Will Kass
Austin
Summary
Accomplished high-tech professional with a proven track record of successfully delivering products in the computer and semiconductor industries. Over 10 years of board-level design experience and 15 years of applications engineering experience. Brings a wealth of expertise to any project. Thrives in both small and large company environments, demonstrating adaptability and excellence in diverse settings. Strong knowledge of high-speed digital design fundamentals, with extensive experience in designing for EMC, ESD, and signal integrity. Consistently delivers high-quality results. Extensive collaboration with Asian suppliers, ODMs, and product development teams has honed skills in cross-functional teamwork and global project management.
Overview
23
23
years of professional experience
Work History
Senior Field Applications Engineer
Foxconn Interconnect Technology
05.2019 - 03.2025
- Senior level field applications engineer responsible for driving pre- and post-design-in activities for a major Tier 1 Hyperscale, AI Server, and Client Computing customer, promoting FIT’s interconnect and cable products to secure design wins and grow sales
- Key engineering resource on sales team to lead technical aspects of the sales cycle
- Develop and maintain technical relationships with key engineers and system architects at Tier 1 customer
- Continually provide VOC feedback to my engineering teams to improve products and enhance the overall customer experience through design cycle
- Prepare new technical training material and product presentations to enhance demand creation activities
- Consistently meet and exceed strategic sales objectives
- Helped to grow annual sales revenue at Tier 1 from $80M to $180M during my tenure
- Strong understanding of core signal integrity fundamentals with high-speed interconnect and cable product designs
- Design-in and optimize solutions for the Open Compute Project (OCP) data center product designs including: MXIO, Near-Stack, Swift, EDSFF, M-CRPS, M-PIC
- Design-in sockets/retention mechanisms for Intel, AMD, and Nvidia CPUs and GPUs for major hyperscale and AI deployments
- Develop expertise in Orv3 (Open Rack v3) rack power delivery architectures specifically designed for large-scale cloud deployments, featuring the 48V busbar power distribution system
Senior Field Applications Engineer
Future Electronics
05.2014 - 05.2019
- Senior level field applications engineer acting as a technical leader for supplier products and determining solutions to support our customers’ requirements
- Taking a leadership role by assisting with development and delivery of technical training and marketing material to drive demand creation activities with all of our product lines
- This position has a significant amount of customer interfacing activity and requires excellent communication skills in addition to a strong design background
- Assists in the qualification of design opportunities as well as supporting the field in increasing design registrations and sales activity
- Develop relationships with key engineering personnel in order to support a strong partnership approach with customers and vendors
- Participate in supplier QBRs and provide key market data to facilitate design activity efforts
- Responsible for training our focus accounts and design community on new products
Senior Field Applications Engineer
Pericom Semiconductor
09.2010 - 04.2014
- Senior level field applications engineer responsible for proactively solving customer design challenges through creative application of Pericom Semiconductor technology solutions
- Assisted in managing a large sales region territory (15 million in revenue/year)
- This position has a significant amount of customer interfacing activity and requires excellent communication skills in addition to a strong design background
- Work closely with customers to understand their system application goals and use breadth of knowledge to propose Pericom Semiconductor solutions to fit their system needs and requirements
- These solutions included products for high speed digital applications and signal integrity including: PCIe, SAS/SATA, USB, LVDS, DP, DVI/HDMI
- Work with Marketing and Design engineering teams to define new products to meet customer needs
- Proliferate new technology solutions with the customer base and provide support throughout their design cycles
- Responsible for training the sales channels and design community on new products
Senior Hardware Development Engineer
Dell Inc.
01.2002 - 06.2010
- Senior level hardware design engineer responsible for board-level electronic design and qualification of mobile laptop computer systems for Dell’s Latitude business line (volume > 10K/month)
- Led all activities to take a design from concept to prototype hardware for system definition, simulation, and layout
- Completed circuit designs on mobile laptop platforms using Cadence OrCAD and Allegro design tools
- Specific experience in laptop design included: Intel X86 CPUs, chipsets, FET circuits, opamp/comparators, voltage references, temperature sensors, DC-DC and linear voltage regulators, diodes, EMC considerations and signal termination schemes
- Hardware design experience with the following complex high speed digital interfaces included: PCI-Express, SATA, USB 2.0/3.0, DP, HDMI, DVI, DDR2/3, GMII, Gigabit Ethernet
- Drove cross-functional reviews of team's designs prior to gerber
- Spearheaded bring up, electrical analysis, debug, and test plan development/execution
- Worked with ODMs in Taiwan in China to ensure designs were manufactured, assembled, and tested to Dell specifications
- Lead EE on 5 successful laptop product launches
Education
BSEE - Electrical and Computer Engineering
University of Texas
Austin, TexasSkills
- Electronic hardware design
- Skilled in OrCAD design tools
- Proficient in Allegro layout
- Proficient in SolidWorks CAD
- Experience with Verilog coding
- Proficient in oscilloscope usage
- Experienced with logic and serial analyzers
- Network protocol analysis
- Product evaluation and validation
- Skilled in utilizing CRM systems
- Experience with MS Project
Timeline
Senior Field Applications Engineer
Foxconn Interconnect Technology
05.2019 - 03.2025
Senior Field Applications Engineer
Future Electronics
05.2014 - 05.2019
Senior Field Applications Engineer
Pericom Semiconductor
09.2010 - 04.2014
Senior Hardware Development Engineer
Dell Inc.
01.2002 - 06.2010
BSEE - Electrical and Computer Engineering
University of Texas
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