KARTHIK KALAIAZHAGAN
Albuquerque,NM
Summary
Failure Analysis and Reliability Engineer with over 10 years of experience in identifying root causes of semiconductor device failures and improving yield. Strong leadership and relationship-building skills. Experienced in advanced fault isolation tools and techniques to enhance product reliability.
Overview
11
11
years of professional experience
Work History
Failure Analysis Engineer
Intel Corporation
12.2018 - Current
- Perform fault isolation on semiconductor devices using ELITE, OBIRCH, X-ray, and IREM tools to locate failures.
- Conduct physical failure analysis using SEM, FIB, and EDX to identify root causes and improve yields.
- Characterize and test devices with Nanoprober and electrical bench testing.
- Develop new techniques and train engineers to improve cycle time and throughput.
- Manage scheduling, maintenance, and certification for fault isolation tools.
Senior Failure Analysis Engineer
GlobalFoundries
06.2014 - 11.2018
- Conducted physical failure analysis on scan chain logic nets and identified failure modes in advanced technology nodes.
- Performed FIB cross-sections and nanoprobing on SRAM devices; created defect Pareto charts.
- Used iPHEMOS and ELITE tools for fault isolation on HOL structures; collaborated with TEM team for analysis.
- Utilized JMP and Weibull analysis to determine failure times and estimate reliability characteristics.
- Worked closely with Integration and Process teams to communicate defect findings and support yield improvements.
Education
Master of Science - Electrical Engineering
Rochester Institute of Technology
Rochester, NY12-2013
Skills
- Failure Analysis
- Device Characterization
- Yield Enhancement
- JMP and Weibull Analysis
- Fault Isolation
- Design of Experiments
- Defect Pareto Analysis
- Avalon and CADNAV Software
Tools
- Enhanced Lock-in Thermal Emission (ELITE)
- Nanoprober and Bench Testing
- IPHEMOS
- Infrared Emission Microscope (IREM)
- Scanning Electron Microscope (SEM)
- Focused Ion Beam (FIB)
- Atomic Force Microscope (AFM)
- Electron Dispersive Spectroscopy (EDS)
- X-ray
Patent
- Defect Detection Using Thermal Laser Stimulation and Atomic Force Microscopy Patent No: US-2024-0069095-A1
Publications
- Conductive Thin Film Fail Detection in 20 nm and 14 nm Technologies.
42nd (ISTFA), 2016
- Nanoprobing-Based EBAC Technique from Backside and Frontside to Isolate Logic Fails for Otherwise Non-Visual Defects.
43rd (ISTFA), 2017
Timeline
Failure Analysis Engineer
Intel Corporation
12.2018 - Current
Senior Failure Analysis Engineer
GlobalFoundries
06.2014 - 11.2018
Master of Science - Electrical Engineering
Rochester Institute of Technology
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