upgrades with vendor for design changes, material selection and process optimization.
- Contributed to engineering standards by developing best practices within the organization.
- Maintained documentation of all process parameters and test results.
- Led manufacturing availability reports that tracked key detractors related to production processes that increased overall availability by 8%.
Graduate Research Assistant
Interfacial Electrochemistry & Materials Research Lab - University of North Texas
Denton, TX
08.2016 - Current
- Mechanistic Investigation and Prevention of Aluminum Bond pad Corrosion in Copper wire bonded device assembly ($166,000 : Funded by Semiconductor Research Corporation)
- Part of team that developed novel, selective, one step Chemical Vapor Deposition process to produce thermally stable Corrosion protective coating for Aluminum bond pad & copper wire corrosion in wire-bonded devices used in IC packaging.
- Successfully CVD coated devices on different variants of BGA devices obtained from NXP and was able to demonstrate successful protection from corrosion in severe chloride environments at higher temperatures.
- Resulted in two patent applications along with six presentation and publications in leading microelectronic conferences.
- UV-Vis spectroscopy as monitoring tool for etch rate control in PCB Copper etching (Collaboration with Intel Corporation):
- Developed thin film UV-Vis metrology (less than 5 µm path length cell) to help analyze cupric chloride wet etch bath solution for controlling Copper etch rate in PCB manufacturing.
- Demonstrated inefficiency of current metrology's used to monitor Cupric chloride solution etch rate and developed UV-Vis as alternative method in predicting etch rate of Cupric chloride etch solution.
- Successfully led team to transition from lab made thin film UV cell to using portable ATR probe for monitoring etch rate control in PCB Copper wet etching.
- Resulted in collaborative publication with Intel Corporation in peer reviewed journal.
Education
Ph.D. - Analytical/Materials Chemistry
University of North Texas
Denton, TX09.2021
Bachelor of Technology - Chemical & Electrochemical Engineering
CSIR - Central Electrochemical Research Institute
Karaikudi04.2015
Skills
- Magnetron and RF Sputtering
- Chemical Vapor Deposition (CVD)
- UV-Vis Spectroscopy: Double beam, ATR reflectance techniques
- FTIR Spectroscopy: ATR, Reflection absorption, Transmission techniques
- E-chem characterization – Potentiometry, Impedance Spectroscopy, Electrochemical Quartz Crystal Micro balance (E- QCM)
- Software: MS Office, Autodesk Inventor, Solid works, Fusion 360, Origin Pro, OPUS, OMINIC, CHI
Additional Information
- Awarded Second Place on the Graduate Research Seminar day (May 2019) conducted by Department of Chemistry, University of North Texas.
- Patent pending on "Passivation Coating on Cu surface for Cu Wire bonding application" (Invention ID: 08/05/2021-001)
- Publications : Comparative study of Chloride and Fluoride Induced Aluminum Pad Corrosion in WBD Packaging Assembly, Corrosion and Materials Degradation, 3, 2021, 447-460.
- Mechanistic Study of Copper Wire-Bonding Failures on Packaging Devices in Acidic Chloride Environments, Microelectronics Reliability, 113, 2020, 113917,ISSN 0026-2714.
- Thin-film UV-Vis spectroscopy as a chemically-sensitive monitoring tool for copper etching bath, Journal of Industrial and Engineering Chemistry, 51, 2017, 44-48 (Collaborative work with Intel).
Timeline
Module Development Engineer
Intel
10.2021 - Current
Graduate Research Assistant
Interfacial Electrochemistry & Materials Research Lab - University of North Texas
08.2016 - Current
Ph.D. - Analytical/Materials Chemistry
University of North Texas
Bachelor of Technology - Chemical & Electrochemical Engineering
CSIR - Central Electrochemical Research Institute
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