Summary
Overview
Work History
Education
Skills
Accomplishments
Affiliations
Languages
Publications
Patents and trade secrets
Timeline
Generic

Kranthi Kumar

Chandler,US

Summary

Senior Process Engineer with 8 years of semiconductor experience specializing in ALD metal deposition and NAND memory device testing. Proven contributor to high volume manufacturing environments, with a strong record of improving yield, reliability, and throughput through data-driven process optimization. Experienced in transferring ALD metal processes from R&D to production and supporting large-scale equipment upgrades. Deep expertise in SPC, DOE, root cause analysis, and process integration for memory technologies. Recognized for hands-on troubleshooting, rapid issue resolution, and effective collaboration with device, integration, and manufacturing teams.

Overview

9
9
years of professional experience

Work History

Senior Process Engineer I, Metal Logic Team

ASM America
Phoenix, US
07.2023 - Current
  • Developed and optimized BEOL Mo deposition processes on ASM thermal and plasma tools for 3nm and < 3nm nodes.
  • Successfully led the transfer of process technology from ASM demo tools to customer onsite.
  • Led ASM Tool startups for thermal and plasma metal fleets at customer sites.
  • Pioneered the integration of real time sensing for chamber clean and recovery, reducing the tool down time by 30%.
  • Developed and implemented new processes with 5% improvement of yield and 10% reduction in defects.
  • Root cause, troubleshoot and resolve semiconductor equipment and process issues.
  • Develop and maintain process control systems and standard operating procedures (SOPs). Ensure accurate documentation of process parameters, changes, and results.
  • Collaborated with hardware/software/sales/BU to optimize equipment performance and troubleshoot process deviations through hardware CIPs.
  • Technology Transfer & Scale-Up

Senior Process Engineer I, Corporate Research & Development

ASM International
Leuven, Belgium
05.2022 - 06.2023
  • Owned and managed three ALD pilot production tools, maintaining >90% uptime through proactive monitoring and optimization.
  • Developed and implemented preventive maintenance (PM) schedules and troubleshooting protocols, reducing unplanned downtime by 30%.

Staff Engineer, Systems Team, cSSD

Micron
Hyderabad, Telangana, India
11.2021 - 10.2022
  • Developed high and low temperature reliability check points for SSD memories.
  • Orchestrated the successful approaches for performance and reliability studies of NAND memory at various temperatures. Reducing testing time by 30%.

Staff Engineer, Device Team

Western Digital
Bangalore, India
04.2017 - 10.2021
  • Led end-to-end reliability and process qualification of legacy 2D NAND technology, supporting high-volume manufacturing (HVM) release through endurance, retention, and stress validation using DOE, SPC, and structured failure analysis methodologies.
  • Developed and optimized erase control algorithms to mitigate erase disturb mechanisms, improving process stability, cycling performance, and manufacturing yield.

Education

Ph. D - Centre for Nanoscience and Engineering

Indian Institute of Science
Bangalore, India
01-2018

M. Tech - Nanoscience, Centre for Nanoscience and Technology

Anna University
Chennai, Tamilnadu, India
01-2011

B. Tech - undefined

YPR college of Engineering, JNTU Hyderabad
AP, India
01-2008

Skills

  • Material Processing and device fabrication
  • Atomic layer deposition of metals and dielectrics
  • Chemical vapor deposition of thin films, mainly 2D materials
  • Transfer of 2D materials from the grown substrate
  • Thermal evaporation, sputtering and etching
  • Lithography: e-beam and photo
  • Characterization
  • Electron microscopy – SEM and EDX
  • Raman spectroscopy and photoluminescence
  • X-ray photo spectroscopy (XPS)
  • Atomic force microscopy
  • XRD of polycrystalline/epitaxial films
  • Electrical characterization: CV, IV of MOS devices, four probe & Hall measurements
  • Others: ImageJ, JMP, Origin, MATLAB, Spotfire, Unix

Accomplishments

  • Designed DOE strategy that improved within wafer non-uniformity by 8%.
  • Developed standardized troubleshooting guide that reduced MTTR (Mean Time to Repair) by 15%.
  • Improved manufacturing yield from 80% to 90% within one year through SPC-driven process control.

Affiliations

Institute of Electrical and Electronics Engineers

Languages

English
Full Professional
Hindi
Full Professional
Telugu
Full Professional

Publications

  • V. Kranthi Kumar, Sukanya Dhar, Tanushree H. Choudhury, S. A. Shivashankar and Srinivasan Raghavan, “A Predictive Approach to CVD of Crystalline Layers of TMDs: The Case of MoS2”. Nanoscale, 2015,7, 7802–7810.
  • Hareesh Chandrasekar, Krishna Bhardwaj, Kranthi Kumar, Swathi Suman, Navakanta Bhat, Manoj Varma, Srinivasan Raghavan, “Spotting 2-D Atomic Layers on Aluminum Nitride Thin Films” IOP, Nanotechnology, October 2015.
  • Sukanya Dhar, V. Kranthi Kumar, Tanushree H. Choudhury, S. A. Shivashankar and Srinivasan Raghavan, “Chemical vapor deposition of MoS2 layers from Mo-S-C-O-H system: thermodynamic modeling and validation”, Physical Chemistry Chemical Physics, 18, 14918-14926, 2016.
  • Sukanya Dhar, Anjali Lalithamabika, V. Kranthi Kumar and Srinivasan Raghavan, “Thermodynamic Modeling of W-C-O-H-S system: for controlled growth of WS2 atomic layers by True CVD”, ECS Trans.,77, Issue 2,49-59, 2017.

Patents and trade secrets

  • Adaptive erase voltage for reduction in erase time at elevated temperature (US Patent granted - 2020)
  • Reducing charge migration in a memory system (US Patent granted - 2022)
  • Resuming write operations after suspension (US Patent granted - 2022)
  • Memory circuitry and method used in forming memory circuitry (US Patent granted - 2022)
  • Selective deposition of metal (US Patent granted - 2022)
  • Selective Deposition of Oxide material and deposition assembly (US Patent granted - 2023)
  • End point detection of chamber clean (US Patent granted - 2025)

Timeline

Senior Process Engineer I, Metal Logic Team

ASM America
07.2023 - Current

Senior Process Engineer I, Corporate Research & Development

ASM International
05.2022 - 06.2023

Staff Engineer, Systems Team, cSSD

Micron
11.2021 - 10.2022

Staff Engineer, Device Team

Western Digital
04.2017 - 10.2021

M. Tech - Nanoscience, Centre for Nanoscience and Technology

Anna University

B. Tech - undefined

YPR college of Engineering, JNTU Hyderabad

Ph. D - Centre for Nanoscience and Engineering

Indian Institute of Science