Jessica Warnberg
Beaverton,Oregon
Summary
Semiconductor engineer with strong problem-solving skills and leadership experience. Expertise in scanning electron microscopy with 10+ years of industry experience in semiconductor yield enhancement and inspection. Consistently identified as a high performer with excellence in both technical and interpersonal skills. Demonstrated track record of continuous improvement, adaptability, and promotions. Curious and questioning individual who is passionate about learning, sourcing and understanding issues, and creating efficiency. Seeking an opportunity as an Defect Metrology Engineer at Intel to deepen my engineering experience.
Overview
12
12
years of professional experience
1
1
Certification
Work History
Senior Field Service Engineer - E-beam
ASML
11.2024 - Current
- Shifted team execution from reactive troubleshooting to proactive fleet health management by implementing and managing tool health dashboards and issue trackers.
- Flagged degradation trends early and reduced down-time waiting for parts by utilizing tool health data to identify likely early failure points and ordering parts ahead of time to turn unscheduled downs into scheduled actions.
- Produced weekly executive‑level fleet health summaries for leadership, consolidating tool health metrics, key hardware actions, PWP trends, unscheduled downtime, completed actions, and newly identified risks into a digestible, decision‑ready format.
- Recognized by ASML leadership for modeling “Data Driven Decisions” by applying data‑driven analysis (logs, historical tool data, stage health trends) to resolve PWP OOS events, driving correct chamber‑open decisions and resolving particle and XY stage issues with higher confidence.
Developed a repeatable BKM and stage‑health reporting approach that increased decision accuracy, reduced bias during investigations, and enabled more consistent handling of future performance impacting events. - Owned scheduling and execution of preventive and proactive maintenance for an 18‑tool fleet, ensuring PMs were completed on‑time at 30‑day intervals while coordinating additional scheduled maintenance to mitigate emerging risks and prevent unplanned downtime.
- Authored or substantially rewrote 15+ procedures (Action plans, BKMs, OCAPs) to standardize PM execution, reduce engineer‑to‑engineer variation, and prevent repeat tool instability.
- Saved an estimated ~3 hours/week by reducing the rediscovery of known issues and centralizing visibility into fleet health and open actions.
- Reduced craftsmanship‑related PM errors by correcting incorrect specifications, repairing broken conditional formatting, and enforcing consistent OOS flagging across all tools.
- Increased customer trust and execution reliability by ensuring customer requests and known issues were tracked, scheduled, and consistently closed.
- Designed and multiple delivered cross‑shift training and certifications to improve knowledge across the team.
- Diagnosed and resolved recurring tool and image‑quality failures, implementing permanent corrective actions that reduced repeat escalations and improved operational predictability.
CS-Apps Engineer - E-beam
ASML
07.2023 - 11.2024
- Heavily supported e-beam TTTM activities by partnering with customers and internal teams to develop customer‑specific processes that enabled reliable recipe execution and tool use cases.
- Served as a 2nd‑line escalation support resource for first‑line engineers, providing expert guidance on image‑quality, recipe‑execution, and tool behavior issues.
- Diagnosed and resolved image‑quality and recipe‑related issues by analyzing tool behavior, settings, and execution conditions, helping stabilize customer workflows.
- Performed user acceptance testing (UAT) for new regional software releases, validating functionality against real‑world engineering workflows and providing feedback prior to deployment.
- Collaborated closely with customers and various internal local and global support teams to translate requirements into executable, supportable processes.
Field Applications Engineer - E-beam and Metrology
ASML
07.2022 - 07.2023
- Support external customer application requests for defect inspection and metrology e-beam applications on HMI (Hermes Microvision, Inc.) SEMs.
- Conduct applications acceptance tests to ensure newly installed and upgraded tools perform to internal specifications.
- Provide training and documentation to help customers learn key features of new applications.
- Troubleshoot e-beam recipe applications and related hardware issues and apply fixes to optimize tool performance.
