Arnob Islam
Pearland,USA
Summary
Accomplished Process Integration Engineer with over a decade of specialized experience in semiconductor technology, focusing on advanced node development and innovative material applications. Led transformative initiatives at Intel that enhanced transistor performance, reduced production costs, and fostered a collaborative and forward-thinking culture. Dedicated to advancing semiconductor manufacturing processes through continuous learning, mentorship, and a drive for groundbreaking advancements.
Overview
12
12
years of professional experience
Work History
Process Integration Development Engineer
Intel Corporation
01.2019 - Current
- Refined fin geometry in Intel’s 3nm FINFET technology utilizing advanced dry etch processes, boosting transistor performance and achieving notable gains (~5%) in CPU clock frequency.
- Implemented advanced EUV lithography in conjunction with optimized OPC and DFM methodologies for fin patterning, enabling significant reduction in process complexity and layer count, thereby achieving cost-efficient manufacturing for Intel 4/3 nm technology nodes.
- Led efforts in front-end process segments (Fin, isolation, metal gate work-function engineering, contact) driving yield and performance improvements in advanced FINFET and GAA technology nodes through targeted pathfinding and PPA optimization.
- Coordinated cross-functional teams to ensure processes met PDK requirements, facilitating seamless integration, DOE, data analysis and timely project milestones.
- Enhanced process validation methodologies, accelerating technology ramp-up and maintaining high-quality standards (i.e., SPC, control, root cause/failure analysis to debug yield issues) across all projects.
- Cultivated a mentoring environment for junior engineers, promoting continuous learning and enabling team capabilities in process integration.
Graduate Research Assistant
Case Western Reserve University
01.2014 - 01.2019
- Conducted detailed research on emerging technologies, significantly enhancing the university’s reputation through impactful publications and presentations.
- Engineered nanoscale resonators for advanced sensing applications, utilizing optical interferometry readout and electrostatic transduction, contributing to groundbreaking research and solidifying technical proficiency.
- Investigated properties of 2D materials, leading to the development of novel transistors and photodiodes that push the boundaries of current technology.
- Acquired hands-on expertise in optoelectronic device characterization, optical interferometry, spectroscopy measurements, ensuring precision in experimental results and contributing to ongoing research initiatives.
- Presented complex technical concepts at various conferences, successfully engaging diverse stakeholders and fostering academic collaborations.
- Supported undergraduate students in research tasks, fostering a collaborative learning environment.
- Collaborated with faculty members to develop research proposals and grant applications.
- Maintained laboratory equipment, ensuring functionality and adherence to safety protocols.
Education
Ph.D. -
Case Western Reserve University
Cleveland, Ohio12.2019
Bachelor of Science -
Bangladesh University of Engineering And Technology
Dhaka, Bangladesh12.2013
Skills
- Process Integration, Yield Optimization, Failure Analysis
- Semiconductor technology and device physics: FINFET, Gate-all-around (GAA) Transistor, emerging 2D transistors
- Semiconductor manufacturing processes, manufacturing automation system (MES)
- Statistical data analysis, JMP, SPC control, CpK/PpK analysis
- Device characterization, testing and low noise DC measurements
- MEMS/NEMS resonators, sensors, oscillators, RF measurements
- Optical interferometry, spectroscopy, optoelectronic/photonic device characterization, PIC
- Material characterization/analytical methods: SEM, TEM, AFM, SIMS
- Scripting/programming languages: MATLAB, Python, C/C
- Layout/ physical implementation, design rule, PDK analysis: Cadence Virtuoso, LTspice
- COMSOL: Electromechanical/thermal module
- Project management, Technical Writing
- Analytical Model Based Problem Solving
Awards
LTD Department Divisional Award (DDA), Intel Corporation, 2020, 2024 and 2025.
Links
- Google Scholar
Timeline
Process Integration Development Engineer
Intel Corporation
01.2019 - Current
Graduate Research Assistant
Case Western Reserve University
01.2014 - 01.2019
Ph.D. -
Case Western Reserve University
Bachelor of Science -
Bangladesh University of Engineering And Technology
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