Company Overview: Microchip acquired Atmel in 2016
Website not provided
Hired by Microchip (Microchip acquired Atmel in 2016) after being contacted by previous Yield Enhancement Managers
Provide comprehensive support for the wafer fab by monitoring microcontroller and flash memory electrical test and sort yield, rapidly identifying root cause of shifted electrical parameters and poor yielding product and determining appropriate corrective actions
Collaborate with the Failure Analysis Lab, the Device Lab and Test & Product Engineering for root cause analysis, device characterization and resolution of test program issues
Converted Microchip from data visualization software Spotfire DecisionSite to Tibco Spotfire Analyst by recreating hundreds of information links from the old software into the new software format as well as creating new links requested by engineers for data extracts
Selected to take on Product Development role, leading the creation of process flows and processes needed to transfer discrete Zener diodes, Schottky diodes and power MOSFET products from foundries used by organizations acquired by Microchip
Personally responsible for electrical measurements on Zener and Schottky Diode products using Frothingham Diode Tester and Curve Tracer
Microchip acquired Atmel in 2016
Website not provided
Flexible Capacitive Touch Screen Yield Engineer
Unipixel Inc.
Colorado Springs, CO
05.2015 - 06.2017
Company Overview: Website not provided
Continued support as sole Yield Enhancement Engineer after XSense (Atmel) was purchased by Unipixel
Responsible for all electrical yield data analysis for flexible capacitive touch screens manufactured to determine issues present and determine corrective actions
Executed issue analysis and solution development for all customer issues
Implemented a format for electrical data analysis that supported all products and testers, replacing a product/tester specific format that required every lot manufactured to be manually evaluated
Developed a bright light inspection for starting material to detect issues, preventing defective material from being introduced into the product line
Website not provided
Flexible Touch Screen Fab Yield Engineer
Atmel Corporation XSense
Colorado Springs, CO
01.2013 - 04.2015
Company Overview: Website not provided
Transitioned from wafer fab to support Atmel’s flexible capacitive touchscreen startup as sole Yield Engineer
Worked seven days a week during initial startup to support development projects needed to bring up the touchscreen line by providing summaries of key indicators at daily operations meetings
Evaluated electrical test results to identify root causes of poor yielding product and provide corrective action recommendations
Assessed customer returns and reliability test failures and reported on root cause and corrective actions
Developed methods to isolate low yield through hand probing, visual inspection, and key tool analysis
Implemented major changes to yield analysis software, significantly increasing the capability to identify precise sensor failure modes
Website not provided
Fab Senior Yield Engineer
Atmel Corporation
10.2003 - 12.2012
Company Overview: Website not provided
Provided comprehensive Yield Enhancement support for the wafer fab by monitoring microcontroller and flash memory electrical test and sort yield, rapidly identifying root cause of shifted electrical parameters and/or poor yielding product and directing needed experiments and process changes
Volunteered to serve as the Yield Engineer for an understaffed technology group during a product transfer to a Korean Foundry
Coordinated all E-Test, sort, bitmapping and yield/DOE evaluations
Took over all flash memory and microcontroller E-TEST engineering responsibility on top of normal yield responsibilities for a five-month period due to staffing shortage
Evaluated, characterized, and implemented a modified shallow trench isolation etch process to alter the trench shape to significantly reduce junction breakdown and improve microcontroller yields
Traveled to China foundry in preparation for product transfer
<ul>
<li>Responsibilities -Process Engineering: -</li>
<li>Responsible for making SOP on required process flow for overall manufacturing.</li>
<li>Responsible for doing validation and closing buy off points in line before starting an NPI.</li>
<li>Making process mapping for on scrap and process issues to increase productivity in manufacturing.</li>
<li>Responsible for doing analysis and making actions against failure to reduce production loss.</li>
<li>Achieving standard targets requirement from customer end related to yield and scrap.</li>
<li>Responsible for confirming QOC and OBA failures and as well as making analysis on that and sharing RCA (Root Cause and Analysis) to CFT (Cross Functional Team).</li>
<li>Conducting MOM (Minutes of Meeting) on daily basis Among the Yield, Scrap and Production.</li>
<li>Responsible for preparing PFMEA on process stages inline.</li>
<li>Making a SWR (Special Work Request) for any process change to improve yield and productivity.</li>
<li>Responsible for making reports based on analysis with PPT, and conducting CFT to present reports for failure reduction.</li>
<li>Maintaining good yield graphs toward the given targets.</li>
<li>Time study, standard time and manpower request, capacity analysis, and line balancing analysis.</li>
<li>Preparing DFMA reports of manufacturing and assembly based on criticality. Process improvement activities and continuous improvement of the manufacturing process, material handling, and line layout.</li>
<li>Organizing and executing all process activities, such as rejection and scrap reduction.</li>
</ul> at Sunny Opotech India Pvt.Ltd<ul>
<li>Responsibilities -Process Engineering: -</li>
<li>Responsible for making SOP on required process flow for overall manufacturing.</li>
<li>Responsible for doing validation and closing buy off points in line before starting an NPI.</li>
<li>Making process mapping for on scrap and process issues to increase productivity in manufacturing.</li>
<li>Responsible for doing analysis and making actions against failure to reduce production loss.</li>
<li>Achieving standard targets requirement from customer end related to yield and scrap.</li>
<li>Responsible for confirming QOC and OBA failures and as well as making analysis on that and sharing RCA (Root Cause and Analysis) to CFT (Cross Functional Team).</li>
<li>Conducting MOM (Minutes of Meeting) on daily basis Among the Yield, Scrap and Production.</li>
<li>Responsible for preparing PFMEA on process stages inline.</li>
<li>Making a SWR (Special Work Request) for any process change to improve yield and productivity.</li>
<li>Responsible for making reports based on analysis with PPT, and conducting CFT to present reports for failure reduction.</li>
<li>Maintaining good yield graphs toward the given targets.</li>
<li>Time study, standard time and manpower request, capacity analysis, and line balancing analysis.</li>
<li>Preparing DFMA reports of manufacturing and assembly based on criticality. Process improvement activities and continuous improvement of the manufacturing process, material handling, and line layout.</li>
<li>Organizing and executing all process activities, such as rejection and scrap reduction.</li>
</ul> at Sunny Opotech India Pvt.Ltd