Reza (Amm) Hasib
Gilbert
Summary
- Pro-active engineer with 9+ years of eclectic technical track record, playing diverse roles inside multiple tech companies with strong project management skills involving outside suppliers
- Strong foothold on advanced IC packaging technology development (APTD), 2.5/3D heterogenous Packaging architecture, substrate build-up layers process integration, laser patterning of substrates, extrusion of metal-polymer composites, materials characterization/failure analysis and cosmetic surface finishing i.e. anodizing, electroplating
Overview
17
17
years of professional experience
Work History
Senior Module Development Engineer
Intel Foundry
08.2022 - Current
- In charge of Pathfinding and Module Engineering roadmap execution, playing a leading role inside laser and lithography module to develop next generation vertical Cu- interconnect technology development for high performance AI computing
- Developed integrated process flow for multiple NPI lots with a strong cross-functional knowledge of design tradeoff, reliability checkpoints and the integrated assembly flow and their interdependence i.e. metallization, plating, lamination, CMP, laser and lithography loop, flip chip packaging, die attach, epoxy and thermal compression bonding etc.
- Led the equipment and rapid process development of two first-of-a-kind laser tools from inception to HVM tracking milestone i.e. supplier audit, NPI and final tool qualification to semi-HVM operations
- Managed multiple suppliers from different geographical areas i.e. Taiwan, Japan, Korea, Germany and USA
- Steered the process development effort for the Bessel beam picosecond laser tool to handle wide range of substrate thickness and size for hyper large form factor substrates for advanced AI applications
- Leading three very forward-looking projects: (i) industry’s most advanced excimer laser tool development with a target of 1um overlay (ii) Laser induced selective surface activation and plating project to reduce layers and attain zero misalignment bump and (iii) dual damascene process to replace traditional lithography loop with mask-based excimer laser
- Conducted multiple DOEs to architect test vehicles for advanced laser recipe development for multi-stack dielectric layers with precision alignment compensation for next-gen EMIB-T technology development
- Manufactured the key patterning features (i.e. Blind/Buffer via, TGV, fiducial, unit level traceability mark, Cavity and bridge via) by laser recipe development extracting design collaterals using DFX and ODB packages
- Navigated design tradeoff by conducting test, DFX review and provided valuable inputs to the design team during the design rule scoping for final package layout and floor plan architecture to improve thermal and mechanical reliability
- Translated system level product package requirement to module level and engineered the way to circumvent different manufacturing challenges which affects the thermal, mechanical, chemical and electrical performance of the package
- Led the effort of gaining insight into glass processing and chemical strengthening with glass substrate suppliers and completed hands-on DOEs involving i.e. low and high CTE glass- to resolve system level product failure and reliability
- Designed and developed test wafers and coupons for refractive index study in glass using ellipsometry and analyzed evolution of TGV, LAZ area and photo-elastic stress mapping to seamless connect with co-packaged optics
- Received three times department level recognition for equipment qualification ramp to HVM and highest utilization
- Patents: 3 patents granted for filing by Intel patent review committee
Research Associate
Advanced Materials & Manufacturing Lab, ASU
05.2019 - 07.2022
- Maneuvered NSF funded research project on the materials development and scaling of the dynamic viscosity of metal-polymer matrix composite (PLA and Ni-Cu alloy) system to resolve critical manufacturing challenges of Injection molding/extrusion to produce highly dense 3D printed metal parts
- Architected a completely new type of composite using capillary infiltration of polymers in metal nano-pores via low-cost 3D printing technology, technology which can be used to make low-cost 3D printed battery electrodes
- Patents: 2 granted patents from PhD research and another new patent recently filed
PhD Intern, SME- Color Material Finish, Manufacturing Design
Apple Inc.
