Olivia Leng
Lowell,MA
Summary
Extensive experience performing quality work in a fast paces electronics manufacturing environment. A hardworking, versatile, flexible individual, who learns quickly, works accurately and efficiently and possesses an aptitude for electronics.
Overview
23
23
years of professional experience
Work History
Quality Management/Team leadership/QA/QC/Source Inspector
Assurance Technology Corporation
10.2016 - Current
- Inspection of high reliability space and aerospace electronics circuit card assemblies, modules, flight cable assemblies and units to the requirements of J-STD-001 and related specifications including NASA-STD-8739.1B Polymeric Application
- Conformal coating inspection under UV/black light, inspection of a component’s bonding/staking for voids, debris and defects follow by NASA and Space Addendum
- Oversee the development, implementation, review and maintain document registers and documentation
- Ability to manage multiple tasks and meets deadlines
- Help drive continuous improvement activities within the inspection department
- Ability to travel out to source inspect aerospace level mechanical components and assemblies including welded and machined parts for compliance with industry and customer specifications
QA/QC/Team-lead/Source Inspector
Columbia Tech
09.2014 - 05.2016
- Performed working on SMT line with touch-up/rework soldering and inspection process including workmanship
- Worked with AOI and SMT operators to ensure quality of line procedures
- Use non-conformance form when entering data into the system in regards to inspections
- Worked with digital caliper for measurements follow by engineering’s and customer’s drawings, use multimeter to check the value of components and perform continuity on cable harnesses
- Verified corrective actions on a prototype board when working on a first piece/first article
- Prepare products and related paperwork for presentation to customer and during source inspection
- Ensure customer purchase order requirements have been met and authorize shipment of products
- Performed in-process and final inspection of PCB'S to IPC-A-610
- Capable of writing a C of C's certificate of Rohs compliance for each shipment required by the customer
QA/QC Inspector
MC Assembly
11.2013 - 08.2014
- Utilized microscope to perform inspection and locate defects
- Experienced with AOI (Automated Optical Inspection) when inspecting the incoming process
- Inspected BGA under microscope for shortages, opens and any exposed to the circuit board before scanning into an X-ray machine
- Performed rework on a QFN’s and BGA components with hot air gun after finding defects through inspection
- Conduct mechanical, dimensional and visual inspections of work in-progress, first article, and finished parts and components using typical inspection devices and methodologies
QA/QC Inspector
Textron
04.2012 - 10.2013
- Inspected class 3 military boards under a microscope
- Worked with calipers, micrometers, multimeters, radius gauges, pin gauges and thread gauges
- Mechanical inspection on piece parts, aluminum plates, touch-up chromate and chassis
- Work with production Surface Mount (SMT) and AOI operators to ensure any defects in troubleshooting
- Perform incoming inspection from raw boards, first article/first piece and in process to final inspection
- Responsible for the incoming inspection and final inspection of PCB assemblies according to schematics and other quality documents
- Performed SMT and THT inspection and was introduced to mechanical/EM inspection processes toward end of contract
- Ability to write NMR’s on any defects for further review/rework
QC Inspector/Electronic Assembly Specialist
Circuit Technology
04.2010 - 03.2012
- Proficient with Final QC Inspection of Electronic SMT and Through-hole PCBs
- Inspections of an X-ray interface for any opens/void on a BGA’s components
- Responsible for QC Inspection of SMT and Through-hole PC boards for bridges, solder-balls, misplaced, misaligned and damaged components, including inspecting for polarities and color codes
- All assembly procedures were performed from instruction of blueprints, schematic and ECOs
- Proficient with Final Inspection of complex electronic components and boards
- Labeled failures and logged the information into computer database
QC Inspector/Team Leader
Aware Inc.
