Huy Doan

* Conducted failure analysis to determine root cause of the power SiC power devices/modules for a variety of customers in the automotive industry. Provided an 8D report with recommendations for correction action.

* Successfully completed failure analysis on over 300 8D cases to support the external automotive customers.

* Supported the new product introduction (NPI) team. Performed failure analysis on failed products and then provided the team with a technical report and recommendations.

* Supported the operation team to identify yield issues.

* Supported the R&D process/product development engineering team.

* Successfully completed failure analysis on over 700 cases to support the operation and NPI teams.

* Developed a high potential (Hipot) test program, which is used to evaluate the insulation of the module package.

* Developed a failure analysis procedure which helped to determine the root cause of the TM3 module. The procedure included electrical testing to verify failure mode, isolation test to verify the package, thermal imaging to locate the failure site on the device and de-processing to remove the solder for further analysis.

* Developed a process to remove lead (Pb) tin (Sn) solder, which helped to improve significantly the failure analysis cycle time.

* A member of the transfer team that was responsible for qualifying 150 mm SiC MOSFET products at the Durham facility.

* Provided technical support & MOSFET process flow training to the team and process engineering.

* Worked with the team to develop a qualification plan and then reviewed the plan with the R&D and Reliability teams to define reliability test requirements.

* Worked with process engineering team to create PFMEA and Playbook. which is used to evaluate and identify potential failure related to the operation process.

* Started and maintained qualification products. Analyzed final electrical test results and provided data summary to the team.

* Determined wafers needed by month and laid out clear schedule of tool/process quals, module quals, section quals and full line qual.

* Provided day-to-day engineer support to ensure maximized production which included product disposition, inspection training, temporary process change.

* Monitored critical SPC charts to maintain product yield and quality. Worked with process engineers to improve Cpk for critical SPCs.

* Developed and updated visible inspection documents for both Schottky and MOSFET. Provided technical training across the division including Operators, technicians, shift engineers and process engineers.

* Worked with process engineering team to develop and optimize critical processes that helped to improve the product yield up to %94. This also resulted in the reduction of the cycle time.

* Supported the process engineer team to qualify new tools.

* Worked with NPI team to ensure effective implementation of the new products.

* Worked with the R&D and NPI teams to successfully qualify 150 mm MOSFET products. Developed anneal process to correct wafer shape which enabled the 150 mm production qualification. Identified and fixed the IMD void which caused reliability failure during 150 mm MOSFET qualification. Maintained qualification products to ensure project meet the timeline. Worked with the metrology team to develop IVS. UV1280 and KLA recipes to collect base line data for critical processes.

* Supported day-to-day sustaining the power products such as Schottky, PiN diode, MOSFET, BJT, GTO, JFET.

* Developed and implemented processes which included running the DOE, performing the experiments and then writing the report and sharing it with the team. This helped improve the yield and cycle time power products.

2001–2005 Eastman Kodak Company Rochester, NY

Plasma Process Engineer

* Responsible for sustaining plasma dry etching for polysilicon, tungsten, tungsten nitride, titanium tungsten, and aluminum thin films in the CCD semiconductor manufacturing.

* Provided and updated training procedures.

Supported operation by monitoring the critical SPC charts and suggesting process changes to improve production, quality, and safety.

* Worked with design/development/integration teams to develop new etch processes as needed.

* Worked with equipment technician and vendors to address tool problems.

* Successfully developed a new dry etch process to eliminate metal corrosion issue which helped to enable the new product.

* Developed and implemented a tool qualification procedure which helped reduce particles, improving product yield.