LORA NISHALINI ANTHONY
Kulim,Malaysia
Summary
A skilled Technical Leader with 18 years of experience in Intel, leading multiple First-of-Kind equipment, factory start-up and ramps. Result-oriented project lead, with experience in developing, implementing, and supporting equipment with a steep ramp. Experienced in building high performance and engaged teams. Comfortable with ambiguity and able to thrive in a face-paced environment.
Overview
19
19
years of professional experience
Work History
Senior Technical Lead
Intel Technology
08.2018 - Current
- Led the KMDSDP SDX startup and ramp, IQ TPT optimization, NTI and operation excellence
- Responsible to identify and fix systemic issues in Die Sort
- Led multiple task forces, Drive continuous improvement projects and methodology changes in the Virtual Factories for cost savings/avoidance, module availability improvements and product ramps
- Co-developed and conducted L4 advanced troubleshooting training to enhance factory capability, eliminating FSE within 2 years of factory startup, with $31M savings
- Enabled Intel to perform cell IQ and hardware upgrades, with $1.6M savings
- Partnered with IMR and demonstrated 8 SDX chiller repairs internally amounting to $2.6M savings and enabled Helium usage reduction amounting to $1.5M saving
- Provide remote assistance to the virtual factories for issue debugging and resolution
- Lead factory technical development programs for technical leads
- Member of the ATM Technical Steering Council and Malaysia Site leadership program.
Technical Lead
Intel Technology
07.2015 - 08.2018
- Supported the development and validation of the HDMx equipment and Thermal Actuation Pan in STTD Chandler, Arizona
- Influenced and collaborated with TD to design and validate the Gen 2 HDMx Server Actuation Pans
- Identified major firmware bugs, hardware issues and fixes
- Managed the schedules and project timelines to intercept sustainable and user friendly changes
- Designed the HDMx Lifter, service cart and test bench to support collateral transport, troubleshooting and validation
- Developed the HDMx Thermal and Actuation Pan training material and trained Engineers, Technicians and developed other trainers in TD/VF
- Supported the HDMx startup and ramp in Intel Vietnam Vietnam Assembly/Test VNAT, Intel Kulim Kulim Assembly/Test KUAT and Intel China Chengdu Assembly/Test CDAT
- Resolved HFE leaks and stain on die seen in extreme cold testing temperatures
- Established as a HUB to perform remote and on-site troubleshooting support for the ATM factories.
Equipment and Process Engineer
Intel Technology
06.2005 - 07.2015
- Responsible for timely deployment, installation, and qualification of test module to support product or package startup and ramp
- Started up and ramped FOK mixed-signal Teradyne testers, CMT testers and Extreme handlers
- Established new sustaining and maintenance process for the HDMT Actuation Pan, with HDMT being a FOK tool designed by Intel and leading the first site startup and ramp
- Developed the HDMT Thermal and Actuation Pan training material and trained Engineers, Technicians and developed other trainers in TD/VF
- Enabled cold testing on the HDMT by resolving condensation issues in the tool and enabling the chiller to support cold testing condition
- Led multiple quality improvement projects to address stain on die, die crack, handling time, thermal failures, heater burns, HFE valve reliability issues
- Supported the startup and ramp of the HDMT equipment in Intel Vietnam Vietnam Assembly/Test VNAT and Intel Kulim Kulim Assembly/Test KUAT.
Education
Bachelor of Science - Electrical And Electronics Engineering
University Tenaga Nasional
MalaysiaSkills
- Cross-functional task forces
- Stakeholder Management
- Strategic Planning
- Advanced Troubleshooting
- Equipment Training
- Project Management
- Data Analysis
- Leadership
- Team Mentoring
- Flexibility and Adaptability
Passions
Reading, Innovating
Languages
Malay
Native or Bilingual
Tamil
Professional Working
English
Full Professional
Additional Information
6 Technical Publication related to Thermal Solution and HDMT
Timeline
Senior Technical Lead
Intel Technology
08.2018 - Current
Technical Lead
Intel Technology
07.2015 - 08.2018
Equipment and Process Engineer
Intel Technology
06.2005 - 07.2015
Bachelor of Science - Electrical And Electronics Engineering
University Tenaga Nasional
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