Summary
Overview
Work History
Education
Skills
Websites
Certification
Accomplishments
Timeline
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Ridwan Fayaz Hossain

Portland

Summary

Dynamic and results-driven Etch Module Process Engineer with 3+ years of experience in semiconductor manufacturing, specializing in 18A node ramp-up, process development, optimization, and tool sustaining. Proven expertise in preventive and corrective maintenance on TEL and LAM etch tools, with a solid foundation in semiconductor device physics and advanced data analysis. Skilled in driving yield improvement, throughput optimization, and cost reduction through structured problem solving, SPC, and DOE methodologies. Adept at collaborating in fast-paced and cross-functional environments. Strong communicator with a customer-focused, proactive approach and a passion for continuous improvement.

Overview

9
9
years of professional experience
1
1
Certification

Work History

Module Process Engineer

Intel Corporation
03.2022 - Current
  • Led two successful latest node ramp-ups (including 18A) with speed and quality, qualifying, configuring, and sustaining over 20+ manufacturing tools while ensuring 90% machine availability.
  • Engineered solutions (BKM) to resolve critical tool issues while adapting to a dynamic high-volume manufacturing environment, including scheduled night shifts, weekend on-duty, and on-call.
  • Championed process improvement project initiatives through DOE, such as surface-scan improvement, new post-lot cleaning piloting, and RFVpp interlock implementation, boosting operational efficiency by 3-6% and earning a Departmental Award in Q3-2024.
  • Optimized manufacturing efficiency by managing multiple cost-saving projects, reducing cost per wafer by $1-$5 through process improvements and alternative sourced parts piloting.
  • Collaborated with cross-functional teams (process engineers, technicians, vendors) to resolve equipment-related challenges and implement strategies and solutions on a daily basis.
  • Supported new product development efforts through scale-up activities from pilot-scale testing to full-scale production implementation.

Post-doctoral Associate

University of Minnesota
08.2020 - 01.2022
  • 2D Graphene and Titanium Carbide-based ECoG and G-FET for neural recording and stimulation.
  • Designed and assembled a very first miniaturized micro-camera array that eliminates the size/weight/cost scaling law associated with the large-FOV microscope.

Research Assistant (Ph.D.)

University of North Texas
01.2016 - 05.2020
  • Developed first-of-a-kind flexible heterostructure photodetectors and solar cells based on 2D MoS₂, WSe₂, and perovskites using inkjet printing, addressing key challenges in material integration and device performance.
  • Studied the photo-responsivity, strain-dependency, phonon dynamics, carrier transport associated with metal contacts, Schottky barrier, etc.
  • Expert in synthesizing and characterizing 2D materials i.e., Graphene, MoS2, WSe2, Al, Perovskite.

Education

Bachelor of Science - Electrical and Electronic Engineering

Ahsanullah University of Science And Technology
Dhaka, Bangladesh
05-2013

Master of Science - Electrical Engineering

University of Texas Rio Grande Valley
Edinburg, TX
12-2015

Doctor of Philosophy (Ph.D.) - Electrical Engineering

University of North Texas
Denton, TX
05.2020

Skills

  • Manufacturing Equipment: TEL, LAM platform tool
  • Process Engineering
  • Material characterization techniques
  • Cleanroom process expertise
  • Root-cause analysis
  • Design of experiments
  • Equipment performance analysis using JMP and SPC
  • Experience with Silvaco, Cadence, and AutoCAD
  • Multitasking
  • Model Based Problem Solving
  • Project Management
  • Cross-Functional Collaboration
  • Team Player
  • Strong Ownership
  • Growth Mindset
  • Process development
  • Team collaboration

Certification

  • Design of experiments (DOE)- Model Based Problem Solving
  • Failure Modes and Effects Analysis (FMEA)
  • Six Sigma (Green Belt)
  • Process Matching
  • JMP Statistical Analysis
  • Fab Statistics
  • Equipment Vendor Training - Tokyo Electronics (TEL)

Accomplishments

  • Department Divisional Award (Q3, 2024)
  • Intel Recognized/valued multiple times for demonstrating 'Result driven', 'One Intel', 'Quality', and 'Integrity' mindset and activities (2022-25)
  • 1st place (poster) at 2021 IEM Annual Conference, UMN (2021)
  • Outstanding Graduate Student Award, UNT (2020)
  • Best Graduating Ph.D. Student-Spring'20', UNT (2020)

Timeline

Module Process Engineer

Intel Corporation
03.2022 - Current

Post-doctoral Associate

University of Minnesota
08.2020 - 01.2022

Research Assistant (Ph.D.)

University of North Texas
01.2016 - 05.2020

Doctor of Philosophy (Ph.D.) - Electrical Engineering

University of North Texas

Bachelor of Science - Electrical and Electronic Engineering

Ahsanullah University of Science And Technology

Master of Science - Electrical Engineering

University of Texas Rio Grande Valley

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