
Dynamic Lab Technician with expertise at Kuprion Inc in particle size characterization and thermal conductivity evaluation. Proven track record in enhancing material selection and process consistency through rigorous testing and analysis. Developed comprehensive skill set in fast-paced laboratory environment, including data analysis and equipment maintenance. Looking to transition into new field where these skills can be applied and further developed. Seeking role that values precision, analytical thinking, and continuous improvement.
Skills
· Particle Size Analysis
Proficient in using Rigaku XRD systems for particle size characterization.
· Die Bonding & Shear Testing
Manual die bonding, shear testing, and bond line analysis using CSAM imaging and microscopy.
Film test analysis with resistance measurements.
· Imaging & Surface Analysis
Skilled in Keyence imaging for cross-sectional and surface/depth analysis of trenches, vias, and various substrates.
· Thermal Conductivity Testing
Laser Flash analysis for evaluating thermal conductivity of vias.
· 3D Modeling & Printing
Experienced in Autodesk/AutoCAD for 3D modeling.
Proficient in FlashPrint, Flashforge, and Orcaslice software for prototyping and mold creation.
· Material Compaction
Hands-on experience with compaction processes.
· Inventory & Chemical Management
Managed inventory and restocking of chemicals with Markov Software
Size distribution analysis
Die bonding and shear analysis
Imaging and analysis expertise
Thermal conductivity evaluation
3D printing proficiency
Material Compaction
Chemical inventory oversight
• SAXS Analysis
Utilized Small-Angle X-ray Scattering (SAXS) for particle size analysis to predict key features of raw material batches used in the die attach process.
Helped improve material selection and process consistency by identifying batch-to-batch variability.
• Die Bond / Shear / CSAM / Film Testing
Performed qualification testing on new raw material batches to assess their suitability for project use, including mechanical and imaging evaluations.
Enabled early detection of material defects and ensured reliability in downstream processes.
• Manufacturing Pilot Testing
Designed and modeled component trays using CAD software to support automation of pick-and-place operations in die attach machines.
Contributed to increased throughput and reduced manual handling errors during pilot runs.
• Thermal Analysis & Coining Project
Led thermal characterization of coin vias using Laser Flash Analysis and developed a Standard Operating Procedure (SOP) to ensure consistent and reproducible data collection.
Built a comprehensive database of thermal conductivity values for coin materials to support formulation and process optimization based on customer specifications.
Note: SOP implementation improved cross-team data reliability, while the database provided actionable insights for material selection and process tuning in coining applications.
• Conductance Experiments
Developed a testing protocol to monitor conductance across vendors, batches, and solution ages for sodium borohydride used in raw material synthesis.
Measured conductance values and compiled a database to identify optimal sources and conditions.
Improving synthesis consistency and enabled traceability of material performance across suppliers.