Summary
Overview
Work History
Education
Skills
Hobbies
Accomplishments
Timeline
Generic

Mario Evaldo Arenas Macias

Krakow,Poland

Summary

Driven by over 14 years of experience in the Electronic industry, with a specific focus on Automotive Powertrain, Hi-Fi Audio systems, High-performance computing systems, and Digital cockpit electronics, I am an accomplished Engineering Leader. I am dedicated to fostering team success by exemplifying a strong work ethic, consistently delivering top-quality results, and demonstrating a clear understanding of company goals. Committed to personal and professional growth, I am motivated to continually expand my knowledge and excel within the electronic industry.

Overview

14
14
years of professional experience

Work History

Director Hardware Project Lead

HARMAN
10.2023 - Current
  • Responsible for overseeing and coordinating all North America activities related to the successful delivery of hardware products or solutions within a company or organization.


  • Lead a team of 6 direct reports responsible for overseeing and coordinating all hardware delivery activities across electrical, mechanical, and validation engineering teams, supporting NA customers.
  • Manage cross-functional program execution to ensure on-time delivery of complex hardware products and solutions while meeting quality, cost and performance targets.
  • Collaborate closely with engineering teams to define product requirements, roadmaps, and development plans aligned with business goals.
  • Drive program governance and communicate status, risks, and issues to executive management.
  • Mentor and develop a high-performing team focused on operational excellence and continuous improvement.
  • Define KPI's and Process execution for HW PM leaders.

Global Electrical Engineering Director

Aptiv
04.2021 - 10.2023
  • Global Leader for a group of +250 Electrical Engineers that support programs globally distributed in 3 different geographical regions (North America, Europe, India). Supporting ALL product lines (Perception systems-vision/radars, Compute-gateways/compute/Servers/Infotainment, ECU's-Zone Controllers/ADAS/BCM/Interior Electronics)
  • Current goals focused on restructuring the organization to be flexible, global, and homologated engineering centers.
  • Alignment of global initiatives across Hardware organizations (Electrical + Mechanical)
  • Enabled, Growth and transition of business and opportunities to re-structure organization from HCC to BCC sites.
  • Defined skillset plan and development of capability and capacity of different sites.
  • Provided technical leadership for the company to effectively steer strategic plans and future projects
  • Technical approver for new engineering business, main approver during gate reviews for Electrical discipline.
  • Responsible of execution multi/billion dollar businesses under cost-effective metrics for resources and expenses.
  • Managed and distribute forecasts and budgets for new businesses and critical task
  • Reviewed project goals and objectives on a monthly basis with the project manager and design team.
  • Checked design compliance with product specifications and standards requirements.
  • Created a database and pipeline for implementing semiconductor shortage, controlling more than 100 redesigns in less than 9 months.
  • Demonstrated expertise in integrating advanced electronic components, sensors, and architectures to deliver seamless user experiences and enable sophisticated ADAS functionalities for enhanced vehicle safety.
  • Expertise in navigating complex safety requirements across multiple levels, from concept development to validation, delivering robust and reliable solutions.

Hardware Engineering Manager

Visteon Corporation
05.2019 - 04.2021
  • Head of hardware engineering team (+40 engineers). Responsible for growth and execution.
  • Defining schedules and driving projects to successful completion observing schedules defined. Schedule alignment from Engineering Groups.
  • Identify and assign clear ownership of project tasks to hardware team members and drive the timely execution of each team member.
  • Recommend internal and external process improvements.
  • Ensuring cross-functional alignment.
  • Products include ADAS, Display, Clusters, Audio, Infotainment, and Battery Management Systems.
  • Define people development plans for technical career paths through close and formal coaching.
  • Responsible of suggest and implement VAVE opportunities in every single product.
  • Accountable contact for engineering execution

Principal Hw Engineer

Harman International
10.2016 - 05.2019
  • Hardware Design Lead, responsible for design definition of the entire hardware product concept (Schematic, architecture, PCB guidance, and BOM definition).
  • Develop GLOBAL core process of the hardware development cycle in coordination with different regions (North America, Europe, China) to standardize tasks and best practices as an example: BOM compare tools, DFMEA baseline, Lessons Learn.
  • Leader for VAVE North America for GM and Toyota. Achieving savings above $8M USD.
  • People manager for Hardware team Queretaro R&D center (Oct 2016 - July 2017). I helped to grow the team from 5 to 14, promote processes and goals that helped to improve the quality of the deliverables and the solutions, generating a collaborative environment that allowed to increase the number of projects that the engineers are involved in and the number of goals achieved.
    Under this role, I was actively working with the Director of the site to establish the growth and the strategy to develop the engineering team, covering the needs of the company and the customers

Sr. Hardware Design Engineer

Harman International
11.2015 - 09.2016
  • Hardware Design Leader for Toyota products, responsible for design definition(schematic, power supply, components and architecture), from RFI to SOP.
  • Performed and review worst cases for hardware items
  • Coordinate layout activities and lead board definition, solve and review signal integrity issue items
  • Perform hardware validation and proof of concept activities
  • Leader in Mexico for VAVE activities. Yearly participation in the global forum for best practices and ideas bringing new savings to the company.

