Vito Adragna

• Designed and optimized PCB layouts for aerospace applications using Altium Designer.
• Collaborated with cross-functional teams to ensure design compliance with specifications and standards.
• Conducted thorough design reviews, identifying potential issues and recommending corrective actions.
• Developed and maintained comprehensive documentation for PCB designs, enhancing project traceability.

Please see above work history. This was my 2nd employment assignment with Teledyne. Received many Positive feedback compliments from Team members & from AcTalent agency for my design outputs and professionalism working with Teledyne.

Designed a 6 Layer dense/double sided Power Supply Board. Designed 2 very dense 8 Layer Ethernet Boards, consisting of matched length 50ohm, 75ohm, 90ohm and 100-ohm diff pairs mating to a very large/dense double sided 14 layer Processor Board. Designed 3 very dense 14 Layer NIC & AIC Boards, consisting of multiple BGA’s, Micros, 50, 75, 80, 90, and 100ohm matched length diff pairs mating to a 1800 part 14 Layer 2nd Processor Board, Ethernet Switching. Solid and split plane creation. Library part creation of footprints and logic symbols. All output files for fab house and assembly house. Attended many design review meetings. Designed 2 large Test boards using some of the above circuitry for proof of concept. Designed 3 smaller Test Boards for this project.