06.2018 - 01.2019
- Investigated the impact of cleaning chemistry dosing frequency and optimized cosmetic anodization process flow for next gen iPads by conducting DOEs to find color variability i.e. da, dal and dE94 (CIELAB color space)
- Implemented the new process improvement solution at overseas vendor site in Asia navigating through the challenges of scaling up from prototype to mass manufacturing (worked with GSM, reliability and quality team) and demonstrated 68% less rework needed by utilizing optimum cleaning chemistry resulting in a boost in yield and a reduced cost margin
- Analyzed SEM and Raman spectroscopy to find out AZO-dye penetration depth profile in anodized alumina and checked the color retention and stability after UV exposure (with Reliability team)
Planning and Ops Strategy Intern
Freeport-McMoRan
05.2017 - 08.2017
- Developed a PM-to-PM strategy model by cost-gap analysis to improve machine availability yielding $7mil cost savings
- Selected to present at the “Intern Conference” to deliver the Winning Idea based on its ultimate business impact. Only 12 interns were selected to present from the “Engineering Tower” out of the 240 interns.
Plant Engineer
Abengoa Solar Power Plant
01.2015 - 09.2015
- Analyzed plant performance and KPIs by rigorous data analysis and made improvement recommendations and monitored and controlled emissions i.e., NOx, SOx, VOCs to save 475K tons of CO2 emission per year
Manufacturing Process & Quality Eng., Finish & Assembly
Apex Tool Group
08.2014 - 01.2015
- Reviewed & provided design feedback, developed process quality plans, managed supplier quality audits, and drove failure analysis & corrective actions in Annealing, Etching, Electroplating, Coating, and other finishing steps
- Skills set:
- Finishing and assembly: Injection Molding| Heat treatment| Annealing| Sandblasting| Tumbling| Vibratory Oil Polishing| Lapping| Cleaning| Etching| Decorative Nickel and Chromium Plating| Black oxide and pigment coating| Components Assembly
- Finish product analysis: Gage R&R (Repeatability & Reproducibility) | GD&T (Geometric Dimensioning and Tolerancing) | CMM (Coordinate measuring machines) | SPC (Statistical Process Control) | Hardness testing
Team Leader-Manufacturing (Operations, Supply Chain)
BAT
09.2008 - 08.2011
- Managed 150 unionized employees, monitored cost structure and mentored them to ensure seamless manufacturing productivity with high OEE (overall equipment effectiveness)
- Steered the plant-wide implementation of Lean transition (5S, Kaizen, Poke-Yoke, TQM) facilitating growth and cost reduction and gained a significant impact on improving PPMH (Product per man hour)
Education
Ph.D. - Mechanical Engineering
Arizona State University
Tempe, AZ01.2022
M.Sc. - Mechanical & Energy Eng.
University of North Texas (UNT)
Denton, TX01.2013
B.Sc. - Chemical Engineering
Bangladesh University of Eng. and Technology
Bangladesh01.2008
Skills
- 25/3D Packaging
- Laser patterning
- EMIB-T
- Through glass via (TGV) formation
- Substrate assembly and test knowledge
- Build up layer overlay and shrinkage analysis
- Precision alignment to attain high overlay
- Anodizing
- Mechanical & Chemical Surface Finishing
- Extrusion/Injection molding
- 3D printing of metals and composites
- Debinding and sintering 3D
- Optical metrology analysis
- 3D Laser Scanning
- Cross-sectional SEM EDS
- EDS XPS Raman
- Cp/Cpk improvement
- JMP SQL AutoCAD SPC
- Color Spectrophotometry
- UV stability analysis of color
- Powder metallurgy
- Chemical dealloying of bi-metallic alloys
- Rheology study via TA instrument rheometer
- TGA DSC DMA
- OEE (Overall Equipment Effectiveness)
- Cycle time and Yield improvement
Timeline
Senior Module Development Engineer
Intel Foundry
08.2022 - Current
Research Associate
Advanced Materials & Manufacturing Lab, ASU
05.2019 - 07.2022
PhD Intern, SME- Color Material Finish, Manufacturing Design
Apple Inc.
06.2018 - 01.2019
Planning and Ops Strategy Intern
Freeport-McMoRan
05.2017 - 08.2017
Plant Engineer
Abengoa Solar Power Plant
01.2015 - 09.2015
Manufacturing Process & Quality Eng., Finish & Assembly
Apex Tool Group
08.2014 - 01.2015
Team Leader-Manufacturing (Operations, Supply Chain)
BAT
09.2008 - 08.2011
M.Sc. - Mechanical & Energy Eng.
University of North Texas (UNT)
B.Sc. - Chemical Engineering
Bangladesh University of Eng. and Technology
Ph.D. - Mechanical Engineering
Arizona State University