KIHYON KIM
San Jose,CA
Summary
Experienced Lithography Process Engineer with a strong background in AR Micro LED process development at Google. Proven track record as an Application Engineer at KLA-Tencor, focusing on new production evaluation. Former Group Leader and Imaging Simulation Expert at ASML, with extensive experience in leading lithography teams at Samsung SDI and Samsung Electronics. Solid foundation in quality control from early career at Samsung Motors, enhancing overall process efficiency.
Overview
28
28
years of professional experience
Work History
Lithography Process Development Engineer
Google
San Jose, California
04.2023 - Current
- Micro LED for AR: New development engineering. I made most of the major rules for the process and for high volume.
- I deeply worked with the integration team and the design team.
- Proactively evaluate all new lithography conditions, depending on design changes.
- All new lithography conditions develop and create a standard WoW, since this is a new business.
- SPC: How to Monitor and Control. Trained all other process engineers.
- ASML PAS 850C scanner control with a 6-inch wafer.
- Metrology - CDSEM purchase, recipe creation, monitoring method, amount, and frequency. All standards have been created.
New Product Leader (Application)
KLA Tencor
Portland, USA
09.2021 - 04.2023
- Led evaluation of new generation machines to enhance performance and reliability.
- Developed design simulation using Metrology Target Designer (MTD) for precise measurements.
- Provided application support for image-based overlay and scatterometry techniques.
Application Group Leader & Simulation expert
ASML
Austin, USA
01.2020 - 09.2021
- Defined and explained WELLE compaction vs product overlay correlation through simulation.
- Demonstrated strong evidence linking old issue at Samsung to WELLE compaction.
- Evaluated edge yield improvement via Focus Die Optimization (FDO).
- Analyzed Texas Instrument PAS system proximity improvement solutions using simulation.
Sr. 2nd Line Application Engineer / Imaging Expert
ASML
Hillsboro, USA
03.2015 - 12.2019
- Supported Hillsboro Intel R&D for new product project initiatives.
- Executed EUV reticle pellicle project to enhance production accuracy.
- Conducted EUV imaging simulations to assess performance metrics.
- Implemented speckle reduction strategies to improve image quality.
- Performed proximity matching simulations using Lithocruiser, Prolith, and Hyperlith tools.
- Facilitated pupil matching simulations and analyses for optical optimization.
- Evaluated new function options for ASML technology advancements.
- DOMA - CD uniformity improvement.
- Image Tuner - Lens Aberration optimize.
- Image Optimizer2 - edge leveling improves.
- Lens heating control.
Sr. Field Application Engineer / Generalist & Imaging
ASML
Korea
07.2007 - 03.2015
- Supported issue tracking and facilitated machine stabilization across multiple sites.
- Evaluated new options for project development.
- AGILE - wafer real surface measurement by air.
- Gridmapper - Overlay improvement.
- COI, CFI, CPI - Customized Overlay, Focus, Productivity improvement.
- Flexwave - Lens Aberration Control.
- DUV 860L beta successfully supported and it prevented competitor DRY machine purchase.
Photo Process Manager
Samsung Display
Cheonan, Korea
06.2006 - 06.2007
- Led start-up of high-volume AMOLED lithography production, achieving first-time success globally.
- Samsung Display asked for help with the 12-mask AMOLED process. The HV experience was only LCD (4 masks).
- Spearheaded multiple development projects, addressing challenges in high-volume production.
- Introduced new vacuum drying conditions, replacing baking to reduce corrosion risks.
- Standardized lithography process conditions to ensure consistency and efficiency.
- Established comprehensive process control measures for overlay, critical dimension, and defect analysis.
- Coordinated cross-functional teams, monitoring processes and conducting failure analyses for continuous improvement.
Lithography Process Engineer
Samsung Electronics Co.
Hwaseong FAB, Korea
08.1999 - 06.2006
- Spearheaded worldwide 1st 300mm FAB startup for TFT technology.
- Set up and controlled DRAM and FLASH processes.
- Developed new device projects, including DRAM 90nm and FLASH 63nm.
- Engineered new Optical Proximity Correction (OPC) and optimized Tapered Process Recipe (TPR) for new devices.
- Facilitated transfer of new designs to high-volume FAB production.
- Received CEO Prize for successful setup of 90nm first MLC FLASH memory.
Process engineer
Samsung Electronics Co.
Giheung FAB, Korea
02.1998 - 12.2001
- Conducted organic ARC process evaluations to establish high-volume production standards.
- Implemented process control measures, enhancing SPC, defect rates, and yield.
- Optimized measurement techniques using KLA and SEM for precise metrology.
- Troubleshot TEL track issues, ensuring recipe control and consistency.
Education
Bachelor's degree - Mechanical Engineering
Inje University
Korea02-1998
Exchange Student -
UC Davis
01.1997
Training
- 1999, NIKON - Korea
- 2000, ASML PAS, DUV - Korea
- 2001, CANON - Japan
- 2003, KLA Archer10 process - USA
- 2003, TEL - Japan
- 2007, ASML Application Level1,2,3 - Netherland
- 2010, ASML NXT - Netherland
- 2011, ASML Image 2nd line training - Netherland
- 2012, ASML Imaging simulation - Netherland
- 2016, IMEC Process Level2,3
- 2017, EUV - Portland
- 2021, Nanofabrication training - San Jose AMAT
Awards
Samsung CEO Prize, Due to 90nm 1st MLC FLASH memory successful set-up.
Timeline
Lithography Process Development Engineer
Google
04.2023 - Current
New Product Leader (Application)
KLA Tencor
09.2021 - 04.2023
Application Group Leader & Simulation expert
ASML
01.2020 - 09.2021
Sr. 2nd Line Application Engineer / Imaging Expert
ASML
03.2015 - 12.2019
Sr. Field Application Engineer / Generalist & Imaging
ASML
07.2007 - 03.2015
Photo Process Manager
Samsung Display
06.2006 - 06.2007
Lithography Process Engineer
Samsung Electronics Co.
08.1999 - 06.2006
Process engineer
Samsung Electronics Co.
02.1998 - 12.2001
Bachelor's degree - Mechanical Engineering
Inje University
Exchange Student -
UC Davis