Sergio A. Carrillo
Laveen,AZ
Summary
Detail-oriented Module Equipment Technician specializing in the maintenance and repair of 200mm and 300mm wafer and Advanced Packaging Technology Development semiconductor equipment. Extensive expertise in equipment operations, process optimization, training, troubleshooting, repair, and preventive maintenance. Committed to safety and collaboration, driving the pursuit of zero-defect outcomes in high-volume manufacturing environments while consistently enhancing operational efficiency. Proven ability to adapt to evolving technologies with a strong emphasis on quality and performance standards.
Overview
2027
2027
years of professional experience
Work History
Module Equipment Technician MTE, APTDSWA
Intel Corporation
01.2018 - Current
- Operated and maintained advanced semiconductor manufacturing equipment to ensure optimal performance.
- Troubleshot equipment issues, identifying root causes and implementing effective solutions.
- Troubleshot electrical and mechanical issues in nonfunctioning electromechanical equipment to ensure optimal manufacturing operations.
- Performed setup calibration and (PMs) preventative maintenance on production equipment.
- Actively initiated tasks and projects without supervision, contributing to team objectives. capable of managing own activities as well as supporting team activities.
- Communication skills with the capability to effectively communicate with peers, engineering, and customers.
- Implemented preventive maintenance schedules to enhance equipment lifespan and reliability.
- Collaborated with engineering teams to optimize equipment settings for increased production efficiency.
- Trained new technicians on operational procedures and safety protocols for equipment handling.
- Developed standard operating procedures that improved workflow consistency and enhanced overall productivity in the facility.
- Participated in Emergency Response Team (ERT).
- Level III certified on the following Metals Etch toolset certifications - (EPL) Uyemura Electroless Copper Plating, AMAT (PVD) Physical vapor deposition sputter toolsets, (PSX) TOPAZ 500 (TSY) TOPAZ Hi Source, (DAP) TOPAZ T-103, (DDE) Dry Desmear Etch. ULVAC (PDE) Plasma Dry Etch, (MHS) Hirata Material Handling Equipment
Module Equipment Technician MT, APTDSWA
Intel Corporation
2013 - 2018
- Executed substrate packaging production tasks, including operations, preventive maintenance, troubleshooting, and training to sustain production levels.
- Collaborated on establishing operational standards and specifications for new tool implementation to enhance efficiency in SPTD CH8 FAB startup.
- Collected and evaluated tool operations data to support the engineering team in equipment adjustments, process optimization, and troubleshooting complex non-standard events.
- Participated in Emergency Response Team (ERT).
- Provided expert troubleshooting and resolution for Material Handling System (MHS) issues to maintain system reliability.
- Conducted training for peers to enhance proficiency in DSP, dry, metals, and etch processes.
- Operated advanced manufacturing equipment to ensure product quality and efficiency.
- Conducted routine maintenance on machinery to minimize downtime and enhance performance.
- Collaborated with cross-functional teams to troubleshoot production issues effectively.
- Trained new technicians on safety protocols and operational procedures for manufacturing systems.
- Achieved Level I/II certifications for Hitachi laser drill (LAC/LAU), (COL/UVL), and (THL). Assisted in operating SACI-500 laminator (LAM). Supported the use of group batch conveyor oven (ACU) and group single chamber oven (BOV). Handled blue M oven (BMO) operations efficiently. Facilitated utilization of ULVAC physical vapor deposition sputter (SPE) equipment. Aided in the operation of Hitachi auto peeler ABF (AAP) and UV cure (SRU). Participated in NEMS plasma clean (MPC) tasks. Contributed to the management of Hirata 24-panel material handling equipment (MHS). Operated Cyber Technologies CT 600ST total thickness variation (TTV) system.
Module Equipment Technician, Thin Films Implant
Intel Corporation
01.2011 - 01.2013
- Perform non/scheduled PMs on all Implanter equipment Varian VIISta VIM HCPi and MIM 810HP toolsets.
- Performed pm tool qualifications, including tasks such as beam tuning, particle monitoring, and recipe top-offs on partial lots.
- Collaborated with ROC technicians to diagnose and resolve tool malfunctions efficiently.
- Troubleshoot and sustain installation, repair, and manufacturing operations, on all Varian VIISta VIM HCPi and MIM 810HP toolsets.
- Participated in safety initiatives and monitored improvement tracker systems to uphold safety standards.
