Solange Carina Kot
Worcester,MA
Summary
Highly skilled Microelectronics Wire Bonder and Assembler with over 20 years of hands on experience in semiconductor packaging, microelectronics assembly, precision wire bonding and soldering. Proven expertise in manual and automatic ultrasonic and gold ball bonding such as Orthodyne, Hughes, Palomar, Mech-EL, and Dage/Royce testing systems. Experienced in cleanroom environments, ESD-safe handling, die attach, glop top, visual inspection, and data entry. Adept at interpreting blueprints, schematics, and job travelers to execute complex bonding and assembly tasks for defense, aerospace, and industrial electronics. Committed to high-reliability production, quality control, and continuous improvement.
Overview
20
20
years of professional experience
Work History
Microwave Assembler
Businnes Integra (Lockheed Martin)
Chelmsford, MA
09.2025 - Current
- Assembled components according to specifications, ensuring high quality and precision.
- Operated various hand and power tools to complete assembly tasks efficiently.
- Conducted routine inspections of assembled products to maintain quality standards.
- Collaborated with team members and Quality Engineering to optimize workflow and enhance productivity.
- Installation of connectors, substrates, components and modules in highly complex microwave assemblies, using paste and sheet epoxies.
- Working in MyHydra location as a WireBonder operated manuals and automatic wirebonders gold AU 0.007, 0.01, and Ribbon wires.
Wire Bonder Assembler IV
Spectrum Control
Marlborough, MA
03.2023 - 06.2025
- Set up wire bonders according to specifications and job travelers, using blueprints, drawings, and work schematics to determine materials and sequence of operations.
- Performed microelectronics wire bonding using both manual and automatic machines including ribbon/wire wedge, orthodyne M20, 360A, 360B, Hughes 2460 II to V, Palomar 8000, 8100, 2460 II to V, MEI-1204W, Mech-EL Nu829, ENC. Glop Top MRSI-170.
- Handled ultrasonic wire bonding of aluminum and gold wires (AL & AU) to packages per required specifications.
- Created and loaded bonding programs for automatic bonders when product was not already in the system.
- Performed manual gold ball wire bonding.
- Used tweezers, torque drivers, cutters, strippers, pliers, and microscopes for precision bonding and alignment work.
- Conducted wire pull testing and bond shear testing, both destructive and non-destructive using Dage 4000, Royce 650.
- Entered wire pull test data into SPC database using computer systems.
- Worked daily in a clean, ESD controlled environment.
Assembler II
Kopin Corporate
Westborough, MA
01.2019 - 01.2023
- Assembled advanced vision systems and micro display modules for use in defense, security, and industrial applications, including integration of micro displays, precision optics, and ruggedized housings.
- Performed microchip bonding and die placement under a high magnification microscope, ensuring precise alignment and secure attachment using hand and power tools.
- Worked in a cleanroom environment, adhering to ESD safe handling practices.
- Conducted visual inspections using microscopes to verify bond integrity, alignment accuracy, and compliance as per MIL SPECs.
Wire Bonder Assembler IV
API Corporation
Marlborough, MA
01.2006 - 01.2016
- Set up wire bonders per technical documentation, interpreting blueprints, assembly drawings, and process schematics to determine proper materials and workflow.
- Performed precision microelectronics wire bonding using bonding machines, including ribbon/wire wedge bonders such as Orthodyne M20, 360A, 360B, Hughes 2460 II–V, Palomar 8000/8100, MEI-1204W, Mech-EL Nu829, and ENC.
- Executed ultrasonic wire bonding using aluminum and gold wires (AL & AU) on hybrid packages and assemblies.
- Programmed and configured automatic bonders when job specific programs were not preloaded in the system.
- Performed manual gold ball bonding using precision techniques and under magnification for high-reliability microelectronic assemblies.
- Utilized hand tools such as tweezers, torque drivers, cutters, strippers, and pliers alongside microscopes to perform detailed wire bonding and fine alignment work.
- Conducted bond testing, including wire pull and shear tests using Dage 4000 and Royce 650 equipment.
- Recorded test results and statistical process control data into computerized systems for quality assurance and traceability.
- Consistently maintained high standards in a cleanroom, ESD safe environment, following strict contamination control and safety protocols.
Education
GED -
Mount Wachusett Community College
Gardner, MA07.1995
Skills
- ISO 9000
- ISO 14001
- SPC-Quantum
- Blueprint
- ESD
- Handling of Hybrid
- Solder/Lead
- DIE Inspection
- DIE Coat
- Orthodyne M 20
- Orthodyne 360A
- Orthodyne 360B
- Hughes 2460 II to V
- Palomar 2460 II to V
- Palomar 8000
- Palomar 8100
- Ribbon/Wire Wedge
- MEI-1204W
- Mech-EL Nu829
- ENC Glop Top MRSI-170
- Dage 4000
- Royce 650
Languages
Spanish
Native or Bilingual
Timeline
Microwave Assembler
Businnes Integra (Lockheed Martin)
09.2025 - Current
Wire Bonder Assembler IV
Spectrum Control
03.2023 - 06.2025
Assembler II
Kopin Corporate
01.2019 - 01.2023
Wire Bonder Assembler IV
API Corporation
01.2006 - 01.2016
GED -
Mount Wachusett Community College