CMOS Continuous Wave Time of Flight (ToF) Depth Sensor
Led development of NXP i.MX8 based evaluation platform, showcasing ToF camera module + Depth ISP
- Created requirements for multiple software teams responsible for different components of the evaluation kit
- Performed bring-up and debug for system level integration of hardware, depth ISP firmware, and SDK
- Implemented pipeline for evaluation kit assembly flow, as well as end-of-line testing to ensure performance during evaluation
- https://wiki.analog.com/resources/eval/user-guides/eval-adtf3175d-nxz
Led applications efforts for ADI custom depth ISP (Converts raw ToF sensor data to depth)
- Ran performance characterization (filtering, depth compute accuracy)
- Maintained a system integration guide
- Provided technical support for customer designs via schematic, layout reviews, and generating use-case specific firmware
Managed the design and construction of a depth sensor characterization lab
- Designed 6m long screw-driven motorized rail system for depth camera module characterization
- Coordinated facilities, EHS, and product team from concept to launch of lab
Developed applications based on open source computer vision algorithms (OpenCV)
Demonstrated ADIs ToF sensors and camera modules at multiple trade shows (CES - Las Vegas, Embedded World - Nuremberg)
Provided technical support to customers in industrial, consumer and automotive segments
Capacitance sensing AFE with embedded processor core (LX6)
Led applications efforts by supporting and enabling key customers
- Led system integration support for a Tier 1 customer in consumer electronics through product development and shipping
- Conducted training and provided Tier 2 support to Field Applications and Sales teams in North America, Europe and APAC
- Generated collateral documentation such as datasheet and calibration guide
Led development of reference system designs and prototypes
- Improved customer ease of use by creating calibration scripts
- Developed and debugged firmware for embedded core (C - Xtensa LX6)
- Created mechanical and electrical prototypes to support multiple scenarios such as Front Facing Proximity, Specific Absorption Rate (SAR), and human vs. non-human detection
Created automated test scripts for silicon characterization board to test various hardware blocks
Patent Pending : Front-facing proximity detection using capacitive sensor (US20220300111A1)
CCD indirect ToF Sensor
Implemented calibration procedures (depth and lens) for ToF evaluation platform
- Created static target calibration procedure for camera lens calibration, reducing the need to capture >10 images with different poses to one image containing five poses
- Optimized generation of CCD timing vector tables, significantly reducing smartphone thermal characterization time at customer (Vivo)
Developed and managed CCD evaluation platform calibration procedure at contract manufacturer (AD-96TOF1-EBZ).
Conducted on-site deployment of module bring-up suites, calibration flow and assembly validation