PRAHLAD KULKARNI

• Was responsible for the validation of new designs related to semiconductor test equipment (heaters/actuation systems/pressure and temperature control systems etc) through in-house lab tests from planning to execution
• Participated in design and test reviews, provided feedback, and made presentations to management on topics related to testing data, roadblocks, and conclusions.
• Worked with the suppliers on resolving issues brought up by customers through root cause analysis, and testing the desired solution

Working on overall research and development of a vacuum reaction chamber for semiconductor processing equipment as per customer requirements:

• Designed and conducted experiments to validate heaters, thermal spacers, and new O-ring materials through chamber bench testing and establishing relevant specs.
• Conducted thermal validation tests on the wafer stage using a TC wafer which include surface temperature non-uniformity tests, transient and steady state tests to correlate wafer temperature and process result through a temperature spec
• Took part in design and development of the susceptor (stage on which the wafer sits during process) using an alternate manufacturing technique to improve its thermal performance and reduce manufacturing variation
• System level trouble shooting through data analysis to identify root cause for feild related issues and presenting to the management
• Taking part in various design reviews and proving feedback/suggestions for possible improvement
• Worked closely with production & manufacturing teams to resolve build/quality issues and improve documentation

• Designed and fabricated a heat exchanger with phase change medium for waste heat recovery/Thermal storage in collaboration with Ford Motors. The experiments were validated with a computational model.
• IR Microscopy was employed to obtain the IR images to compute key parameters like contact resistance between high conductivity metal foams and wax (PCM), heat exchanger activation/de-activation times etc.
• Mobile level electronic thermal management using phase change materials. IR microscope was used for material thermal characterization.