Raymond (Scott) Lower
Summary
Semiconductor manufacturing specialist with 19+ years at Intel in both high-volume (FAB20) and R&D (D1D) environments. Deep expertise in copper electroplating, wet etch processing, and process control. Proven leadership as Area Coordinator and Backup Operations Manager across multiple modules. Returning to the workforce with fresh focus, technical energy, and a strong track record of safety, quality, and cross-functional collaboration.
Overview
19
19
years of professional experience
Work History
Sustaining Specialist – Copper Electroplating
Intel Corporation
01.2018 - 01.2021
- Supported advanced research and development efforts in the copper electroplating module, working closely with engineers to evaluate new processes, materials, and tool capabilities
- Ensured stability and adherence to experimental specifications by analyzing tool data and driving timely corrective actions
- Resolved issues including chemistry drift, film defects, and tool faults to minimize impact on experimental yield
- Reviewed metrology data (thickness, roughness, voids) to reduce variability and support process qualification
- Managed recipe changes, tool qualifications, and maintenance coordination for SCP and LAM toolsets
- Served as Backup Operations Manager for Copper Electroplating, Copper Barrier Seed, and CVD/PVD/ALD modules, coordinating cross-functional shift-level operations and engineering alignment
Senior Manufacturing Technician / Area Coordinator – Copper Electroplating
Intel Corporation
01.2010 - 01.2018
- Led technician operations in the R&D fab environment, balancing shift execution with the demands of rapid experimentation and engineering collaboration
- Directed technician task assignments, schedule coverage, and on-the-job training across the copper electroplating area
- Held Backup Operations Manager role supporting Copper Electroplating, Copper Barrier Seed, and CVD/PVD/ALD modules, ensuring continuity of operations and communication across modules
- Monitored process performance, executed DOE plans, and participated in tool and process development activities
- Worked closely with engineering teams to improve uptime, optimize KPIs, and support technology development goals
Wet Etch Manufacturing Technician / Area Coordinator – AWB Toolset
Intel Corporation
01.2002 - 01.2010
- Operated and maintained AWB wet etch tools in a high-volume manufacturing environment, ensuring wafer flow and process stability
- Promoted to Area Coordinator in 2004, managing technician schedules and shift execution for wet process operations
- Conducted bath analysis, titrations, and inline monitoring to maintain tight process control
- Reduced tool downtime through proactive troubleshooting and routine maintenance
- Maintained strict compliance with cleanroom safety and chemical handling protocols
Education
Associate of Applied Science - Digital Systems Technology
Umpqua Community College
Roseburg, OR01.2002
Skills
Technical Expertise
- Copper Electroplating (Via/Trench Fill)
- Wet Etch Processing & Chemical Handling
- Toolsets: SCP, LAM, CVD, PVD, ALD
- Metrology Tools: OCD, SEM, XRF, Profilometry
- Chemical Analysis: Titration, Inline Sensors
- Process Monitoring, Data Analysis, DOE Execution
- Equipment Troubleshooting & Preventive Maintenance
- SOP Documentation, Cleanroom & Safety Protocols
Leadership & Collaboration
- Area Coordination & Shift Management
- Technician Training & Mentorship
- Cross-functional Communication & Escalation
- Backup Operations Manager (Multiple Modules)
- Engineering & R&D Partnership
- Root Cause Analysis & Continuous Improvement
Work Availability
monday
tuesday
wednesday
thursday
friday
saturday
sunday
morning
afternoon
evening
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Timeline
Sustaining Specialist – Copper Electroplating
Intel Corporation
01.2018 - 01.2021
Senior Manufacturing Technician / Area Coordinator – Copper Electroplating
Intel Corporation
01.2010 - 01.2018
Wet Etch Manufacturing Technician / Area Coordinator – AWB Toolset
Intel Corporation
01.2002 - 01.2010
Associate of Applied Science - Digital Systems Technology
Umpqua Community College
Key Highlights
· 19+ years in advanced semiconductor manufacturing with emphasis on copper electroplating and chemical process control
· Leadership experience as Area Coordinator, managing shift operations and technician development for 14+ years
Backup operations manager for Multiple Thin Films modules
· Deep expertise in metrology tools, wet etch chemistry, tool troubleshooting, and DOE execution
· Recognized for clear communication, cross-functional collaboration, and rapid problem-solving under pressure
Career Break
Family Care Leave, 01/01/22, Present, Provided full-time care for a neurodivergent child and elderly parent with dementia. Stayed technically engaged through industry news, self-guided study, and professional networking. Motivated to re-enter the semiconductor field with renewed focus and commitment.
Leadership & Collaboration
· Sustaining Specialist – Copper Electroplating (D1D R&D Fab)
· Area Coordinator – both fab20 and d1d
· Backup Operations Manager for (Copper Electroplating, Copper Barrier Seed, CVD/PVD/ALD)
· Technician Training & Mentorship
· Cross-functional Communication & Issue Escalation
· Root Cause Analysis & Continuous Improvement
· Engineering & R&D Partnership
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