- Trained junior technicians on equipment operation and safety protocols, fostering a culture of safety and efficiency.
- Reduced equipment downtime by implementing preventive maintenance schedules and procedures.
- Level I/II Certified on the following certifications: 1266 MIM Maintenance Core Prereq, 1268/69 Varian VIISta 810 (MIM) - Bernas Source, 1268/69 Varian VIISta 810 (MIM) Maintenance Core Prereq, 1268/69 Varian VIISta 810 (MIM) Semi-Annual, 1268/69 Varian VIISta 810 (MIM) LIO, 1268/69 Varian VIISta HCPi (VIM) General PM + Source, 1268/69 Varian VIISta HCPi (VIM) Maintenance Core Prereq, 1268/69 Varian VIISta HCPi (VIM) LIO.
Sr. Equipment Engineering Tech, Thin Film Implant
Samsung Austin Semiconductor
01.2007 - 01.2011
- Contributed to new 300mm FAB startup by coordinating tool ordering, creating specifications, and standardizing processes and equipment with headquarters FAB.
- Coordinated tool ownership and move-in processes for new equipment. for First in FAB 300mm VIISta HCP Implanter.
- Led team of technicians and vendors in installation and maintenance of Axcelis and Varian 300mm toolsets, ensuring operational readiness.
- Tool achieved no wafer scrap for 2007 and reached 100% complete automation benchmark.
- Developed and implemented process improvements, reducing downtime and enhancing workflow efficiency.
- Implemented preventive maintenance programs, ensuring optimal performance of semiconductor manufacturing equipment.
- Led equipment troubleshooting initiatives to minimize downtime and enhance operational efficiency.
- Developed Implant area PM schedules and checklists.
- Write and audit Standard Operating Procedures and Failure Analysis Reports for the Implant area Toolset, including Varian VIISta 810xP, VIISta HCP, and Axcelis Paradigm Xe per ISO 15001, 9001 specifications.
- Review Pre- and Post-PM statistical analysis to ensure “perfect pm” was performed.
- Mentored junior technicians, sharing knowledge and expertise in advanced equipment operation and maintenance techniques.
- Contributed to the Implant focus group that standardized operations and techniques across shifts.
- Collaborated with cross-functional teams to resolve technical issues and enhance equipment functionality.
- Conducted root cause analysis on equipment failures, driving corrective actions for long-term solutions.
- Led 5S initiatives to enhance organization and cleanliness in the workplace. Participated in the Total Productive Maintenance team to enhance equipment reliability..
- Championed the adoption of lean manufacturing principles within the department, resulting in reduced waste and improved operational efficiency.
EES Equipment Technician, Thin Films, Implant
ST Microelectronics
2006 - 01.2007
- Operated and maintained semiconductor manufacturing equipment for optimal performance.
- Performed comprehensive maintenance tasks on implanter equipment, focusing on Axcelis HC, GSD 200 series, and MC 8200/8250 models to enhance equipment reliability and efficiency.
- Monitored equipment performance metrics to identify trends and recommend improvements.
- Troubleshot equipment failures and remedied problems to restore functionality.
- Developed and implemented PM schedules and checklists for Implanter area to ensure optimal equipment performance.
- Collaborated with engineering teams on equipment modification projects to improve functionality.
- Repaired and replaced worn and damaged components.
- Rebuilt Implanter components to enhance reliability of Implanter consumables and assemblies, enhancing equipment reliability and uptime.
TPM Equipment Technician, Thin Films Implant
ST Microelectronics
2005 - 2006
- Operated and maintained semiconductor manufacturing equipment for optimal performance.
- Perform scheduled PMs and corrective maintenance on all Implanter equipment such as Axcelis HC GSD 200, GSD 200e2, GSD LED, MC 8200, 8250, HE VHE/HE.
- Performed routine maintenance and troubleshooting on semiconductor manufacturing equipment.
- Performed routine maintenance and troubleshooting with Senior Equipment Technicians on semiconductor manufacturing equipment.
- Repaired and replaced worn and damaged components.
- Collaborated with engineering teams to implement process improvements in equipment performance.
- Rebuilt Implanter components to enhance reliability of Implanter consumables and assemblies, enhancing equipment reliability and uptime.
- Conducted preventive maintenance on manufacturing equipment to ensure optimal functionality.