03.2007 - 12.2009
- Inspected populated PC boards according to blueprints, schematics, and ECOs
- Proficient in SMT and Through-hole inspection of complex PC boards and assemblies
- Responsible for all phases of electronic assembly of SMT, run test and inspect Through-hole and Fine-pitch soldering
- Performed Inspection of wires, subassemblies and components according to written procedures
- Performed all SMT, Through-hole soldering, Rework, Repair, and Touch-up according to specs
- Followed all micro assembly procedures and ECOs
- Responsible for all electronic assembly according to blueprints, schematics and BOMs
- Performed electronic testing of PCB’s, entering information into computer software
- Capable of point to point assembly; packing and unpacking boards, scan devices, inspect RMA’s and rework/repair
QC/Electronic Assembly Specialist
STC
05.2006 - 03.2007
- Performed SMT, Through-hole and Fine Pitch Soldering under microscope, including all Rework, Repair, SMT and Thru-Hole Solder Touch-up
- Responsible for notifying and involving production line in manufacturing, prepping Engineering to build PC boards
- Responsible for Mechanical assembly using hand and power tools according to written and verbal instructions
- Responsible for building subassemblies according to blueprints, wiring subassemblies into boxes including all point to point wiring; system integration
- Performed Rework according to ECO’s wiring, use any kind of hand, air and power tools
- Inspection of a component placement on PCB’s by reading blueprints, work in a clean room and following work orders
- Kit inspection, inspecting die components using vacuum pens on a 10x microscope during processing in the clean room environment
- Performed Touch-up on boards and final inspection of the assembly
- Utilized various types of testing equipment
- Helped with final production and packaging as needed
QC Inspector/Electronic Assembly Specialist
Micro Semi
01.2003 - 04.2006
- Responsible for all micro assembly of electronics, including Die mount, bond pull, plasma clean, die attach and wire bonding
- All worked conducted according to BOMs, written and verbal instructions and ECOs
- Inspected wafers with all types of epoxies
- Use of microscope for soldering and inspection up to 8/hrs daily
- Worked with Orthodyne machine and silver epoxy
- Worked from routing orders and following Engineering procedures to remove the excess flux for V6000 PCMCIA slots
QC/Micro-Electronics Assembly Specialist
Vectron International
03.2002 - 01.2003
- IPC-A-610 Certified
- Responsible for all soldering of SMT and Through-hole assemblies including Electro Mechanical Assembly of precision electronic parts
- Performed various phases of Rework, Repair, Fine-pitch and SMT soldering using microscope
- Gathered alignment measurements for preteen hybrids
- Responsible for sub-assembly integration, as well as package assemblies, lid seals and wire bond
- Inspect internal components for wire bond attachment under microscope and operate an automated system for monitoring
- Built and tested on temperature audits, products, including; chip resisters, ICs and various piece parts
- Performed mechanical assembly using hand, air, and power tools
Education
Associate In Electronics Engineering Technology -
Middlesex Community College
Lowell, MA05.2003
High School Diploma -
Lowell High School
Lowell, MA06.2001
Skills
- Rework/Repair Techniques
- Electrical Mechanical Inspection
- Incoming/Receiving Inspection
- Final Inspection
- Geometric Dimensions and Tolerances (GD&T)
- Communication Skills
- ISO9001 Certification
- IPC-A-610 Certification
- J-STD-001D Certification
- Space Addendum Certification
- Polymeric/Bonding/Staking Certification
- Microsoft Office Knowledge
Timeline
Quality Management/Team leadership/QA/QC/Source Inspector
Assurance Technology Corporation
10.2016 - Current
QA/QC/Team-lead/Source Inspector
Columbia Tech
09.2014 - 05.2016
QA/QC Inspector
MC Assembly
11.2013 - 08.2014
QA/QC Inspector
Textron
04.2012 - 10.2013
QC Inspector/Electronic Assembly Specialist
Circuit Technology
04.2010 - 03.2012
QC Inspector/Team Leader
Aware Inc.
03.2007 - 12.2009
QC/Electronic Assembly Specialist
STC
05.2006 - 03.2007
QC Inspector/Electronic Assembly Specialist
Micro Semi
01.2003 - 04.2006
QC/Micro-Electronics Assembly Specialist
Vectron International
03.2002 - 01.2003
Associate In Electronics Engineering Technology -
Middlesex Community College
High School Diploma -
Lowell High School
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