Mohan Yasodharababu
IC Technology Development Packaging Engineer
Phoenix,AZ
Summary
A mechanical engineer demonstrated the ability to work on projects with cross-functional teams (electrical, biomedical) from design to product using creative concepts and problem-solving techniques. Possess 7 + years of academic research/industry experience in performing structural analysis using FEA, material characterization, design improvement and validating with experiments. Achieved a 6+ journal publication in the area of Experimental Mechanics | Numerical Analysis, Optimization, and Simulation Mechanical Modeling and Simulation | Micro-Nano Scale Material Characterization | Equipment Development | Solid Mechanics
Overview
13
13
years of professional experience
Work History
Packaging Research & Development Engineer
Intel Corporation
Chandler, AZ
10.2021 - Current
- Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units
- Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages
- Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design
- Conducts tests and research on basic materials and properties
- Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance
- Provides consultation concerning packaging problems and improvements in the packaging process
- Responds to customer/client requests or events as they occur.
Graduate Research Assistant (PhD)
University of Arkansas
Fayetteville, AR
08.2016 - 07.2021
- Conducted in-situ experiments using AFM to probe the mechanical properties of biomaterial
- Designed and fabricated the immersed ultrasound experimental setup (signal generator, transducer, fixtures, DAQ) to examine the elastic wave propagation in 3D printed biomaterial
- Developed a multiscale model to predict the mechanical behavior of cell-substrate interface using FEA (ANSYS) and Molecular Dynamics (LAMMPS), and collaborated with the Forsyth Institute (Harvard Dental School) to predict failure strength in enamel microstructure using the multiscale model.
R&D Engineer Intern
ANSYS
Pittsburgh, PA
05.2019 - 08.2019
- Test and validate the new feature nonlinear adaptivity in finite element analysis meshing to resolve convergence issues with high element distortions, for the large deformation structural and coupled problems.
R&D Mechanical Engineer
Lennox International
Chennai, TN
06.2015 - 08.2016
- Supported the commercial HVAC business unit in a team environment for NPD, prototype evaluation, and field failures analysis, with the aim of improving the design based on FEA and experimental testing
- Key projects: ASTM packaging, Transportation test procedures, Modal testing and Analysis on HVAC units, Thermal analysis on the PCB electronic boards.
Material Research Intern
Karlsruhe Institute of Technology
Karlsruhe, Germany
05.2015 - 06.2015
- Supported a microstructure research team in measuring electrical resistivity and deflection from actuators with a scanning electron microscope (SEM), as well as gaining clean room expertise in nano fabrication
- Using MATLAB code, reduced errors in analyzing thermal and displacement images of smart materials using the Digital Image Correlation (DIC) technique.
Graduate Research Assistant
Indian Institute of Technology Madras
Chennai, TN
01.2013 - 05.2015
- Developed piezoelectric test setup to simultaneously measure charge and displacement (strain) of 1-3 piezocomposites using sawyer tower circuit, laser vibrometer and high voltage amplifier
- Fatigue experiments are performed on 1-3 piezocomposites, in order to understand the degradation phenomena due to various range in frequency, amplitude of electric fields at various ambient temperature.
Senior Project Assistant
National Institute of Ocean Technology
Chennai, TN
07.2012 - 12.2012
- Conducted experiments to measure the retained strength under hydrostatic pressure for the syntactic foams used for deep-sea packaging applications; new design has improved the energy absorbing capacity by 30%.
Mechanical Design Engineer Trainee
Rane TRW Steering Systems
Chennai, TN
01.2012 - 05.2012
- Mechanical design and optimization of lower control arm in front suspension system by design of experiments and validated using rotating beam test; new design has reduced 10% cost in manufacturing.
Education
Doctorate (Ph.D.) - Mechanical Engineering, Engineering Mechanics
07.2021
- Thesis: Influence of Extracellular Matrix Stiffness and Topography on Neuronal Cell Behavior and Neurite Outgrowth.
- GPA: 3.6/4.0
Master's (M.S) - Applied Mechanics, Solid Mechanics
05.2015
- Thesis: Piezoelectric Material Characterization Under Electrical, Mechanical & Thermal Fatigue Loading on 1-3 Piezocomposites for Sensor and Actuator Applications.