Yield Enhancement and Metrology Process Engineer
Texas Instruments (formerly Micron)
05.2020 - 07.2022
- Rapidly identify and escalate product excursions to drive areas to containment actions. Document and investigate unsourced excursions to root cause. Set up inline data collection using optical and SEM microscopy, such as pre-post step insects, EDS, defect revisits, and oversampling to validate root cause and fix.
- Monitor product inspections and react to SPC chart violations. Disposition product and source deviations to appropriate process areas for correction.
- Identify and investigate SPC chart trends using data analysis techniques.
- Troubleshoot metrology data collection issues and optimize CD SEM data collection recipes.
Yield Enhancement Lab Engineer Lead
Micron (formerly IM Flash Technologies)
09.2017 - 05.2020
- Prepared and presented daily reports on key lab findings to drive yield improvement.
- Reported on KPI’s, CTs, queue times, and other key metrics and investigated trends and missed targets to pinpoint improvement opportunities.
- Cultivated a highly skilled and flexible team based on internal skill points system and upward feedback.
- Managed the transmission electron microscopy (TEM) engineering and technician group.
- Created and implemented site wide business process update to establish lab engineering request limits to reduce and more effectively track cycle times, improve prioritization, and close knowledge gaps between lab and external customers.
Yield Enhancement Lab Technician
IM Flash Technologies
06.2014 - 09.2017
- Created lab wide BKMs for how to choose different SEM sample preparation methods, imaging e-beam sensitive photoresist, SEM microcleaving sample preparation technique, planar TEM sample preparation technique, and ultra-thin TEM lamella prep.
- Improved turn time on SEM cross section data requests by identifying inefficiencies in procedural CADs and updating recipes to obtain the same data in less time.
- Drove several characterization and improvement projects such as mitigation of Cu migration on samples, characterizing the effects of the electron beam on dielectrics and metal contacts, and Gage R&R study to quantify differences between lab measurement systems.
- Troubleshoot SEM and dualbeam tool issues such as lens cooling errors, stage errors, and vacuum failures. Perform mechanical column alignment on Hitachi 4800 SEM.
- Participated in the People Committee to address workplace survey complaints and improve job satisfaction. Organized and promoted team building events.
Education
Physics With Computational Emphasis
Salt Lake Community College
Salt Lake CityAssociate of Applied Science - Electron Microscopy
Madison Area Technical College
Madison, WI05-2014
General Studies
University of Wisconsin - Madison
Madison, WISkills
- Strong understanding of theory and operation of electron microscopes and characterization techniques, including scanning electron microscopes (SEM), energy dispersive spectroscopy (EDS), and passive voltage contrasting (PVC), focus ion beam (FIB), and transmission electron microscopy (TEM)
- Semiconductor and material sample preparation and failure analysis including deprocessing die for physical failure analysis (PFA), signal tracing, and in-situ cross-sectional and planar TEM lamella prep
- Knowledge of semiconductor manufacturing and fabrication processes, memory architecture, and cell operation
- Leadership skills such as performance appraisals, promoting and performance managing team members, effective goal setting, team building, and conflict resolution
- Ability to create professional reports to clearly communicate engineering results to a broad audience
- Datamining and application of data analysis tools such as JMP, Excel, and in-house programs to identify process trends and correlations
Certification
- Lean Six Sigma Green Belt Certificate, University of Utah - October 2021
Timeline
Senior Field Service Engineer - E-beam
ASML
11.2024 - Current
CS-Apps Engineer - E-beam
ASML
07.2023 - 11.2024
Field Applications Engineer - E-beam and Metrology
ASML
07.2022 - 07.2023
Yield Enhancement and Metrology Process Engineer
Texas Instruments (formerly Micron)
05.2020 - 07.2022
Yield Enhancement Lab Engineer Lead
Micron (formerly IM Flash Technologies)
09.2017 - 05.2020
Yield Enhancement Lab Technician
IM Flash Technologies
06.2014 - 09.2017
Physics With Computational Emphasis
Salt Lake Community College
Associate of Applied Science - Electron Microscopy
Madison Area Technical College
General Studies
University of Wisconsin - Madison