Hermelinda Caballero
2608 S Ventura Rd Oxnard,CA
Summary
Focused professional knowledgeable about devising innovative solutions to diverse business concerns and goals. Strategic and forward-thinking leader with self-motivated and tactical mindset. Excellent relationship-building and critical thinking skills with determined and decisive nature. Experienced Quality Control Inspector skilled at inspections, assessments and reporting on quality issues. Accomplished at helping companies dramatically improve production through quality control enhancements. Works well with production teams on correcting negative trends and driving improvements. Skilled Quality Control Inspector focused on performing appropriate and useful analysis of products and component materials in order to drive quality improvements in manufacturing environments. Experienced QA, assembler with over 20 years of experience in electronic assembly. Excellent reputation for resolving problems and improving customer satisfaction. Hardworking and passionate job seeker with strong organizational skills eager to secure entry-level QA position. Ready to help team achieve company goals.
Overview
18
18
years of professional experience
1
1
Certification
Work History
QA Inspector
Mercury Systems Inc
03.2018 - 01.2020
- Monitored performance and generated reports detailing quality of product and defect rates.
- Created and deployed best practices to improve efficiency and reduce defects.
- Streamlined QA processes by working closely with development teams and staying abreast of changing product demands.
- Communicated with production team members about quality issues.
- Performed visual inspections and non-destructive tests where appropriate.
- Reported repeated issues to supervisors and other departments, collaborating to identify issue roots and rectify problems.
- Evaluated components and final products against quality standards and manufacturing specifications.
- Completed precise measurements using special tools.
- Used microscope and bond pull test machine to inspect quality of products, taking note of functionality, appearance and other specifications.
- Conducted Bond pull tests to evaluate comprehensive quality of transistors products, noting results and marking or removing defective items.
- Studied blueprints and design specs to uphold best-in-class knowledge of all products.
- Used hand tools, instruments, gauges and equipment to complete accurate measurements and noted results for official records.
- Examined die attached, wire bond and MMcs for defects or issues, reported problems quickly and maintained high levels of accuracy.
- Checked color, shape, texture and grade of products and materials against established templates, charts and samples.
- Evaluated items to assign grades and marked quality level, rejection status or acceptance.
- Repaired faults, reassembled products and completed additional tests.
- Conducted tests and diagnostic procedures using tools such as analyzers, multimeters and power supplies.
- Collected all readings throughout production processes to monitor levels.
- Located and investigated production concerns and helped management implement corrective actions.
Production Lead
Polyfet RF Devices
07.2005 - 03.2018
- Coached team members in techniques necessary to complete job tasks.
- Trained new team members by relaying information on company procedures and safety requirements.
- Worked different stations to provide optimal coverage and meet production goals.
- Evaluated employee skills and knowledge regularly, training and mentoring individuals with lagging skills.
- Continuously checked products for quality assurance according to strict guidelines.
- Participated in cross-functional team-building activities.
- Directed and supervised team of engaged all process development.
- Trained workers in proper operation, calibration and maintenance of production line equipment.
- Coordinated effective schedules for production employees.
- Maintained safe work areas by keeping pathways and stations free of hazards and excess waste or materials.
- Monitored employee activities to verify consistent use of good manufacturing principles.
- Handled production line documentation for waste, downtime and output.
- Communicated clear instructions for general operations and product-specific runs to prevent errors and rework.
- Organized regular production line cleaning and sanitation to prevent contamination and consumer illnesses.
- Kept production line ready for monthly inspections and yearly audits by consistently following optimal processes.
- Supported employees by accurately tracking time and proactively resolving any conflicts.
- Worked with supervisor and other team leads to manage and prioritize staffing assignments to meet customer demand and production schedules.
- Kept records of equipment, budgets, deliveries and supplies and made paperwork available to management for evaluation.
- Updated production metrics and facilitate regular team communication.
- Made sure that products were produced on time and are of good quality.
- Maintained organized work area by cleaning and removing hazards.
- Inspected finished products for quality and adherence to customer specifications.
- Performed general equipment maintenance and repair to minimize downtime.
- Assembled transistor products according to changing daily work orders and specific customer needs.
- Calibrated machines to maintain required productivity levels and adherence to quality standards.
- Tested products or subassemblies for functionality or quality and troubleshot problems with equipment, devices or products.
- cut wafer, manual probe and auto prove wafers.
- received a title of process specialist for minimize the time of process of transistors
Electronics Team Member
Microwave Devices
02.2002 - 07.2005
- Assembled components per technical specifications and production guidelines.
- Installed completed assemblies into cases.
- Completed surface mount soldering of printed circuit boards.
- Used precision measuring equipment to check final products for adherence to tolerance limits.
- Assembled products and components and made proactive adjustments to settings to produce work within tight tolerances.
- Analyzed blueprints and work orders to understand specifications and complete accurate assembly of [Type] products.
- Safely operated finishing tool to prepare products for inspections and packaging.
- Wired machines and packages.
Education
No Degree -
Mexico
Mexico Skills
- Safety Procedures
- Quality Control
- Fabrication Inspection
- Acceptance Requirements
- Quality Control Planning
- Active Learning
- Best Practices and Tools
- Maintaining Quality Assurance Standards
- Digital Multimeters
- Quantity Verification
- Sampling Protocols
- Sampling Procedures
- Visual Inspection
- Inspection Procedures
- Document Quality
- Inspection Protocols
- Minor Repairs
- Dial Calipers
- Maintaining Clean Work Areas
- Equipment Testing and Calibration
- Process Validation
- Defect Recording
- Blueprint Understanding
- QA Tools
- Quality Assurance Procedures
- Random Sampling
- ISO Quality Standards
- Inspection and Examination
- Equipment Function Testing
- Manage Corrective Actions
- Raw Materials Inspection and Testing
- Optical Gauges
- Product Tests
- Production
Accomplishments
- Supervised team of 11 staff members.
- Documented and resolved wire bond test which led to device fail.
- Used Microsoft Excel to develop inventory tracking spreadsheets.
Certification
- QA, wire bond, solder components Training -
- polyfet Rf Devices
- mercury systems, -2018
Manual probe and auto probe wafers, wafer cut, Manual marking, wire Bond, Die attach,
wafer arrive complete so I had to probe a sample die of deferent areas, if each area past the manual test we perform auto probe on hole wafer testin, gain, BVDss, and other the machine will mark with red in any die that no past the test witch is not good for production
after this process is done wafer cut was the following step this will cut all die on singles then wil do die pick witch is done on machine that only will pick good die for production then go to die attach witch attach die to a gold package on a die attach machine then move to wire bond were connect die to die with a gold ribbon or gold wire, then move to a test the parts if all test pass moves to leddin this will put a ceramic cap on the transistor then go to markin were we mark with black ink the part number part code.
Additional Information
I speak English and Spanish
I like learn new thing
I always on time
I like to work fast
Timeline
QA Inspector
Mercury Systems Inc
03.2018 - 01.2020
Production Lead
Polyfet RF Devices
07.2005 - 03.2018
Electronics Team Member
Microwave Devices
02.2002 - 07.2005
No Degree -
Mexico
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