Summary
Overview
Work History
Education
Skills
Accomplishments
References
Timeline
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LEE RAMOS

GILBERT,AZ

Summary

Dynamic Lead Validation Engineer & Lab Manager with extensive experience at Alphacore Inc., specializing in test program development for digital, analog, and mixed-signal modules. Achieved a remarkable 50% reduction in test time while effectively leading cross-functional teams. Demonstrates strong mentorship skills and deep expertise in Teradyne J750 HD & Uflex Systems within high-volume production environments. Committed to driving innovation and efficiency in engineering processes.

Overview

31
31
years of professional experience

Work History

Lead Validation Engineer & Lab Manager

Alphacore Inc.
Tempe, USA
08.2022 - Current
  • Validation and Radiation Test of Test Chip Ips including High-Speed, Low Power, Rad-Hard ADCs, DACs, DC-DC Converters, Rot-Angle Sensors, PLLs
  • Manages 2 Interns, 1 Engineer and 2 Technicians for Daily Test and Validation operations
  • Interfaces with test equipment, ATE and hardware vendors, assembly and foundry houses for existing and new products
  • Technical report generation of Silicon Validation reports per foundry and customer requirements
  • Develops test plans for conventional and radiation testing for Rad-Hard devices, including bench test development

Principal Engineer/Rel Lab Manager

Mercury Systems Inc.
Phoenix, USA
02.2019 - 08.2022
  • NPI of all DD3, DDR2, SRAMS, DRAMs and SDRAMs for MIL STD devices tested at Magnum Systems and Advantest HP93K
  • Test Program development for Characterization, Qualification and Initial production release for MIL-STD memory and Rad-hard memory devices
  • Test Program conversion of some memory legacy products from Megatest System and Teradyne J99x System to Magnum Test Systems
  • Sustaining of legacy Memory products tested on Magnum systems and Advantest HP93K
  • Oversees the Development and sustaining of Reliability Programs for Burn-In of DDR2/3 products on InCal’s Tahoe Burn-In Systems and AMT Burn In systems
  • Manages 2 Test Engineers, 2 Technicians and 1 Technical Operator at Reliability Laboratory in Phoenix
  • Interfaces with test equipment and ATE vendors, assembly and foundry houses for existing and new products
  • Works with manufacturing for any test engineering issues, procedures or improvements

Principal Test Engineer: 32-Bit MCU

Microchip Technology Inc.
Chandler, USA
09.2007 - 02.2017
  • Have strong experience in NPI, first silicon, and high-volume production ramp-up and sustaining.
  • Lead test program development efforts on Microchip’s 32-bit line of embedded high-performance microcontroller products (Dover and Las Vegas products of Microchip: PIC32MX350F, PIC32MX450F, PIC32MX470F, PIC32MX128F, PIC32MX256F, PIC32MX512F) for high-volume production (Die and Package Level).
  • Coordinated efforts with Design, Application, Validation, Marketing, and Product Engineering on product and manufacturing test issues.
  • Defined and developed test methodologies, test plans, and manufacturing flows to ensure optimum test coverage with the highest possible fault coverage on digital and mixed signal tests
  • Lead a cross-functional team on various tests, yields, and quality improvement projects.
  • Involved in pre-Silicon test verification on select embedded modules using Mentor Graphics ModelSim Simulation tools
  • Developed test cases for verification using assembly and C
  • Designed Final Test and Probe hardware for Teradyne J750/HD/Ultraflex and Advantest V93K ATE platform with optimized digital, SCAN capability, and mixed signal test circuitry in multisite production environment
  • Developed qualification, reliability and characterization test programs on Microchip 32-bit core, Flash, and mixed-signal embedded modules
  • Drove the successful post-silicon release-to-production (RTP) efforts of Microchip 32bit MCUs (Dover and Las Vegas)
  • Reduced test-time by at least 50% at RTP, thus reducing test cost
  • Provided mentorship and training to fellow test engineering counterpart abroad
  • Worked with manufacturing for any test engineering issue, procedures or improvements

Sr. Test Engineer – 16-bit MCU

Microchip Technology Inc.
Chandler, USA
01.2000 - 09.2007
  • Performed test program development, checkout, and production releases for the new 16-bit PIC MCU.
  • Developed and released characterization, reliability, and qualification test programs.
  • Involved in the new product development process, quality planning, and device validation.
  • Performed pre- and post-silicon validation on both ATE and test benches using oscilloscopes, power supplies, frequency generators, and parametric analyzers.
  • Identified and implemented yield, quality, and test cost improvement projects, and maintained necessary procedures and documentation for test production.
  • Worked with manufacturing for any test engineering issues, procedures, or improvements.

