Professional Summary
Overview
Work History
Education
Skills
Personal Information
Publications
Timeline

SANKALP AGRAWAL

Qualcomm Inc
San Diego,CA
7
years of professional experience

Engineering professional with solid track record in project management and technical innovation. Adept at driving engineering processes to achieve optimal performance, ensuring high-quality outcomes. Known for collaborative approach and reliability in dynamic environments, leveraging problem-solving and analytical skills.

Work History

Senior Engineer Wireless Research and Development - Signal Processing DSP Firmware

3 Years 3 Months
Qualcomm Inc | 06.2023 - Current
  • ORAN Spec implementation on the Qualcomm Custom 5G Digital Signal Processor.
  • Implemented ORAN Channel beamforming technique implementation and Uplink Performance Improvement to achieve high Spectral Efficiency
  • Wrote Packet processing algorithms which now stream billions of packets which help implement Massive MIMO
  • Implemented ORAN channel beamforming technique and uplink performance improvements, enhancing spectral efficiency
  • Developed firmware using custom DSP instruction set with Vector/SIMD programming, achieving high throughput
  • Writing networking firmware for the Low PHY of the Open RAN architecture
  • Collaborated with other subsystem experts to optimize performance of 5G base station firmware
  • Researching 6G implementation on custom high performance data center CPU/DSPs
  • Researching AI/ML hardware implementation and communication for 6G
  • Developed communication protocols including SRS, PUSCH, STS, and ST6 for 5G systems.

Flight Software Engineer

4 Months
Department of Aerospace Engineering, Boulder - CubeSat | 01.2023 - 05.2023
  • Writing firmware for interfacing propulsion systems designed for orbital maneuvering of the satellite
  • Developed firmware for high speed/high bandwidth and low speed/low bandwidth modules of satellite, enhancing communication capabilities
  • Designing architecture for a co-processor for satellite navigation and coordination between satellites
  • Designed interfaces between co-processor and main processor for high speed and low speed communications, facilitating efficient data transfer
  • Writing firmware for the X-band transmitter to transmit massive chunks of sensor data to the base station
  • Created firmware for inter satellite communication system using low-speed RF transceiver, enabling reliable data exchange between satellites

Interim Engineering Intern

3 Months
Qualcomm Inc | 05.2022 - 08.2022
  • Architected the Massive MIMO Spatial Processing driver on the L2 for 5G Base Station Chip
  • Implemented algorithms for user selection in MU-MIMO groups using SRS channel estimates, enhancing group performance through graph theory
  • Developed web-based solution to visualize SRS indication statistics from L1, improving data accessibility and interpretation
  • Authored python tool parser for SOC logs, enabling profiling on Google's Perfetto platform for improved analysis

Embedded Firmware Developer

2 Years 1 Month
Siemens | 07.2019 - 08.2021
  • Built lifesaving technology by designing and developing Fire Safety Panels and fire sensors deployed around the globe, at every major hospital and airports
  • Collaborated on FPGA development by porting Microblaze and writing firmware in C, enhancing system performance
  • Collaborated on the development of the FPGA by porting Microblaze on it and writing its firmware in C
  • Developed three products for Siemens US and Siemens Korea, including fire panels and components, contributing to global fire safety solutions
  • Carried out the development of 3 products under Siemens US and Siemens Korea, including fire panels and its components
  • Created and incorporated reliable communication protocols for high-bandwidth products, ensuring efficient data transmission
  • Created and incorporated reliable communication protocols for products requiring higher bandwidth
  • Contributed to feature enhancements and defect resolution in software applications.
  • The application runs on Linux SBC and the code is pure C++.

Education

Master of Science - Embedded Systems Engineering

University of Colorado Boulder | Boulder, United States | 01-2023
Courses: Principles of Embedded Software, Mastering Embedded Systems Architecture, Low Power Embedded Systems Design, Real Time Operating Systems

Bachelor of Technology - Electronics & Telecommunications Engineering

Vishwakarma Institute of Technology | Pune, India | 01-2019
Courses: Digital Electronics, Digital/Analog Communication, Embedded Systems, Digital Signal Processing, Electromagnetism, Linear Algebra

Skills

Firmware development
Technical documentation
Project management
Risk analysis
Innovation and creativity
Team leadership
Management skills
Leadership skills

Personal Information

Title: Senior Engineer | 5G Protocols | Firmware Development | DSP Engineer

Publications

  • Agrawal, Sankalp & Gupta, Ayush & Chourikar, Sameer & Deshmukh, Ankur & Bhargava, Prasham, "A Geometric Approach to Inverse Kinematics of a 3 DOF Robotic Arm", International Journal for Rese arch in Applied Science and Engineering Technology, 2018
  • Agrawal, Sankalp & Gupta, Ayush & Bhargava, Prasham & Deshmukh, Ankur & Kadam, Bhakti, "Comparative Study of Different Approaches to Inverse Kinematics", Second International Conference, ICACDS 2018, Dehradun, India, 2018

Timeline

Senior Engineer Wireless Research and Development - Signal Processing DSP Firmware

Qualcomm Inc
06.2023 - CurrentRead More

Flight Software Engineer

Department of Aerospace Engineering, Boulder - CubeSat
01.2023 - 05.2023Read More

Interim Engineering Intern

Qualcomm Inc
05.2022 - 08.2022Read More

Embedded Firmware Developer

Siemens
07.2019 - 08.2021Read More

Vishwakarma Institute of Technology

Bachelor of Technology from Electronics & Telecommunications Engineering
Read More

University of Colorado Boulder

Master of Science from Embedded Systems Engineering
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SANKALP AGRAWAL