TPM Equipment Technician, Wafer Sort (Probe)
ST Microelectronics
2004 - 2005
- Perform scheduled PMs and corrective maintenance on all Tester equipment such as Teradyne Catalyst, 1971, A565, and A585, Schlumberger ITS 9000 PX and EXA, HP Agilent 93000, Electrogas 4080 / 4090 probers, Keithley S400 / S600, August Inspection NSX-95, LTX Synchro II, and Cybernetics.
- Assisted in re-creating system calibration training procedures, enhancing operational consistency for EG 4080 / 4090 probers.
- Operated and maintained complex semiconductor manufacturing equipment.
- Conducted routine inspections to ensure equipment reliability and performance.
- Performed routine maintenance and troubleshooting with Senior Equipment Technicians on semiconductor manufacturing equipment.
- Supported manufacturing and engineering staff by providing timely and effective responses to inquiries.
- Maintained dependable coverage for EES and manufacturing staff, ensuring continuity of operations during absences.
Manufacturing Technician II, Wafer Sort (Probe)
ST Microelectronics
2003 - 2004
- Oversaw daily operations and maintained all parametric Keithley S400 / S600 toolsets.
- Managed daily operations and maintenance of parametric Keithley S400 / S600 toolsets to ensure optimal performance.
- Developed new product and prototype program recipes, conducted probed wafer data analysis, and established daily production output targets.
- Assisted in troubleshooting equipment malfunctions, contributing to timely repairs and production continuity.
- Performed routine maintenance on machinery to minimize downtime and enhance operational efficiency.
- Increased overall productivity by training new technicians and providing ongoing support to team members.
- Operated tester equipment such as Teradyne Catalyst, J971, A565, and A585, Schlumberger ITS 9000 PX and EXa, HP Agilent 93000, Electroglas 4080 / 4090 probers, Keithley S400 / S600, August Inspection NSX-95, LTX Synchro II,
Manufacturing Technician I, Wafer Sort (Probe)
ST Microelectronics
01.2002 - 2003
- Operated and maintained manufacturing equipment to ensure optimal functionality and performance.
- Responsible for equipment operation, wafer handling, and processing.
- Executed quality control processes to identify defects and maintain product standards.
- Supported continuous improvement initiatives to enhance productivity and yield.
- Facilitated communication between incoming and outgoing shifts to ensure seamless information transfer.
- Collaborated with team members to enhance workflow efficiency in production lines.
- Maintained a safe work environment by enforcing safety protocols and conducting routine inspections.
- Utilized Lean Manufacturing principles to eliminate inefficiencies and maximize productivity throughout the facility.
- Operated tester equipment such as Teradyne Catalyst, J971, A565, and A585, Schlumberger ITS 9000 PX and EXa, HP Agilent 93000, Electroglas 4080 / 4090 probers, Keithley S400 / S600, August Inspection NSX-95, LTX Synchro II,
Education
Associates Degree - Computer Electronic Technology
High-Tech Institute
Phoenix, AZ01-2001
Skills
- Preventive Maintenance
- Equipment Repair/Troubleshooting
- System diagnostics
- Calibration procedures
- Control systems
- Drawings, diagrams and schematics
- Specification procedures
- Electrical and Mechanical aptitude
- Written and verbal communication
- Task prioritization
- PM green to green time management
- Initiative-driven individual
- Teamwork in a diverse workplace
- Safety policies and procedures
- Analytical thinking
- FAB startup
- Experience in thin films and wafer sort 200mm, 300mm manufacturing
- Experience in metals/etch substrate packaging test development manufacturing
Timeline
Module Equipment Technician MTE, APTDSWA
Intel Corporation
01.2018 - Current
Module Equipment Technician, Thin Films Implant
Intel Corporation
01.2011 - 01.2013
Sr. Equipment Engineering Tech, Thin Film Implant
Samsung Austin Semiconductor
01.2007 - 01.2011
Manufacturing Technician I, Wafer Sort (Probe)
ST Microelectronics
01.2002 - 2003
Module Equipment Technician MT, APTDSWA
Intel Corporation
2013 - 2018
EES Equipment Technician, Thin Films, Implant
ST Microelectronics
2006 - 01.2007
TPM Equipment Technician, Thin Films Implant
ST Microelectronics
2005 - 2006
TPM Equipment Technician, Wafer Sort (Probe)
ST Microelectronics
2004 - 2005
Manufacturing Technician II, Wafer Sort (Probe)
ST Microelectronics
2003 - 2004
Associates Degree - Computer Electronic Technology
High-Tech Institute