JEFFREY WALDECK
Horseshoe Bend,ID
Summary
Experienced Packaging Engineer with a proven track record in designing, testing, and
optimizing packaging solutions for electronic products. Skilled in packaging design,
materials selection, prototyping, cost analysis, sustainability initiatives, quality
assurance, and regulatory compliance. Proficient in CAD software and experienced in
collaborating with cross-functional teams. Adept at problem-solving, project
management, and continuous improvement. Seeking an opportunity to leverage my
expertise to enhance packaging solutions for you.
Overview
35
35
years of professional experience
Work History
Expert Hardware Development Engineer
HP Inc
01.2017 - 09.2023
- Designed and tested LaserJet packaging, ensuring product safety and presentation.
- Optimized international supply chain processes to improve efficiency and reduce
costs. - Collaborated with global teams to streamline packaging design and production.
- New employee training/mentoring and creation of best-practices for package design and testing.
Hardware Development Engineering Lead
Adecco Technical Services
01.2007 - 01.2017
- Provided worldwide support for LaserJet packaging and manufacturing process, ensuring consistency and quality.
- Led ISO 9000 departmental initiatives, ensuring compliance and quality standards
- Championed production lift-assist systems, enhancing ergonomics and efficiency.
Hardware Development Engineer
Hewlett-Packard Company
01.2001 - 01.2005
- Designed and tested LaserJet packaging, ensuring product safety and presentation.
- Optimized international supply chain processes to improve efficiency and reduce costs.
- Collaborated with global teams to streamline packaging design and production.
Hardware Development Engineer
Hewlett-Packard Company
01.1989 - 01.2001
- Led design and testing efforts for storage systems HDD packaging, ensuring reliability.
- Designed and tested HDD enclosures for rack systems, meeting rigorous standards.
- Achieved $1.2 million dollars cost savings by reducing cost of packaging
- Championed ESD and environmental considerations for packaging
- Ergonomic Champion for HP Boise site
Education
M.S. Packaging -
Michigan State University
East Lansing, MichiganSkills
- Packaging Engineering
- 3D CAD
- Training Junior Team Members
- Best Practices and Standards
- Cost Savings
- Design Reviews
- Lab Testing
- Design Changes
- Change Management Process
Affiliations
Idaho Mountain Search & Rescue Unit, Board member 1990-2002
Amateur Radio Emergency Services member (K7JAF) 2012-present
Timeline
Expert Hardware Development Engineer
HP Inc
01.2017 - 09.2023
Hardware Development Engineering Lead
Adecco Technical Services
01.2007 - 01.2017
Hardware Development Engineer
Hewlett-Packard Company
01.2001 - 01.2005
Hardware Development Engineer
Hewlett-Packard Company
01.1989 - 01.2001
M.S. Packaging -
Michigan State University