Summary
Overview
Work History
Education
Skills
Additional Information
EDA EXPERTISE
Timeline
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Praveen Kumar Adapala

Okemos,MI

Summary

Senior Analog IC Layout Designer with over 7 years of experience in high-performance analog/mixed-signal CMOS layout. Demonstrated expertise in custom physical layout and verification of circuits using Cadence Virtuoso XL in FinFET technologies. Seeking to leverage experience in top-level planning, floorplan for critical blocks, leading a team and developing IP level tape outs to drive design excellence.

Overview

7
7
years of professional experience

Work History

Senior Layout Design Engineer

Qualcomm India Pvt.Ltd
07.2017 - 01.2023
  • I collaborated with the MSIP team to design several high-speed DAC IPs, including WLANDAC, TXDAC, and ETDAC across multiple FinFET technologies
  • My responsibilities include aiding the ADC, PLL, and SERDES teams in block layout development
  • Expertise in DAC top level and sub-level hierarchies (CAL DAC array, MSB array, LSB array, RLOAD, BIAS and CAL blocks)
  • Responsible for DAC IP deliveries on time with low noise, low parasitic, best quality, and high efficiency
  • Highly skilled in Floor Planning, Placement, Area Estimation, Signal & Power Routing of Macro Blocks, Full IP Integration and Chip Level
  • Demonstrated leadership in managing multiple custom IC layout projects, collaborating closely with design engineers at Qualcomm SD team to ensure optimal circuit performance
  • Recognized for the ability to work effectively both as part of a team and independently, providing valuable input, guidance, and task delegation to layout resources
  • Skilled in fostering clear communication within multi-site team environments across different time zones.

Layout Design Engineer

Wafer Space Semiconductors Pvt.Ltd
12.2015 - 10.2021
  • Worked alongside IT ODC projects for 1.5 years to finalize custom physical layouts and verify high-performance circuits
  • Has a thorough grasp of Parasitic (R & C), Color Decomposition, Guard Rings, Isolation Techniques, Custom Fill vs Auto Fill, FINCODE, Matching Layers, IR Drop, Electromigration, Shielding, and Decaps
  • I possess expertise in diverse matching techniques, covering differential pairs, current mirrors, resistors, capacitors, and BJT's matching
  • Additionally, I am well-versed in layout-dependent effects such as LOD, WPE, OSE, CPO, and PPE
  • I mentored junior team members in deploying IC layout techniques ensuring compliance with DRC and LVS standards, while also emphasizing best practices in floor planning and power & signal routing.

Education

Master of Science - Master of Science in Engineering Management

Trine University
Angola, IN
05.2024

Master of Science - DIGITAL ELECTRONICS & COMMUNICATION ENGINEERING

Jawaharlal Nehru Technological University
Hyderabad, India
01.2015

Bachelor of Science - Electronics & Communications Engineering

Jawaharlal Nehru Technological University
Hyderabad, India
03.2012

Skills

  • Analog IC Layout Design
  • Cadence Virtuoso Layout Editor
  • Floorplan, Placement, Routing, Top level checks
  • Physical Verifications- LVS, DRC, ERC, EMIR

Additional Information

  • FINFET: TSMC (N3E, N6RF, N7P, N28, N28RF)

Samsung (5LPE, 11LPP, 14LPCRF, 14LPPRF)

Global Foundries(14nm)

  • FDSOI: Global Foundries (22FDSOI)
  • CMOS: TSMC 28nm, N40nm, N45nm

EDA EXPERTISE

  • Cadence Virtuoso L, XL & EXL
  • Cadence Virtuoso Schematic Editor
  • Mentor Graphics Calibre LVS, DRC, ERC
  • Verification Synopsis, Calibre & PVS

Timeline

Senior Layout Design Engineer

Qualcomm India Pvt.Ltd
07.2017 - 01.2023

Layout Design Engineer

Wafer Space Semiconductors Pvt.Ltd
12.2015 - 10.2021

Master of Science - Master of Science in Engineering Management

Trine University

Master of Science - DIGITAL ELECTRONICS & COMMUNICATION ENGINEERING

Jawaharlal Nehru Technological University

Bachelor of Science - Electronics & Communications Engineering

Jawaharlal Nehru Technological University
Praveen Kumar Adapala