Maxwell Ylitalo
Phoenix,AZ
Summary
Experienced process engineer in advanced semiconductor manufacturing, with 3+ years of experience specializing in chemical mechanical planarization. Committed to process optimization to improve throughput, and reduce costs without sacrificing quality. This standard is achieved through skilled use of various engineering practices including statistical process control, root cause analysis, and cross-functional collaboration.
Overview
6
6
years of professional experience
Work History
CMP Process Engineer
TSMC Arizona
Phoenix, AZ
01.2023 - Current
- Managed test wafer production, and shipment from Taiwan to Arizona for use in new tool qualification.
- Prepared production management systems during fab start-up to match the strict process control done in Taiwan.
- Collaborated with the facility and equipment engineers in the first installation of new process, and metrology equipment in TSMC AZ.
- Performed experiments to analyze various production ramp-up risks.
- Performed weekly inspection of the slurry delivery systems during fab construction to verify construction quality.
CMP Process Engineer
TSMC
Tainan, Taiwan
02.2021 - 12.2022
- Analyzed production data through statistical process control (SPC) to control daily performance indexes.
- Tested and implemented raw material changes in the process tools to increase efficiency, and decrease cost.
- Tested new process, and metrology tools after being installed to verify tool performance, and quality met production standards.
- Regularly performed root-cause analysis to determine the source of defects, and implemented changes to minimize future defect risk.
Process Research Lab R&D Intern
3M Company
St. Paul, MN
06.2019 - 08.2019
- Created a novel coating method for the continuous application of pressure sensitive adhesives onto low energy substrates
- Performed lab-based experiments to measure adhesion and surface tension changes under various substrate coating conditions.
Product Development R&D Intern
3M Company
St. Paul, MN
05.2018 - 08.2018
- Designed and tested new adhesives and hooks for next generation Command products
- Collaborated with the marketing team to better understand customer needs.
Education
Bachelor of Science in Chemical Engineering -
UNIVERSITY OF WISCONSIN - MADISON
12.2020
Skills
- Advanced manufacturing
- Statistical process control (SPC)
- Root cause analysis
- Process qualification
- Yield improvement
- Defect tracing and analysis
- Six Sigma principles
- Process technician training
- Raw material procurement
- Excellent written and verbal communication skills
- Ability to work with a global team
- Experienced working overseas
- Microsoft Excel
- JMP
- MATLAB
Awards
- Patent: US2017/0306369 "A method for surfactant enhanced enzymatic hydrolysis"
- Int. Science and Engineering Fair (ISEF) Second Grand Award
- Edison Innovation Award
Activities
- UW Madison Low Brass Ensemble
- Sub-deacon in the Armenian Apostolic Church
Languages
English
Native/ Bilingual
spanish
Limited
Timeline
CMP Process Engineer
TSMC Arizona
01.2023 - Current
CMP Process Engineer
TSMC
02.2021 - 12.2022
Process Research Lab R&D Intern
3M Company
06.2019 - 08.2019
Product Development R&D Intern
3M Company
05.2018 - 08.2018
Bachelor of Science in Chemical Engineering -
UNIVERSITY OF WISCONSIN - MADISON
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