Summary
Overview
Work History
Education
Skills
Websites
Technical Skills Summary
Awards
Timeline
Generic

Vijay Kumar Kadagala

San Diego,CA

Summary

  • Seeking a leadership position as Software head in the Semiconductor or Product company
  • SW/System technical lead
  • Senior Director of Engineering at Qualcomm with over 22 years of extensive experience as a Software Project lead and embedded systems design and development of wireless technologies, Virtual platforms
  • Compute overall SW project engineer responsible for all Compute program execution (X Elite series) from Inception to commercialization
  • Managed the entire product life cycle as Project Engineer (Hardware planning, architecture, Pre- silicon, Software planning and development, Test and integration, Commercialization) for multiple Qualcomm Snapdragon MSM (X Elite, 8cx etc) and MDM chipsets.
  • SW lead for several Compute Mobile handset, XR(VR/AR) chipsets chipsets.
  • Extensive knowledge in ASIC architecture and design as well as SW platform architecture. Also experienced in Power, performance and thermal architecture and design
  • Seasoned in Pre silicon(FPGA) validation for Qualcomm SOCs and also responsible for coming up with performance optimizations on FPGA platforms to improve the experience for developers.
  • Currently leading the Software for Compute and XR portfolio at Qualcomm as well as Virtual platforms for all Qualcomm SOCs across all BUs (Automotive, IOT, XR and Mobile)
  • Drove the custom CPU SW design (Nuvia Oryon CPU) and deliverables and responsible for bringup, validation and commercialization.
  • Leading 25+ Qualcomm Virtual platform team responsible for creating fast models using System C for Qualcomm IPs and peripherals as well as QEMU/TLM integration and creating full SOC emulation for Qualcomm SOCs and running several OS platforms like Linux, QNX, Android as well as Hypervisors
  • Extensive knowledge in Product planning, Hardware architecture, Software architecture, Product council reviews, Emulation validation, Silicon bringup validation, Customer release planning, Product and System test execution, Field and IOT planning and execution with all carriers (VzW, ATT, Sprint, CMCC etc)
  • Managed carrier relations, OEM support, Chipset certifications, Internal and customer milestone execution.
  • Served as Direct responsible individual (DRI ) for Apple project execution and responsible for successful Iphone launches with Qualcomm chipset.
  • Lead Chipset stability team responsible for triaging all chipset stability issues.
  • Design and Development
  • Key participation of Nuvia CPU SW design for Windows, Power, Limits and Performance
  • Virtual platform model design and development (QEMU, TLM and System C)
  • Participated in 4G LTE and 5G(Sub6 and mmW) design discussions.
  • Extensive knowledge on Qualcomm Modem hardware and microkernel architecture. Also knowledgeable about the RFIC, RFFE design and participated in design discussions for different RF card variants.
  • Machine learning lead and responsible for developing tools based on ML techniques for auto crash triaging with smarts involving Modem F3s, call stacks, Scenario specific (IRAT, reslections, MSIM) and RAT specific flows.
  • WCDMA L2 team lead and responsible for the development of Enhanced L2 stack for the HSPA+ and DC HSPA+.
  • UMS NAS protocol development experience and responsible for Session Manager (SM)/Radio Access Bearer Manager (RABM)/GPRS Mobility manager (GMM)/MM, BMC protocol development.
  • Data path architect for DC HSDPA and responsible for bringing up world's first 42Mbps call.
  • UMB RLP/RLL layer design and development.

Seasoned Engineering Manager adept at seamlessly integrating project technical aspects and making information relatable to non-technical personnel. Experienced leader and program manager with 22-year history in field. Clear communicator, decision maker and problem solver. Hardworking and passionate job seeker with strong organizational skills eager to secure entry-level Senior Director position. Ready to help team achieve company goals. Detail-oriented team player with strong organizational skills. Ability to handle multiple projects simultaneously with a high degree of accuracy.

Overview

23
23
years of professional experience

Work History

Senior Director of Engineering

Qualcomm Incorporation
03.2004 - Current
  • Software Project lead and embedded systems design and development of wireless technologies, Virtual platforms
  • Established strong relationships with key stakeholders, including vendors, partners, customers, and executive leadership teams.
  • Increased overall team productivity by promoting a culture of collaboration, innovation, and continuous improvement.
  • Spearheaded successful implementation of cross-departmental initiatives that resulted in improved communication, collaboration, and overall efficiency among engineering teams.
  • Designed detailed budget for engineering equipment and projects.
  • Used strong analytical and problem-solving skills to develop effective solutions for challenging situations.
  • Applied effective time management techniques to meet tight deadlines.
  • Drove process improvements across all stages of product development lifecycle – from concept to delivery – resulting in increased customer satisfaction rates.