Sr. Test Product Engineer/Technical Consultant

Microchip Technology Inc.
Bangkok, Thailand
01.1998 - 01.2000
  • Responsible for the development and implementation of ATE test solutions for use in high volume production, characterization, and design validation
  • Closely interacted with design, architecture, application, marketing and product engineering in developing and improving capabilities to test, characterize and validate PIC products
  • Key expert in ATE test methodology development and test pattern content generation for full coverage of all modules within a microcontroller including digital logic, Flash, analog, DC parametric, functional and analog tests
  • Conducted technical training with Thai engineers on Microchip’s Test Methodology and Guidelines, LTX Trillium Programming and Teradyne J750 Programming
  • Continuously involved in test-product engineering issues and projects
  • Coordinated new product production releases between offshore test facility and US-HQ Test and Product Engineering

Test Product Engineer

Microchip Technology Inc.
Kaohsiung, Taiwan ROC
01.1996 - 01.1998
  • Leads and supports MCU 16-Bit Test Engineering Group in enhancing first pass yield and DPM reduction, directed manufacturing team in addressing long process cycle time, and collaborated with off-shore test facilities to address test and quality issues
  • Product owner of 16-bit baseline and midrange EPROM/EEPROM based microcontroller products
  • Performs new product qualifications, characterization, cold test eliminations, test-time reduction, yield improvement, failure analysis and other cost-saving and cycle-time reduction projects
  • Supports production and coordinate with other departments regarding test and product manufacturing issues
  • Supports products tested on LTX-Trillium Micromaster II, STS Credence, HP-Versatest V2102, Integra J750 Teradyne, and Schlumberger Fairchild Series 10/60/120
  • Coordinates and supports test-related and packaging issues with subcon companies in Bangkok and Shanghai

Test Engineer

AMI- Philippines (now ON Semi)
Paranaque, Philippines
01.1994 - 01.1996
  • Supported the Digital ASICs team in handling logic arrays and standard cell type CMOS structure products
  • Performed test program conversions from Sentry7/21 to LTX Trillium MMaster tester for multiple products
  • Responsible for qualification of products transferred from the Idaho headquarters to the test facility in the Philippines, including verification of testability and establishing requirements for manufacturability
  • Through continuous data and failure analysis, spearheaded cost-effective and process optimization efforts such as test time reduction, cold socket and burn-in tests elimination

Education

Bachelor of Science - Electronics and Communications Engineering

University of Santo Tomas
Manila, Philippines
01.1994

Skills

  • Test program development
  • Digital, Analog & Mixed-signal modules
  • NOR and NAND flash memories
  • RAMs / ROMs
  • Comparators, Op-Amps
  • USB, ADC, DAC, PLL
  • Internal clocks
  • Serial Digital Interfaces
  • Parallel digital interfaces
  • IIC, SPI, ICSP
  • PMP UART
  • Ethernet, CAN
  • DFT, SCAN, BIST, DMA
  • VBT, C/C, Assembly language
  • Perl, Python, STIL, and MATLAB
  • Verilog, VHDL
  • Teradyne J750 HD & Uflex Systems
  • Advantest HP93K and Nextest Magnum Systems
  • Oscilloscope Signal generators, Spectrum Analyzers
  • AWG, Logic analyzers, Diligent systems, Arduino
  • Test handlers, Wafer sorters

Accomplishments

  • One of the 2 Test Engineers that built the Test Engineering expertise in Microchip Technology – Thailand facility which now has more than 50 highly skilled test engineers in more than 6 BU.
  • One of the 2 Test Engineers that helped build the R&D Test Engineering group in Microchip Technology Inc. Philippines which now houses more than 50 highly skilled test engineers.
  • Lead an RTP of Microchip Technology’s 2nd MCU-32 bit product line which became the best general purpose, low-cost and high-performance MCU 32bit.

References

Available upon request

Timeline

Lead Validation Engineer & Lab Manager

Alphacore Inc.
08.2022 - Current

Principal Engineer/Rel Lab Manager

Mercury Systems Inc.
02.2019 - 08.2022

Principal Test Engineer: 32-Bit MCU

Microchip Technology Inc.
09.2007 - 02.2017

Sr. Test Engineer – 16-bit MCU

Microchip Technology Inc.
01.2000 - 09.2007

Sr. Test Product Engineer/Technical Consultant

Microchip Technology Inc.
01.1998 - 01.2000

Test Product Engineer

Microchip Technology Inc.
01.1996 - 01.1998

Test Engineer

AMI- Philippines (now ON Semi)
01.1994 - 01.1996

Bachelor of Science - Electronics and Communications Engineering

University of Santo Tomas

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LEE RAMOS