Brandi Conyers

Trained and Certified to all Assembly operations and procedures.

• Developed bonding parameters tailored to different types of new technologies, such as devices, packages, capillaries, wire types, and stacked dies.
• Designed bond parameters and looping profile for Stand-off Stitch/BGA4 Loop, eliminating the need for manual dressing while bonding long wire packages. Proficiently bonded die with excessive silicon along the edges.
• Developed and implemented an optimized tape mounting process that effectively shields the Accretech Saw's chuck from potential water damage.
• Scheduled and organized assembly build requests, giving careful attention to detail and making priority decisions as needed.
• Effectively communicating with customers, CSR’s, engineers, management, and co-workers.
• Maintain an organized work area. I participated in 5S+ Set Phase for both Assembly and Probe Repair.
• Performed thorough review and revision of Assembly forms and documents based on Agile guidelines.
• Ship materials via GTS or shipping memo.
• Trained in wire pull and ball shear.
• Responsible for ordering and managing supplies for the Pocatello Test Development Line.
• Managed regular monitoring and reporting of environmental measurements for the Pocatello Test Development Line.

Trained and Certified to Test Floor operations and procedures.

• Trained to both wafer sort and final test operations.
• Use of Promis to track, evaluate, and disposition wafers and final test parts.
• Updated the Test floor Schedule, Completed Gentof Log and prioritized WTOF and PTOF submissions accordingly.
• Participated in 5S+ Set Phase for the Test Floor.
• Reviewed and revised Test Floor forms and documents.
• Revised forms and documents for Maintenance.
• Assisted maintenance with update of the Board Build Hardware Database. Including reorganization, relabeling, and cleaning of sockets and receptacles.
• Ship materials via GTS or shipping memo, per Engineering request.
• Actively participating in the Wafer Sort and Final Test FMEA.
• Improved safety with installation of GPIB cable storage.
• Weekday and weekend coverage during coworkers' absence.

Minimal Cross-Training in Probe Repair.

• Received small amount of training on Applied Precision PRVX2 System.
• Received training on replacing vertical card probe tips.

Fab Operator • Photo, Etch, Thin Films, Diffusion, Alpha and Bump

• Trained and certified to DI Inspection and Develop in Fab 9 Photo.
• Trained and certified to Oxide Etch and Poly Etch in Fab 9 Etch.
• Trained and certified to all Fab 9 Thin Films equipment and procedures.
• Trained and certified to all Fab 9 Diffusion equipment and procedures.
• Trained and certified to all Bump equipment and procedures. E.g. Photo Resist Spinner, Photo Stepper, Au Metal Sputter, Au Electroplater, Asher and etc.