Chipset Software Project Engineer

Qualcomm Incorporation
03.2004 - Current
  • Compute, XR chipsets, Virtual platform lead for Qualcomm SOCs, Modem SW lead, Chipset stability lead, Multiprocessor architect and 3G/4G protocol development
  • Provided technical expertise throughout all phases of the project, ensuring accurate execution of designs and specifications.
  • Collaborated with other departments to facilitate successful project completion.
  • Assisted with cost proposal development and customer presentations.
  • Collaborated on interdisciplinary projects, showcasing adaptability and versatility as a Project Engineer.
  • Developed high-quality engineering designs and plans to meet industry standards.
  • Determined and scheduled priorities as required to progress engineering work.
  • Coordinated cross-functional teams, fostering collaboration to achieve project goals.
  • Worked effectively in fast-paced environments.
  • Delivered regular compliance reports to drive process improvement and corrective measures.

2G/3G Wireless Protocol Development

Sasken communications (client: Kyocera/Panasonic wireless)
04.2003 - 02.2004
  • Design dynamic memory allocation system for Kyocera UI

2G/3G Wireless Protocol Development

Hellosoft solutions pvt Ltd
02.2001 - 03.2003
  • Design and development of VOIP(SIP) protocol

Education

Master of Science - Computer Engineering

Indian Institute Of Technology
Kharagpur, India
02.2001

BTech in Electronics and Communication Engineering - Electronics And Communications Engineering

Nagarjuna University
India
04.1999

Skills

  • Creating Virtual platforms for SOCs from scratch (Bit accurate and cycle accurate) Also experience in tradeoffs with Performance with bit accuracy and Cycle accuracy when modeling
  • Seasoned in bringing on several AI frameworks (Qualcomm NN SDK), Multimedia (ViDC, , Camera, Video analytics engine) on Virtual platforms using several OS platforms Also seasoned in creating VirtIO interfaces for the open CL, open GL, Vulkan and Peripherals(PCIE, UART, USB, Canbus, Ethernet etc)
  • Experienced in AWS cloud onboarding of Virtual platforms using dockerizations as well as creating CI/CD for the Virtual platforms for full automation
  • Extensive knowledge on Chipset architecture including the CPUSS, Multimedia, Modem baseband and RF
  • Expertise in Multiprocessor architecture and contributed to chipset architecture designs
  • Expertise in SOC pre silicon and post silicon bring up and has contributed to many successful Qualcomm SOC bringups
  • Expertise in wireless protocols in all Modem technologies
  • Expertise in Microprocessor architecture as well as Qualcomm SOC architectures
  • Conversant with RTOS likes QURT, REX, L4, Vxworks
  • Possess excellent analytical and problem-solving skills
  • Knowledge in Wireless Technologies Viz, 5GNR, LTE, UMTS, LTE, GSM/GPRS
  • Team Player with ability to communicate effectively at all levels of development process

Technical Skills Summary

  • Programming/Tools
  • C, C++, SystemC, TLM, Linux Kernel, RTOS(QURT, VxWorks etc), GCC and LLVM compilers, git, Perl/Python, Machine Learning (Neural Networks), QLIKVIEW, Perforce, JIRA.
  • HW Platforms
  • ARM chipsets(Nuvia Oryon custom CPU, Kroyo 4/5/6, A53/57, Cortex M0/3 etc), Hexagon QDSP6, FPGA pre silicon Emulation, Tensilica, RISC-V etc
  • Debugging tools
  • Lauterbach Trace 32, GDB, LLDB
  • Version control
  • Github, Perforce, Rational clearcase
  • Phone configuration tools
  • QUTS, QPST, QXDM, QROCKET etc
  • Technology
  • 2G, 3G, 4G LTE, 5G

Awards

  • Awarded 5 patents for the inventions in Qualcomm Chipset architecture
  • Impact award for creating the Qualcomm virtual platform from scratch and all the way to commercialize
  • Achieved Upendra patel award for HSPA+ SW commercialization.
  • Achieved 5 Super Qualstar awards for outstanding contributions in commercialization of SDM845, SDM835 also creating the Chipset stability team and automating the Stability triaging.
  • Achieved 25+ “QUALSTAR” awards for outstanding contribution in NAS protocol development, UMB stack development and resolving customer issues.

Timeline

Senior Director of Engineering

Qualcomm Incorporation
03.2004 - Current

Chipset Software Project Engineer

Qualcomm Incorporation
03.2004 - Current

2G/3G Wireless Protocol Development

Sasken communications (client: Kyocera/Panasonic wireless)
04.2003 - 02.2004

2G/3G Wireless Protocol Development

Hellosoft solutions pvt Ltd
02.2001 - 03.2003

Master of Science - Computer Engineering

Indian Institute Of Technology

BTech in Electronics and Communication Engineering - Electronics And Communications Engineering

Nagarjuna University
Vijay Kumar Kadagala