Hardware Lead

Intel Corp
06.2013 - 10.2015
  • Responsible for the platform definition and feasibility study, schematic capture of complex high-speed multilayer circuit boards, and generation of all output materials required for board layout
  • Designing high-speed logic and/or circuits using programmable devices
  • Performing system-level design and simulation analyzing system timing and signal integrity
  • Collaborate with PCB layout designers for layout and checking board files for correctness
  • Mentoring junior engineers
  • Responsible for multi-site collaboration coordination with other team leaders, PCB layout designers, signal integrity engineers, board vendors and Intel validation teams
  • Link to product owned now in the market: https://www.intel.la/content/www/xl/es/products/servers/accelerators.html

Hardware Engineer

Continental Automotive GmbH
03.2012 - 06.2013
  • Design and develop analog/digital circuit for automotive applications
  • Select and test new electronic components
  • Perform WCA, DMFEA ensuring design compliance to customer specification
  • Follow continuous improvement activities regarding supplied components, design, and manufacturing processes
  • Support the Program Managment at RFQ phase and new business through suggestion of technical solutions and effort assumptions

Product Engineer

Continental Automotive GmbH
06.2010 - 03.2012
  • Provide support to projects in series production, support to warranty returns, based on detailed knowledge for design and operation of products
  • Serve as a technical link between Design-Production-Client products responsible for decision-making
  • Provide preventive and corrective actions for Warranty returns.
  • Lead technical discussions with the customer for warranty returns
  • Develop 8D's documents and statistical data to support evidence
  • Green Belt project to identify $500k in savings to reduce internal warranty returns.

Education

Master of Science - Automotive Engineering

Instituto Tecnologico Y De Estudios Superiores De Monterrey
Puebla, Mexico
02.2023

Bachelor of Science - Electrictronics And RD , Embedded Systems

Instituto Tecnologico Y De Estudios Superiores De Monterrey
Puebla, Mexico
2010

Skills

    Soft Skills

  • Team leadership
  • Troubleshooting and problem resolution
  • Cross-functional collaboration
  • Quality assurance
  • New employee mentoring
  • Excellent communication skills
  • Risk management
  • Accountable management
  • Out of the box thinker
  • Technical Skills

  • Schematic tools (Mentor, Cadence, Altium, Zuken)
  • Verilog (FPGA, CPLDs)
  • Analog and digital design
  • Signal integrity, Power Integrity
  • DFM
  • DFMEA
  • EMC guideline and best practices
  • WCCA
  • Hardware Validation Plan
  • Equipment acquisition development
  • 8D/5Why's/FTA/Fishbone

Hobbies

Read science books or fiction novels, DIY Arduino and FPGA projects, Play video games

Accomplishments

    Visteon Corporation:

  • Office startup activity for engineering execution. Defined needs of Hardware Development group in Queretaro. Recruiting a +40 engineers team in less than a year after arrival.
  • Support local team with high management sponsorship to develop Intellectual property. Resulting in a new global accountable skill located in Mexico and a ASIC development .
  • Coordinate +14 projects running in parallel supporting supervisors to coordinate activities avoiding overload of people.
  • Implementation of multiple workarounds to remove roadblocks during Covid19 crisis, avoiding a reduction of the effectivity and efficiency of the operation.
  • Brand ambassador, extending Visteon importance across universities, leading efforts to exchange knowledge synergy.
  • Develop technical path plans for each engineer in the group.
  • Develop a group mindset for accountable and proactive engineering execution.
  • Harman International

  • VAVE savings identification and implementation achieving up to $10M for 3 products for 2 customers (Toyota/GM).
  • Main contributor and leader to identify root cause and counter measures to solve GR1 escalation issues with Toyota.
  • Implementation of a BOM tool to check and verify discrepancies between manufacturing releases and Schematic BOM.
  • Definition of Global process for HW design activities such as Schematic release, validation, bench testing, HW/SW interactions.
  • Global process owner and trainer for DFMEA. I've developed and release the DFMEA flow diagram for execution and compliance of the task.
  • Development of a HiFi Audio Amplifier class H in a FPGA presented as a possible solution for unbranded audio.
  • Owner of the first HW program to do "DV and done" based on the early identification of failures and quick response coordinating the cross-functional team to support and identify failures.
  • Low cost FPGA development for high performance power supply to provide a Class-H solution to a current amplifier architecture.
  • Intel Co.

  • Implementation of new debug interface for a high performance PCI graphics card.
  • Achieving of platform power ON without blue-wires
  • Quick resolution by implementing quality tools
  • The project that was developed can be foun the commercial site of intel: https://www.intel.la/content/www/xl/es/products/servers/accelerators.html
  • As a HW tech lead I've coordinated the validation team in Taiwan to complete validation in time and review and approve results.
  • Suport CPLD solution for platform sequencing development.
  • Continental

  • Development of a new and automated 4x4 ECU bench test to improve warranty return analysis time.
  • Development of a DFSS project, achieving $500K in savings by implementig new test excecutions in the testplans.
  • Reduction of warranty returns internal and external, by implementing new test and auditing current processes.
  • Bench prototype development of a quasi-resonant power supply.

Timeline

Director Hardware Project Lead

HARMAN
10.2023 - Current

Global Electrical Engineering Director

Aptiv
04.2021 - 10.2023

Hardware Engineering Manager

Visteon Corporation
05.2019 - 04.2021

Principal Hw Engineer

Harman International
10.2016 - 05.2019

Sr. Hardware Design Engineer

Harman International
11.2015 - 09.2016

Hardware Lead

Intel Corp
06.2013 - 10.2015

Hardware Engineer

Continental Automotive GmbH
03.2012 - 06.2013

Product Engineer

Continental Automotive GmbH
06.2010 - 03.2012

Master of Science - Automotive Engineering

Instituto Tecnologico Y De Estudios Superiores De Monterrey

Bachelor of Science - Electrictronics And RD , Embedded Systems

Instituto Tecnologico Y De Estudios Superiores De Monterrey
Mario Evaldo Arenas Macias