RULON BRAINICH

• Maintain high availability of ASM Epsilon E-2000 epitaxial reactors and wet bench systems in a high-volume semiconductor fab through proactive preventive and corrective maintenance across multiple production platforms.
• Perform electrical and mechanical troubleshooting at the system, subassembly, and component levels using multimeters, oscilloscopes, and thermal probes/thermocouples to diagnose and resolve hardware faults and control process temperature within precise tolerances.
• Replace and service critical process components including gearboxes, Bernoulli wands, lamps, gas bottles, cassettes, gas filters, and associated process chambers, MFCs, and hardware to maximize tool uptime.
• Calibrate and verify SCRs, Foxboro controllers, optical sensors, and process controllers; utilize SPC control charts and historical process data to ensure accuracy and repeatability.
• Apply electrical, mechanical, and process troubleshooting to slip, thickness, and resistivity issues affecting performance, partnering cross-functionally with engineering and technicians to support continuous manufacturing operations.
• Serve as a senior technical resource on the maintenance team, guiding junior technicians on complex troubleshooting and escalations while helping set best practices for preventive maintenance procedures.

• Led and mentored a team of semiconductor wafer fab operators, delivering hands-on training on process tool operation, safety protocols, and SOPs to drive consistent production output and meet quality and yield targets.
• Monitored and controlled automated fab equipment at the operator level, performing first-level troubleshooting and routine inspections to identify process excursions, minimize tool downtime, and reduce wafer scrap/rework.
• Partnered with process engineers and equipment technicians on process improvements and corrective actions while maintaining accurate lot tracking, WIP documentation, and MES data entry to ensure full traceability and compliance.

• Operated epitaxy production tools in a cleanroom environment, following detailed recipes and work instructions to support consistent epitaxial layer growth, throughput, and product quality.
• Performed wafer handling and in-process monitoring, completing routine tool checks, first-level troubleshooting, and basic operator maintenance to minimize downtime.

• Operated CMP tools in a high-volume cleanroom, monitoring process stability and responding promptly to alarms and out-of-control conditions to maintain throughput and product quality.
• Performed in-process metrology (wafer thickness/removal rate, particle counts) and routine tool checks (slurry, pad condition, chemical levels, filters) to verify SPC compliance while executing pre/post-CMP cleaning with strict contamination control.
• Managed lot flow and prioritization in MES systems to meet production targets and supported process improvement by shadowing maintenance technicians on preventive maintenance and troubleshooting activities.

• Operated backend semiconductor saw and pick-and-place equipment, setting up and running lots per traveler specifications while maintaining precise die handling, throughput, and strict adherence to quality and safety requirements.
• Performed in-process inspections and measurements (die quality, chipping/cracking, kerf width, tape condition, yield counts), accurately documenting results in MES and escalating out-of-spec conditions to minimize scrap and yield loss.
• Executed routine tool checks and operator-level maintenance (blade changes/dressing, chuck/tape inspection, vacuum/nozzle verification, cleaning) to reduce downtime and prevent contamination.

GPA: 3.3