- GPA: 3.7/4.0
Bachelor's (B.S) - Mechanical engineering, Engineering Design
05.2012
- Thesis: Mechanical Design and Optimization of Suspension Systems (company: RANE Madras Ltd)
- GPA: 3.7/4.0
Skills
- Modeling and Simulation
- CAD
- SOLIDWORKS
- Autodesk Inventor
- FEA Software
- ANSYS
- Workbench
- Sherlock
- ABAQUS
- COMSOL
- CFD
- Thermal
- ANSYS Fluent
- ICEPACK
- Programming
- MATLAB
- Python
- HPC Cluster
- Linux TCL/TK scripting
- Design for Manufacturability (DFM)
- GD&T
- Statistical Tolerance Analysis
- Design of Experiments (DOE)
- FMEA
- Data Analysis & Interpretation
- Statistical Data Analysis
- Minitab
- Data acquisitions (DAQ)
- Hardware (NI)
- LabView
- Experimental Lab Equipments
- In-Situ
- SEM
- XRD
- AFM
- Nano-indentation
- Material Testing
- Uni-axial
- Bi-axial
- Bending
- Fatigue
- Packaging (drop)
- Friction
- Non Destructive Testing ( Ultrasound transducers)
- Piezoelectric test setup
- Structural health monitoring
- Oscilloscopes
- Spectrum analyzer
- Signal generator
- Strain Measurements
- Laser Interferometer
- Vibrometer
- Strain gauge
- Accelerometers
- Infrared Camera
- PID controller
- Image processing
- Digital Image Correlation (DIC)
- Fixture Fabrication
- Electro-Mechanical
- Thermal Miniature
- Ultrasound Transducers Mount
Accomplishments
- Obtained research assistantship for the tenure of Ph.D. from NSF, USA
- Awarded Celebrate Cool idea in Lennox International.
- Obtained research Assistantship for the tenure of master's from Ministry of HRD, Gov. of India.
Professionalwebsite
- Https://www.linkedin.com/in/mohan-yasodharababu/
- Https://orcid.org/0000-0002-3036-090X
Technicalskills
SOLIDWORKS, Autodesk Inventor, ANSYS, Workbench, Sherlock, ABAQUS, COMSOL, ANSYS Fluent, ICEPACK, MATLAB, Python, HPC Cluster, Linux TCL/TK scripting, True, True, True, True, MATLAB, Minitab, hardware (NI), LabView, SEM, XRD, AFM, Nano-indentation, Uni-axial, Bi-axial, Bending, Fatigue, Packaging (drop), Friction, Non Destructive Testing ( Ultrasound transducers), True, True, True, Laser Interferometer, Vibrometer, Strain gauge, Accelerometers, Infrared Camera, PID controller, Digital Image Correlation (DIC), Electro-Mechanical, Thermal Miniature, Ultrasound Transducers Mount
Publications
- Experimental and theoretical investigation of temperature-dependent electrical fatigue studies on 1-3 type piezocomposites, Yasodharababu, M., Arockiarajan, A., American Institute of Physics (AIP) Advances, 6, 035311, 2016, 10.1063/1.4944582
- Modeling and experimental characterization on fatigue behaviour of 1-3 piezocomposites, Yasodharababu, M., Jayendiran, R., Arockiarajan, A., Proc.SPIE, 2015, 10.1117/12.2082698
- A multiscale investigation of mechanical properties of bio-inspired scaffolds, Gu, Y., Yasodharababu, M., Nair, A.K., Computer Methods in Biomechanics and Biomedical Engineering, 21, 703-711, 2018, 10.1080/10255842.2018.1512593
- Effect of grain size on piezoelectric, ferroelectric, and dielectric properties of PMN-PT, Pramanik, R., Sahukar, M.K., Yasodharababu, M., Praveenkumar, B., Sangawar, S.R., Arockiarajan, A., Ceramics International, 45, 5731-5742, 2019, 10.1016/j.ceramint.2018.12.039
- A Multiscale Model to Predict Neuronal Cell Deformation with Varying ECM Stiffness and Topography, Yasodharababu, M., Nair, A.K., Journal of Cellular and Molecular Bioengineering, 13, 229-245, 2020, 10.1007/s12195-020-00615-2
- Interaction Energy Between Neuronal Cell Receptors and Peptoid Ligands, Yasodharababu, M., Servoss, S.L., Nair, A.K., Journal of Biomechanics, 110381, 2021, 10.1016/j.jbiomech.2021.110381
- A Multiscale investigation to Predict Neurite Outgrowth Dependence on ECM Stiffness and Topography, Yasodharababu, M., Nair, A.K., Journal of Biomechanics, 110897, 2021, 10.1016/j.jbiomech.2021.110897
- Influence of Extracellular Matrix Stiffness and Topography on Neuronal Cell Behavior and Neurite Outgrowth, Graduate Theses and Dissertations, https://scholarworks.uark.edu/etd/4184, 2021
Timeline
Packaging Research & Development Engineer - Intel Corporation
10.2021 - Current
R&D Engineer Intern - ANSYS
05.2019 - 08.2019
Graduate Research Assistant (PhD) - University of Arkansas
08.2016 - 07.2021
R&D Mechanical Engineer - Lennox International
06.2015 - 08.2016
Material Research Intern - Karlsruhe Institute of Technology
05.2015 - 06.2015
Graduate Research Assistant - Indian Institute of Technology Madras
01.2013 - 05.2015
Senior Project Assistant - National Institute of Ocean Technology
07.2012 - 12.2012
Mechanical Design Engineer Trainee - Rane TRW Steering Systems
01.2012 - 05.2012
University of Arkansas - Doctorate (Ph.D.), Mechanical Engineering, Engineering Mechanics
Indian Institute of Technology Madras - Master's (M.S), Applied Mechanics, Solid Mechanics
Anna University - Bachelor's (B.S), Mechanical engineering, Engineering Design