Experienced semiconductor leader with 15+ years of expertise in driving innovation across advanced technologies, with significant expertise on EUV lithography. Skilled in leading large teams to develop next-generation semiconductor processes for logic, chiplet packaging, and AI hardware. Proven ability to manage strategic R&D initiatives, build strong partnerships, and deliver groundbreaking results in collaboration with industry and government stakeholders. Adept at defining technology roadmaps, optimizing processes for advanced nodes, and advancing interconnect yield.